Patents by Inventor Takashi Hirao

Takashi Hirao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220338370
    Abstract: No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module (1) is transferred to a bus bar module (3) via a DC terminal (1A) of the semiconductor module (1). As illustrated in FIG. 4(B), the heat transferred to the bus bar module 3 is then transferred to the pressing member 5 via the annular conductor 8 and the bolt 5A. Since the pressing member 5 is in close contact with the second cooler 2B, the heat transferred to the pressing member 5 is cooled by the second cooler 2B. On the other hand, the heat transferred to the convex portion 6A of the housing 6 is transferred to the first cooler 2A via the housing 6 and cooled. As a result, in the configuration in which a capacitor (4) is connected to the semiconductor module (1) via the bus bar module (3), the heat transferred from the semiconductor module (1) to the capacitor (4) can be suppressed.
    Type: Application
    Filed: July 31, 2020
    Publication date: October 20, 2022
    Applicant: HITACHI ASTEMO, LTD.
    Inventors: Takashi HIRAO, Takeshi TOKUYAMA, Noriyuki MAEKAWA, Akira MATSUSHITA, Toshiya SATOH
  • Patent number: 11469160
    Abstract: Detection accuracy of a collector sense in detecting a voltage is improved. A power module 300 has a first conductor 410 and a second conductor 411 to which a plurality of active elements 317 and 315 configuring upper and lower arm circuits are connected. In addition, the power module 300 has an AC side terminal 320B protruding from one side 301a, a positive electrode side terminal 315B and a negative electrode side terminal 319B which protrude from the other side 301b, an intermediate electrode portion 414 that connects the first conductor 410 and the second conductor 411 to each other, and a collector sense wiring 452a in which a collector electrode of an active element 157 and the first conductor 410 are connected to each other via a sense connection portion 415.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: October 11, 2022
    Assignee: HITACHI ASTEMO, LTD.
    Inventors: Nobutake Tsuyuno, Takashi Hirao, Akira Matsushita
  • Publication number: 20220221697
    Abstract: An ultraviolet optical system includes an objective lens group that captures ultraviolet light for each angle from an ultraviolet light source and forms an intermediate image, and an imaging lens group that re-images the intermediate image. Neither the objective lens group nor the imaging lens group has a cemented surface, and all lenses included in the objective lens group and in the imaging lens group are single lenses that transmit ultraviolet light having a wavelength of 300 mn or shorter. A light distribution measuring apparatus includes the ultraviolet optical system and a sensor, and outputs light distribution of the ultraviolet light source by using a signal obtained by the sensor. The ultraviolet optical system is positioned such that the intermediate image is re-imaged on a light receiving sensor surface, and the sensor has light receiving sensitivity to ultraviolet light having a wavelength of 300 nm or shorter.
    Type: Application
    Filed: February 3, 2020
    Publication date: July 14, 2022
    Inventors: Yusuke HIRAO, Takashi KAWASAKI
  • Patent number: 11383067
    Abstract: A medical elongated body is disclosed that suppresses elongation in an axial direction while maintaining high flexibility and has high torque transmission capability even in a bent state. The medical elongated body includes a tube shaped body. The tube shaped body has a slit extending in a spiral shape while meandering, the slit is formed from a pair of a first opposing surface and a second opposing surface, the first opposing surface forms a first convex portion, the first convex portion has a first wide portion having a width wider in a circumferential direction Y, the second opposing surface forms a first concave portion which surrounds and accommodates the first wide portion, the first convex portion has a first plane portion and a first side portion connected to both end portions, and in a circumferential developed view, the first side portion and the first plane portion have tangential discontinuity.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: July 12, 2022
    Assignee: TERUMO KABUSHIKI KAISHA
    Inventors: Yuichi Tada, Takashi Kitaoka, Mizuho Hirao
  • Publication number: 20220157788
    Abstract: A power semiconductor device includes a first submodule including a first power semiconductor element, a second submodule including a second power semiconductor element, a positive electrode side conductor portion and a negative electrode side conductor portion, an intermediate substrate that forms a negative electrode side facing portion facing the negative electrode side conductor portion with the first submodule sandwiched between them and a positive electrode side facing portion facing the positive electrode side conductor portion with the second submodule sandwiched between them, and a plurality of signal terminals that transmit a signal for controlling the first power semiconductor element or the second power semiconductor element.
