Patents by Inventor Takashi Kurahashi

Takashi Kurahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190362974
    Abstract: The semiconductor manufacturing device includes: a lower substrate support base configured to support a diamond substrate; an upper substrate support base configured to support a semiconductor substrate; a support base drive unit configured to move the lower substrate support base and the upper substrate support base to bring the diamond substrate and the semiconductor substrate into close contact with each other under a state in which a pressure is applied to the diamond substrate and the semiconductor substrate in a thickness direction; and a second mechanism configured to deform a surface of the upper substrate support base opposed to the lower substrate support base so that a surface of the semiconductor substrate opposed to the diamond substrate forms a parallel surface or a parallel plane with respect to a surface of the diamond substrate opposed to the semiconductor substrate.
    Type: Application
    Filed: February 1, 2018
    Publication date: November 28, 2019
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Keisuke NAKAMURA, Muneyoshi SUITA, Akifumi IMAI, Kenichiro KURAHASHI, Tomohiro SHINAGAWA, Takashi MATSUDA, Koji YOSHITSUGU, Eiji YAGYU, Kunihiko NISHIMURA
  • Patent number: 10347817
    Abstract: A lead-free piezoelectric ceramic composition including an alkali niobate/tantalate perovskite oxide main phase having piezoelectric properties and a different metal oxide. The mole ratio (Na/K) between Na (sodium) and K (potassium) in the main phase is 0.40<(Na/K)<3.0. The main phase has a crystal structure in which (i) first spots corresponding to a primitive lattice period and (ii) second spots corresponding to the lattice period two times the primitive lattice period and being weaker than the first spots appear in an electron beam diffraction image entering from the <100> direction with the main phase represented as a pseudo-cubic crystal system. Also, the area ratio of a crystal phase reflecting the second spots in the main phase is 33% or less, and the maximum grain size of crystals reflecting the second spots in the main phase is 25 nm or less.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: July 9, 2019
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Hisashi Kozuka, Hideto Yamada, Takayuki Matsuoka, Kazuaki Kitamura, Masato Yamazaki, Toshiaki Kurahashi, Takashi Kasashima, Yasuyuki Okimura, Kazushige Ohbayashi
  • Patent number: 10340441
    Abstract: A lead-free piezoelectric ceramic composition including an alkali niobate/tantalate perovskite oxide main phase having piezoelectric properties and a different metal oxide subphase. The mole ratio (Na/K) between Na (sodium) and K (potassium) in the main phase assumes a value in a range represented by 0.40<(Na/K)<3.0. The main phase has a crystal structure in which (i) first spots corresponding to a primitive lattice period and (ii) second spots corresponding to the lattice period two times the primitive lattice period and being weaker than the first spots appear in an electron beam diffraction image entering from the <100> direction with the main phase represented as a pseudo-cubic crystal system.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: July 2, 2019
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Hisashi Kozuka, Hideto Yamada, Takayuki Matsuoka, Kazuaki Kitamura, Masato Yamazaki, Toshiaki Kurahashi, Takashi Kasashima, Yasuyuki Okimura, Kazushige Ohbayashi
  • Patent number: 10323153
    Abstract: [Problem] To provide a corrosion-resistant coating that exhibits greater corrosion protection in saltwater environments and the like than was conventional, a method for forming the same, and a device for forming the same. [Solution] A corrosion-resistant alloy coating is formed on a substrate surface by: a) using a thermal spray gun, having a function wherein a flame including melted material particles is jetted toward a substrate, and the flame is partitioned from the open air in an upstream region on said jet path (which is to say the region in which the material particles are melted), and a function wherein, in a downstream region (the area continuing from the upstream region), the material particles and the flame are forcibly cooled by a jet-gas or jet-mist before reaching the substrate; and b) using a corrosion-resistant alloy material comprising aluminum, for the material particles.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: June 18, 2019
    Assignee: YOSHIKAWA KOGYO CO., LTD.
    Inventors: Ryurou Kurahashi, Toshiharu Morimoto, Yoshio Shin, Fumiaki Otsubo, Yasuhiro Omori, Takashi Kumai, Yusuke Nishiura, Toshifumi Horita
  • Patent number: 9012153
    Abstract: To provide a method for objectively evaluating or screening to identify a substance which is capable of suppressing or regulating olfaction. A method of evaluating or screening to identify an agent for suppressing olfactory sensitivity, including adding a test substance to a substrate having a voltage-dependent cation channel and evaluating or selecting a substance that inhibits an electrical activity caused by the cation channel.
