Patents by Inventor Takashi Kawabata
Takashi Kawabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210015959Abstract: Provided are an ultraviolet irradiation device, an ultraviolet irradiation method, an illumination device, and an ultraviolet irradiation system capable of efficiently and safely disinfecting an area to be disinfected and capable of preventing reduction in the operating rate of (equipment, etc., in) the area to be disinfected by maintaining the disinfected state. The ultraviolet irradiation device includes an ultraviolet irradiation unit capable of outputting ultraviolet having a predetermined dominant wavelength, and a drive control unit. The drive control unit performs time control of ultraviolet irradiation and non-irradiation by the ultraviolet irradiation unit on the basis of time necessary to disinfect the area S to be disinfected before or during operation and bacterial growth time after the disinfection.Type: ApplicationFiled: March 29, 2018Publication date: January 21, 2021Inventors: Narihide GOSEKI, Hirokazu UMEKAGE, Atsushi NAGAO, Takashi KAWABATA
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Patent number: 10847702Abstract: A semiconductor module includes: a semiconductor element; a wiring substrate on which the semiconductor element is mounted; a heat dissipation substrate; a first metal material that bonds the wiring substrate and the heat dissipation substrate; and a second metal material that bonds the wiring substrate and the heat dissipation substrate and has a different melting point from the first metal material. Each of the following is at least partially bonded: the first metal material and the wiring substrate, the first metal material and the heat dissipation substrate, the second metal material and the wiring substrate, the second metal material and the heat dissipation substrate, and the first metal material and the second metal material. Each of the following is bonded by alloying: the first metal material and the wiring substrate, the first metal material and the heat dissipation substrate, and the first metal material and the second metal material.Type: GrantFiled: February 26, 2019Date of Patent: November 24, 2020Assignee: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.Inventors: Takeshi Kawabata, Kiyomi Hagihara, Takashi Yui, Naofumi Koga
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Publication number: 20200352061Abstract: A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.Type: ApplicationFiled: July 17, 2020Publication date: November 5, 2020Applicant: TDK CORPORATIONInventors: Takashi YAMADA, Miyuki YANAGIDA, Atsushi SATO, Kenichi KAWABATA
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Publication number: 20200280525Abstract: An allocation method executed by a computer includes dividing each of a plurality of pieces of time-series data into a plurality of segments, allocating a label to each of the pieces of time-series data based on features of each segment in the pieces of time-series data, and allocating a predetermined segment in time-series data, included in the pieces of time-series data, with a label allocated to the time-series data to which the predetermined segment belongs.Type: ApplicationFiled: February 26, 2020Publication date: September 3, 2020Inventors: Yasushi SAKURAI, Yasuko MATSUBARA, Yasuaki IRIFUNE, Saeru YAMAMURO, Kouki KAWABATA, Akira URA, TAKASHI KATOH, YUHEI UMEDA
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Publication number: 20200107479Abstract: A metal magnetic film includes a permalloy and a carbon atom, wherein a content of the carbon atom is 0.3 to 3.0 at % based on a total amount of the carbon atom and metal elements.Type: ApplicationFiled: September 27, 2018Publication date: April 2, 2020Applicant: TDK CORPORATIONInventors: Takashi YAMADA, Miyuki YANAGIDA, Atsushi SATO, Kenichi KAWABATA
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Patent number: 10583217Abstract: There is provided an implant that is safe for the living body. An angular plate as the implant includes a bone supporting plate part and a blade part. The blade part is integrally formed with the bone supporting plate part, and extends from one end of the bone supporting plate part at a predetermined angle ? (0°<?<180°) relative to the bone supporting plate part. The angular plate is formed from a titanium-tantalum-based alloy containing tin. The angular plate is preferably formed from a titanium-tantalum-based alloy containing tin in which a Young's modulus is decreased by increasing the reduction ratio thereof.Type: GrantFiled: September 29, 2017Date of Patent: March 10, 2020Assignee: NIPPON PISTON RING CO., LTD.Inventors: Yoshiki Ishikawa, Yuki Kimura, Takasumi Kubo, Hiroshi Matsushima, Takashi Kawabata, Toshio Nagase
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Publication number: 20200065581Abstract: The image processing method includes a luminance value information obtaining step of obtaining effective radiance values from a subject, and an image generating step of generating a picture image as a set of unit regions each of which has a luminance value obtained by at least partially removing a regular reflection light component on a surface of the subject from the effective radiance values.Type: ApplicationFiled: October 30, 2019Publication date: February 27, 2020Inventors: Suguru KAWABATA, Takashi NAKANO, Kazuhiro NATSUAKI, Takahiro TAKIMOTO, Shinobu YAMAZAKI, Daisuke HONDA, Yukio TAMAI
