Patents by Inventor Takashi Kino

Takashi Kino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120000252
    Abstract: To provide a tubular knitted fabric and a knitting method thereof, which can be knitted without sewing by a flatbed knitting machine, and which is easily fitted to a three dimensional shape of a wearing region without detriment to appearance. As shown in (a), an outward side of thumb pouch 7 is knitted so as to continue in its wale direction to an end portion of a four finger body 6 and while repeats reciprocated knitting in its course direction. In the course direction, a row of stitches is formed in midway and hanging stitches 8, 9 are added on both sides respectively as stitches to be used for linking. In order to make the knitting needles that suspend the hanging stitches 8, 9 different from each other, the position of the row of stitches is shifted in a direction away from a knit end of the four finger body 6.
    Type: Application
    Filed: February 20, 2010
    Publication date: January 5, 2012
    Applicant: SHIMA SEIKI MFG., LTD.
    Inventors: Nobuo Funaki, Takahiro Yamashita, Isao Yumiba, Takashi Kino
  • Patent number: 7846546
    Abstract: Silicon carbide-based fine particles containing an electrically conducting inorganic substance and a electromagnetic wave absorbing material, which are fine particles comprising a particle inner portion of a silicon carbide-based material and a surface layer formed of an electrically conducting inorganic substance mainly comprising carbon, wherein a gradient layer with the compositional ratio of the electrically conducting inorganic substance gradiently increasing toward the particle surface is present and the thickness of the electrically conducting inorganic substance gradient layer is from 1 to 500 nm. The electromagnetic wave absorbing material of the present invention can selectively absorb a electromagnetic wave of 1 to 300 GHz in a wide band.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: December 7, 2010
    Assignee: Ube Industries, Ltd.
    Inventors: Koji Shibata, Takeshi Kita, Koji Shiba, Takashi Kino, Hideo Sano, Yoichi Okubo, Shigeru Yao
  • Publication number: 20090253834
    Abstract: This invention is directed to an adhesive composition having (1) a elastomer component, (2) a resole phenolic resin, and (3) a flame retardant resin that is not (2) a resole phenolic resin. Further, the adhesive compositions of the invention includes (1) a elastomer component and (2) a resole phenolic resin, wherein the (2) resole phenolic resin content is 20 to 50 wt % based on the total amount of the adhesive composition excluding any solvent.
    Type: Application
    Filed: November 11, 2008
    Publication date: October 8, 2009
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: TAKASHI KINO, Tsutomu Mutoh
  • Publication number: 20080292878
    Abstract: A laminated body obtained by forming a metal-deposited layer onto one or both adhesion-improved sides of a polyimide film with improved adhesion obtained by coating and spraying an organic polar solvent solution containing a polybenzimidazole onto one or both sides of a self-supporting film prepared by casting and drying a dope, which is an organic polar solvent solution of a polyimide precursor which may contain an imidization catalyst, onto a support and then heat treating the film to form a multilayer polyimide film of a base polyimide layer and one or two polybenzimidazole layers, by vapor deposition or sputtering, and then plating with metal to form a metal layer onto the metal-deposited layer.
    Type: Application
    Filed: June 30, 2008
    Publication date: November 27, 2008
    Applicant: Ube Industries, Ltd.,
    Inventors: Takashi Kino, Masafumi Kohda, Masato Murakami, Hiroaki Yamaguchi
  • Publication number: 20070062719
    Abstract: Silicon carbide-based fine particles containing an electrically conducting inorganic substance and a electromagnetic wave absorbing material, which are fine particles comprising a particle inner portion of a silicon carbide-based material and a surface layer formed of an electrically conducting inorganic substance mainly comprising carbon, wherein a gradient layer with the compositional ratio of the electrically conducting inorganic substance gradiently increasing toward the particle surface is present and the thickness of the electrically conducting inorganic substance gradient layer is from 1 to 500 nm. The electromagnetic wave absorbing material of the present invention can selectively absorb a electromagnetic wave of 1 to 300 GHz in a wide band.
    Type: Application
    Filed: September 20, 2006
    Publication date: March 22, 2007
    Applicant: Ube Industries, Ltd., a corporation of Japan
    Inventors: Koji Shibata, Takeshi Kita, Koji Shiba, Takashi Kino, Hideo Sano, Yoichi Okubo, Shigeru Yao
  • Publication number: 20060141273
    Abstract: A polyimide film with improved adhesion obtained by forming a thin polybenzimidazole layer on one or both sides of a polyimide film, a process for fabrication of a polyimide film with improved adhesion whereby an organic polar solvent solution containing a polybenzimidazole is coated or sprayed onto one or both sides of a self-supporting film prepared by casting and drying a dope, which is an organic polar solvent solution of a polyimide precursor which may contain an imidization catalyst, onto a support, and the film is then thoroughly heat treated, a cover lay film obtained by laminating a cover lay film adhesive onto the polyimide film with improved adhesion, and a laminated body employing the polyimide film with improved adhesion. The polyimide film exhibits the excellent characteristics of aromatic polyimide films including thermal properties, physical properties and electrical properties, while also having satisfactory adhesion.
    Type: Application
    Filed: August 31, 2005
    Publication date: June 29, 2006
    Applicant: Ube Industries, Ltd., a corporation of Japan
    Inventors: Takashi Kino, Masafumi Kohda, Masato Murakami, Hiroaki Yamaguchi
  • Patent number: D636446
    Type: Grant
    Filed: June 23, 2010
    Date of Patent: April 19, 2011
    Assignee: Royal Co., Ltd.
    Inventor: Takashi Kino
  • Patent number: D640758
    Type: Grant
    Filed: June 21, 2010
    Date of Patent: June 28, 2011
    Assignee: Royal Co., Ltd.
    Inventor: Takashi Kino