Abstract: An inertial force sensor includes a weight, a first fixing portion linked to the weight, a second fixing portion linked to the weight via the first fixing portion, a first electrode on a first surface of the weight, a second electrode facing the first electrode, and first and second elastic portions elastically deforming so as to displace the weight. The first elastic portion displaces the weight along an X-axis but not along any of a Y-axis and a Z-axis. The second elastic portion displaces the first fixing portion along the Y-axis but not along any of the X-axis and the Z-axis. This inertial force sensor detects an acceleration at high sensitivity.

Abstract: A connecting structure includes a circuit board with a first connection land having a plurality of conductor patterns on the surface thereof, a second connection land disposed in a position opposite to the first connection land of the circuit board, and a flexible board including an insulating layer formed so as to surround at least a part of outer periphery of the second connection land. The first connection land and the second connection land are bonded to each other with a bonding member, and the insulating layer is thicker than the total thickness of the second connection land and the first connection land. It is possible to obtain an electronic circuit connecting structure which is free from short-circuit due to running of the bonding member such as solder even with the connecting land greatly reduced in size, and its connecting method.

Abstract: A connecting structure comprises a circuit board with a first connection land having a plurality of conductor patterns on the surface thereof, a second connection land disposed in a position opposite to the first connection land of the circuit board, and a flexible board including an insulating layer formed so as to surround at least a part of outer periphery of the second connection land, wherein the first connection land and the second connection land are bonded to each other with a bonding member, and the insulating layer is thicker than the total thickness of the second connection land and the first connection land. It is possible to obtain an electronic circuit connecting structure which is free from short-circuit due to running of the bonding member such as solder even with the connecting land greatly reduced in size, and its connecting method.

Abstract: A capacitor (1) using a flexible substrate (2) includes a hole portion (6a) formed in a dielectric (6) to connect an upper electrode (7) to an external leader electrode (4). At least part of the hole portion (6a) extends from its lower end to upper end at an inclination between 0.1 and 20° with respect to a top surface of the external leader electrode (4). Then, an upper end corner of an inclined wall surface of the upper electrode (7), which inclines along the hole portion (6a) of the dielectric (6), has a downward inclination between 0.1 and 20°. A lower end corner of the inclined wall surface of the upper electrode (7), which inclines along the hole portion of the dielectric (6), has an upward inclination between 0.1 and 20°. As a result, stress concentration on the corners of the upper electrode (7) is drastically reduced to prevent the upper electrode (7) from cracking.

Abstract: A capacitor (1) using a flexible substrate (2) includes a hole portion (6a) formed in a dielectric (6) to connect an upper electrode (7) to an external leader electrode (4). At least part of the hole portion (6a) extends from its lower end to upper end at an inclination between 0.1 and 20° with respect to a top surface of the external leader electrode (4). Then, an upper end corner of an inclined wall surface of the upper electrode (7), which inclines along the hole portion (6a) of the dielectric (6), has a downward inclination between 0.1 and 20°. A lower end corner of the inclined wall surface of the upper electrode (7), which inclines along the hole portion of the dielectric (6), has an upward inclination between 0.1 and 20°. As a result, stress concentration on the corners of the upper electrode (7) is drastically reduced to prevent the upper electrode (7) from cracking.