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Patent number: 10554832Abstract: There is provided a roller including: a shaft, and an elastic body portion that is provided on an outer peripheral surface of the shaft, in which the elastic body portion includes a plurality of first recessed portions which are provided on one side of the roller in a shaft mounting direction at intervals in a circumferential direction of the roller and each have a bottom portion, and a plurality of second recessed portions which are provided on the other side of the roller in the shaft mounting direction at intervals in the circumferential direction of the roller and each have a bottom portion, and in which each of the first recessed portions is positioned between the adjacent second recessed portions in the circumferential direction of the roller in the side view of the roller in the shaft mounting direction.Type: GrantFiled: April 12, 2018Date of Patent: February 4, 2020Assignee: Seiko Epson CorporationInventors: Hidenobu Maruyama, Kenta Anegawa, Hidehito Okuhara, Takashi Kawabata, Naohiro Daito
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Patent number: 10521660Abstract: The image processing method includes a luminance value information obtaining step of obtaining effective radiance values from a subject, and an image generating step of generating a picture image as a set of unit regions each of which has a luminance value obtained by at least partially removing a regular reflection light component on a surface of the subject from the effective radiance values.Type: GrantFiled: April 24, 2017Date of Patent: December 31, 2019Assignee: SHARP KABUSHIKI KAISHAInventors: Suguru Kawabata, Takashi Nakano, Kazuhiro Natsuaki, Takahiro Takimoto, Shinobu Yamazaki, Daisuke Honda, Yukio Tamai
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Publication number: 20190358021Abstract: A medical member of the present invention includes a knitted body knitted with a linear member formed in a linear shape, at least a part of the knitted body is constituted of an alloy containing titanium, tantalum, and tin, and the alloy is constituted of 15 at % to 27 at % of tantalum and 1 at % to 8 at % of tin, where the total is 100 at %, with remainder being titanium and unavoidable impurities. The knitted body is formed in a sheet shape by plain weaving, twilled weaving, plain dutch weaving, twilled dutch weaving, or stockinette stitch. Thus, there can be provided a medical member capable of dispersing a load applied to a treating site of a soft tissue.Type: ApplicationFiled: January 18, 2018Publication date: November 28, 2019Applicants: NIPPON PISTON RING CO., LTD., NIPPON PISTON RING CO., LTD.Inventors: Takasumi KUBO, Yoshiki ISHIKAWA, Hiroshi MATSUSHIMA, Yuki KIMURA, Masahiro SHINZAWA, Takashi KAWABATA, Toshio NAGASE
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Patent number: 10481313Abstract: An image capturing apparatus that includes a polarizing filter of a slit type in which polarization characteristics are improved is realized. A polarizing unit (10) of an image capturing apparatus (100) includes a first polarizer layer (120a) and a second polarizer layer (120b) that hold a dielectric layer (14) therebetween, and a plurality of slits (13) that are arranged at regular intervals in a predetermined direction are formed in each of the first polarizer layer (120a) and the second polarizer layer (120b). A forming material of each of the first polarizer layer (120a) and the second polarizer layer (120b) and a forming material of a wiring layer that controls an operation of a light receiving unit (11) are selected from Al, Si, Cu, Au, Ag, Pt, W, Ti, Sn, In, Ga, Zn, and a compound or alloy that contains at least one of the foregoing.Type: GrantFiled: March 8, 2017Date of Patent: November 19, 2019Assignee: SHARP KABUSHIKI KAISHAInventors: Daisuke Honda, Takashi Nakano, Suguru Kawabata, Takahiro Takimoto, Kazuhiro Natsuaki, Masayo Uchida, Masaaki Uchihashi
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Patent number: 10448546Abstract: Disclosed is a noise suppression sheet 1 including a resin layer 2, a non-magnetic metal layer 3, and a metal magnetic layer 4 in this order.Type: GrantFiled: September 27, 2018Date of Patent: October 15, 2019Assignee: TDK CORPORATIONInventors: Takashi Yamada, Miyuki Yanagida, Atsushi Sato, Kenichi Kawabata
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Patent number: 10404875Abstract: A roller includes a shaft, and an elastic body portion that is provided on an outer peripheral surface of the shaft, in which the elastic body portion includes an inner peripheral portion which becomes a shaft side, an outer peripheral portion which becomes an outer side with respect to the inner peripheral portion, a plurality of first connection portions which connect the inner peripheral portion and the outer peripheral portion, and a plurality of second connection portions which are provided in a space portion between the adjacent first connection portions and which partition the space portion into one side and the other side of the roller in the axial direction, and in which the first connection portion is inclined in the same direction in a peripheral direction with respect to a radial direction of the roller.Type: GrantFiled: April 12, 2018Date of Patent: September 3, 2019Assignee: Seiko Epson CorporationInventors: Hidenobu Maruyama, Kenta Anegawa, Hidehito Okuhara, Naohiro Daito, Takashi Kawabata
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Publication number: 20190242659Abstract: A heat exchanger includes: a heat-exchanger core which includes flat fins each having a plurality of cuts arranged on one side of each flat fin and allowing heat transfer tubes to be inserted into the cuts, and which has a recess on the other side of the flat fins; and a heat-exchanger core having protrusions which fits in the recesses. The heat-exchanger core also includes flat fins each of which has a plurality of cuts allowing heat transfer tubes to be inserted into the cuts, and also each of which has protrusions on a side of the fin; and a heat-exchanger core having recesses which allow the protrusions to fit in the recesses.Type: ApplicationFiled: October 7, 2016Publication date: August 8, 2019Inventors: Ryoichi IKEDA, Teruaki KONAGAYOSHI, Ryohei KAWABATA, Takashi KATO