    Type: Application
    Filed: January 30, 2020
    Publication date: May 19, 2022
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Hironori NAGASAKI, Toru KATO, Takashi HIRAO, Shintaro TANAKA
  • Patent number: 11232994
    Abstract: A power semiconductor device includes a circuit body, first and second insulations, first and second bases, a case, and a distance regulation portion. The circuit body incudes a semiconductor element and a conductive portion. The first insulation and the second insulation oppose each other. The first base and second base also oppose each other. The case has a first opening portion covered with the first base and a second opening portion covered with the second base. The distance regulation portion has a first end that contacts the first base and a second end, that is opposite to the first end, and that contacts the second base. The distance regulation portion regulates a distance between the first base and the second base.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: January 25, 2022
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Nobutake Tsuyuno, Hiromi Shimazu, Akihiro Namba, Akira Matsushita, Hiroshi Houzouji, Atsuo Nishihara, Toshiaki Ishii, Takashi Hirao
  • Patent number: 11233011
    Abstract: An object of the present invention is to improve assemblability of a power semiconductor device. A power semiconductor device includes a plurality of submodules that includes a semiconductor element interposed between a source conductor and a drain conductor, a sense wiring that transmits a sense signal of the semiconductor element, and an insulating portion at which the sense wiring and the sense conductor are arranged, and a source outer conductor that is formed to surround the source conductor and is joined to the source conductor in each of the plurality of submodules. Each source conductor included in the plurality of submodules includes protrusion portions that are formed toward the sensor wiring from the source conductor, are connected to the sense wiring, and define a distance between the sense wiring and the source outer conductor.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: January 25, 2022
    Assignee: HITACHI ASTEMO, LTD.
    Inventors: Takashi Hirao, Haruka Shimizu
  • Patent number: 11127695
    Abstract: A power conversion device includes first and second power semiconductor elements, and a circuit for transferring a drive signal of the first and second power semiconductor elements. The circuit board includes a first emitter wire which is formed along an arranging direction of the first power semiconductor element and the second power semiconductor element, a first gate wire which is disposed between the first power semiconductor element and the first emitter wire, a second gate wire which is disposed between the second power semiconductor element and the emitter wire, a third gate wire which is disposed to face the first gate wire and the second gate wire with the emitter wire interposed between the third gate wire and the first gate wire and the second gate wire, and a first gate resistor which connects the first gate wire and the third gate wire over the first emitter wire.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: September 21, 2021
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Akihiro Namba, Takashi Hirao, Masami Oonishi
  • Publication number: 20210280483
    Abstract: A power semiconductor apparatus includes a power semiconductor element having low and high potential side electrodes and a sense electrode, high and low potential side conductors electrically connected with the high potential side electrodes, respectively, a sense wiring electrically connected with the sense electrode, and a first metal portion facing the low potential side conductor or the low potential side conductor across the sense wiring. When viewed from an array direction of the sense wiring and the first metal portion, the sense wiring has a facing portion facing the high or low potential side conductor, the first metal portion forms a recess in a part overlapping the facing portion, and a depth of the recess is formed such that a distance between a bottom of the recess and the sense wiring is larger than a distance between the sense wiring and the high or low potential side conductor.
    Type: Application
    Filed: July 11, 2019
    Publication date: September 9, 2021
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Hironori NAGASAKI, Shintaro TANAKA, Takashi HIRAO
  • Publication number: 20210272882
    Abstract: Detection accuracy of a collector sense in detecting a voltage is improved. A power module 300 has a first conductor 410 and a second conductor 411 to which a plurality of active elements 317 and 315 configuring upper and lower arm circuits are connected. In addition, the power module 300 has an AC side terminal 320B protruding from one side 301a, a positive electrode side terminal 315B and a negative electrode side terminal 319B which protrude from the other side 301b, an intermediate electrode portion 414 that connects the first conductor 410 and the second conductor 411 to each other, and a collector sense wiring 452a in which a collector electrode of an active element 157 and the first conductor 410 are connected to each other via a sense connection portion 415.
    Type: Application
    Filed: June 19, 2019
    Publication date: September 2, 2021
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Nobutake TSUYUNO, Takashi HIRAO, Akira MATSUSHITA
  • Patent number: 11056415
    Abstract: To improve yield and reliability at the time when a plurality of semiconductor elements used for a semiconductor device is arranged in parallel.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: July 6, 2021
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masami Oonishi, Takashi Hirao
  • Publication number: 20210074647
    Abstract: An object of the present invention is to improve assemblability of a power semiconductor device. A power semiconductor device includes a plurality of submodules that includes a semiconductor element interposed between a source conductor and a drain conductor, a sense wiring that transmits a sense signal of the semiconductor element, and an insulating portion at which the sense wiring and the sense conductor are arranged, and a source outer conductor that is formed to surround the source conductor and is joined to the source conductor in each of the plurality of submodules. Each source conductor included in the plurality of submodules includes protrusion portions that are formed toward the sensor wiring from the source conductor, are connected to the sense wiring, and define a distance between the sense wiring and the source outer conductor.