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Publication number: 20190241771Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.Type: ApplicationFiled: September 26, 2017Publication date: August 8, 2019Inventors: Takashi TATSUZAWA, Kazuya MATSUDA, Yutaka TSUCHIDA, Takashi SEKI, Mitsuyoshi SHIMAMURA, Kengo SHINOHARA, Tetsuyuki SHIRAKAWA, Yasunori KAWABATA, Satoru MATSUMOTO
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Publication number: 20190216429Abstract: An ultrasound diagnostic apparatus includes an ultrasound probe including a plurality of transducers arranged in a plurality columns and a switching element which switches input of a driving signal to the transducers and output of a receiving signal, a transmitter which outputs the driving signal to the transducers, a receiver which acquires the receiving signal corresponding to the transducers, and a hardware processor which generates ultrasound image data corresponding to each of the columns from the receiving signal, makes partial images in the ultrasound image data respectively have representations, synthesizes the ultrasound image data respectively including the partial images to generate composite image data, generates first identification information indicating to which position in a depth direction of the composite image data each of the representations of the partial images in the composite image data corresponds, and displays the generated first identification information and composite image data onType: ApplicationFiled: January 15, 2019Publication date: July 18, 2019Inventors: Takashi SAKAI, Takashi KIMOTO, Akihiro KAWABATA
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Publication number: 20190189881Abstract: A semiconductor module includes: a semiconductor element; a wiring substrate on which the semiconductor element is mounted; a heat dissipation substrate; a first metal material that bonds the wiring substrate and the heat dissipation substrate; and a second metal material that bonds the wiring substrate and the heat dissipation substrate and has a different melting point from the first metal material. Each of the following is at least partially bonded: the first metal material and the wiring substrate, the first metal material and the heat dissipation substrate, the second metal material and the wiring substrate, the second metal material and the heat dissipation substrate, and the first metal material and the second metal material. Each of the following is bonded by alloying: the first metal material and the wiring substrate, the first metal material and the heat dissipation substrate, and the first metal material and the second metal material.Type: ApplicationFiled: February 26, 2019Publication date: June 20, 2019Inventors: Takeshi KAWABATA, Kiyomi HAGIHARA, Takashi YUI, Naofumi KOGA
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Publication number: 20190162890Abstract: An image capturing apparatus that includes a polarizing filter of a slit type in which polarization characteristics are improved is realized. A polarizing unit (10) of an image capturing apparatus (100) includes a first polarizer layer (120a) and a second polarizer layer (120b) that hold a dielectric layer (14) therebetween, and a plurality of slits (13) that are arranged at regular intervals in a predetermined direction are formed in each of the first polarizer layer (120a) and the second polarizer layer (120b). A forming material of each of the first polarizer layer (120a) and the second polarizer layer (120b) and a forming material of a wiring layer that controls an operation of a light receiving unit (11) are selected from Al, Si, Cu, Au, Ag, Pt, W, Ti, Sn, In, Ga, Zn, and a compound or alloy that contains at least one of the foregoing.Type: ApplicationFiled: March 8, 2017Publication date: May 30, 2019Inventors: DAISUKE HONDA, TAKASHI NAKANO, SUGURU KAWABATA, TAKAHIRO TAKIMOTO, KAZUHIRO NATSUAKI, MASAYO UCHIDA, MASAAKI UCHIHASHI
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Patent number: 10305008Abstract: A semiconductor module includes: one or more semiconductor elements; a wiring substrate having a first surface on which the one or more semiconductor elements are mounted, the wiring substrate being electrically connected to the one or more semiconductor elements; a heat sink on which the wiring substrate is mounted, the heat sink facing a second surface of the wiring substrate on a reverse side of the first surface; a binder which is formed in a die pad area on the heat sink so as to be present between the wiring substrate and the heat sink, and bonds the wiring substrate and the heat sink; and a support which is formed in a peripheral part of the die pad area on the heat sink, and fixes the wiring substrate to the heat sink by being in contact with a peripheral part of the second surface of the wiring substrate.Type: GrantFiled: October 18, 2017Date of Patent: May 28, 2019Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takeshi Kawabata, Kiyomi Hagihara, Satoshi Kanai, Takashi Yui
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Patent number: D884899Type: GrantFiled: March 7, 2018Date of Patent: May 19, 2020Assignee: Hitachi, Ltd.Inventors: Ai Masuda, Jiwon Hong, Akira Kojima, Takashi Yamamoto, Kenichi Kawabata, Takahide Terada, Wenjing Wu, Yushi Tsubota