    Type: Application
    Filed: February 7, 2019
    Publication date: March 11, 2021
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Takashi HIRAO, Haruka SHIMIZU
  • Patent number: 10928428
    Abstract: The present invention aims to reduce the leakage current that flows when measuring a high voltage and includes: a voltage detector that detects a voltage and outputs a detection voltage; a current supplier that supplies a measurement current across a pair of input terminals via a protective resistor; and a processor that executes a voltage measurement process, which measures the voltage based on data indicating the detection voltage, and a resistance measurement process, which measures a resistance connected between the input terminals based on the voltage and the current. A first switch is connected in parallel to the protective resistor and the processor executes the voltage measurement process in a state where the first switch has been set open to measure the terminal voltage, and executes the resistance measurement process by setting the first switch shorted when the voltage is equal to or below the reference voltage value.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: February 23, 2021
    Assignee: HIOKI DENKI KABUSHIKI KAISHA
    Inventors: Tetsuya Nakamura, Takashi Hirao, Yuta Akamatsu, Yuta Suzuki
  • Patent number: 10884030
    Abstract: In an object of the present invention, an object is to provide a technique for achieving higher accuracy in current detection of a radio frequency current, in a current detection device. The current detection device of the present invention includes two or more conductors through which a current shunted from a same conductor flows; conductors through which the shunted current flows have portions opposed to each other; currents flow in opposite directions in opposing portions of the conductors; and a magnetic field detecting element is provided between the opposing portions of the conductors.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: January 5, 2021
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Takashi Hirao, Akihiro Namba
  • Publication number: 20200258853
    Abstract: A power conversion device includes first and second power semiconductor elements, and a circuit for transferring a drive signal of the first and second power semiconductor elements. The circuit board includes a first emitter wire which is formed along an arranging direction of the first power semiconductor element and the second power semiconductor element, a first gate wire which is disposed between the first power semiconductor element and the first emitter wire, a second gate wire which is disposed between the second power semiconductor element and the emitter wire, a third gate wire which is disposed to face the first gate wire and the second gate wire with the emitter wire interposed between the third gate wire and the first gate wire and the second gate wire, and a first gate resistor which connects the first gate wire and the third gate wire over the first emitter wire.
    Type: Application
    Filed: July 27, 2018
    Publication date: August 13, 2020
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Akihiro NAMBA, Takashi HIRAO, Masami OONISHI
  • Publication number: 20200227333
    Abstract: An object of the present invention is to provide a power semiconductor device enabling maintenance in reliability and improvement in productivity. According to the present invention, provided are: a circuit body including a semiconductor element and a conductive portion; a first insulation and a second insulation opposed to each other, the circuit body being interposed between the first insulation and the second insulation; a first base and a second base opposed to each other, the circuit body, the first insulation, and the second insulation being interposed between the first base and the second base; a case having a first opening portion covered with the first base and a second opening portion covered with the second base; and a distance regulation portion provided in space between the first base and the second base, the distance regulation portion regulating a distance between the first base and the second base in contact with the first base and the second base.
    Type: Application
    Filed: May 22, 2018
    Publication date: July 16, 2020
    Inventors: Nobutake TSUYUNO, Hiromi SHIMAZU, Akihiro NAMBA, Akira MATSUSHITA, Hiroshi HOUZOUJI, Atsuo NISHIHARA, Toshiaki ISHII, Takashi HIRAO
  • Publication number: 20190271724
    Abstract: In an object of the present invention, an object is to provide a technique for achieving higher accuracy in current detection of a radio frequency current, in a current detection device. The current detection device of the present invention includes two or more conductors through which a current shunted from a same conductor flows; conductors through which the shunted current flows have portions opposed to each other; currents flow in opposite directions in opposing portions of the conductors; and a magnetic field detecting element is provided between the opposing portions of the conductors.
    Type: Application
    Filed: December 4, 2017
    Publication date: September 5, 2019
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Takashi HIRAO, Akihiro NAMBA
  • Publication number: 20190229032
    Abstract: To improve yield and reliability at the time when a plurality of semiconductor elements used for a semiconductor device is arranged in parallel.
    Type: Application
    Filed: July 19, 2017
    Publication date: July 25, 2019
    Inventors: Masami OONISHI, Takashi HIRAO
  • Publication number: 20190146018
    Abstract: The present invention aims to reduce the leakage current that flows when measuring a high voltage and includes: a voltage detector that detects a voltage and outputs a detection voltage; a current supplier that supplies a measurement current across a pair of input terminals via a protective resistor; and a processor that executes a voltage measurement process, which measures the voltage based on data indicating the detection voltage, and a resistance measurement process, which measures a resistance connected between the input terminals based on the voltage and the current. A first switch is connected in parallel to the protective resistor and the processor executes the voltage measurement process in a state where the first switch has been set open to measure the terminal voltage, and executes the resistance measurement process by setting the first switch shorted when the voltage is equal to or below the reference voltage value.
    Type: Application
    Filed: January 11, 2019
    Publication date: May 16, 2019
    Applicant: HIOKI DENKI KABUSHIKI KAISHA
    Inventors: Tetsuya NAKAMURA, Takashi HIRAO, Yuta AKAMATSU, Yuta SUZUKI
  • Patent number: 10109549
    Abstract: In order to improve productivity of a semiconductor device, while improving stability of the blocking voltage of the semiconductor device, this semiconductor device is characterized by having a semiconductor element, and a laminated structure having three resin layers, said laminated structure being in a peripheral section surrounding a main electrode on one surface of the semiconductor element. The semiconductor device is also characterized in that the laminated structure has, on the center section side of the semiconductor element, a region where a lower resin layer is in contact with an intermediate resin layer, and a region where the lower resin layer is in contact with an upper resin layer.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: October 23, 2018
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Hirao, Kan Yasui, Kazuhiro Suzuki