    Type: Grant
    Filed: April 10, 2009
    Date of Patent: April 21, 2015
    Assignee: Kao Corporation
    Inventors: Kentaro Kumihashi, Hirohiko Ishida, Takashi Kurahashi
  • Publication number: 20110050246
    Abstract: To provide a method for objectively evaluating or screening to identify a substance which is capable of suppressing or regulating olfaction. A method of evaluating or screening to identify an agent for suppressing olfactory sensitivity, including adding a test substance to a substrate having a voltage-dependent cation channel and evaluating or selecting a substance that inhibits an electrical activity caused by the cation channel.
    Type: Application
    Filed: April 10, 2009
    Publication date: March 3, 2011
    Applicant: Kao Corporation
    Inventors: Kentaro Kumihashi, Hirohiko Ishida, Takashi Kurahashi
  • Patent number: 6562147
    Abstract: A connecting material, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an oxide film, which is naturally grown on the surface of a main connecting material such as solder or brazing between two terminals, to realize a reliable solder wetting (a state of the main connecting material being fused and mixed). For an auxiliary connecting material, hydrocarbon such as n-tetradecane (C14H30), for example, can be used. N-tetradecane boils between connection surfaces and cubically expands; energy generated therefrom physically disperses the oxide film and causes a fresh surface to be exposed; solders on both terminals are mixed; and an electrical and mechanical joint is securely achieved. The residue of the auxiliary connecting material is an insulating material, and therefore does not need cleaning.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: May 13, 2003
    Assignee: Denso Corporation
    Inventors: Toshihiro Miyake, Koii Kondo, Takashi Kurahashi, Nozomu Okumura, Makoto Takagi
  • Publication number: 20010023028
    Abstract: A soldering method, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an oxide film, which is naturally grown on the surface of a main connecting material such as solder or brazing between two terminals, to realize a reliable solder wetting (a state of the main connecting material being fused and mixed). For an auxiliary connecting material, hydrocarbon such as n-tetradecane (C14H30), for example, can be used. N-tetradecane boils between connection surfaces and cubically expands; energy generated therefrom physically disperses the oxide film and causes a fresh surface to be exposed; solders on both terminals are mixed; and an electrical and mechanical joint is securely achieved. The residue of the auxiliary connecting material is an insulating material, and therefore does not need cleaning. An excellent electrical joint which is moisture-resistant as well as highly reliable is attained.
    Type: Application
    Filed: March 30, 2001
    Publication date: September 20, 2001
    Applicant: NIPPONDENSO CO., LTD.
    Inventors: Toshihiro Miyake, Koii Kondo, Takashi Kurahashi, Nozomu Okumura, Makoto Takagi
  • Patent number: 6218030
    Abstract: A soldered product having secure reliable joints, without the use of flux, is disclosed. The soldered product includes a first member having a connected portion and a second member, also having a connected portion, facing the first member. The connected portions of the first and second members are electrically connected by a connecting material. A layer of hydrocarbon, including alkane, alkene or alkyne, is disposed around the periphery of the connecting material.
    Type: Grant
    Filed: August 7, 1997
    Date of Patent: April 17, 2001
    Assignee: Nippondenso Co., Ltd.
    Inventors: Toshihiro Miyake, Koji Kondo, Takashi Kurahashi, Nozomu Okumura, Makoto Takagi
  • Patent number: 5904860
    Abstract: Nitrogen atoms on the surface of a first body are terminated by hydrogen atoms after the surfaces of the first body and a second body to which it is to be bonded are cleaned. The surface of the first body terminated by the hydrogen atoms and the surface of the second body are bonded to each other so that hydrogen bonds are formed between the nitrogen atoms and the bonded hydrogen atoms on the surface of the first body and the atoms on the surface of the second body. Using these hydrogen bonds, the surface of the first body and the surface of the second body are strongly bonded to each other. When the surface of the second body is formed with nitride or oxide, strong hydrogen bonds of N--H .sup.- - - N or N--H .sup.- - - O are formed between the first body and the second body. Thus, the method does not require bonding under high temperature or high pressure.
    Type: Grant
    Filed: September 12, 1996
    Date of Patent: May 18, 1999
    Assignee: Nippondenso Co., Ltd.
    Inventors: Masao Nagakubo, Harumi Suzuki, Takashi Kurahashi
  • Patent number: 5824177
    Abstract: A semiconductor wafer, which can be divided into chips at a high yield and a low cost and easily handled during transfer thereof as well, is disclosed. In a semiconductor wafer of such structure that structures with a low mechanical strength, such as suspended microstructures, are exposed at a surface thereof, detachable adhesive sheet making up protective caps for the respective suspended microstructures are formed over the semiconductor wafer. By means of this, even if the semiconductor wafer is diced into the individual chips, respective microstructures on chips are protected from the external force, such as the pressure of cutting water, during the dicing process.
    Type: Grant
    Filed: July 12, 1996
    Date of Patent: October 20, 1998
    Assignee: Nippondenso Co., Ltd.
    Inventors: Shinji Yoshihara, Sumitomo Inomata, Fumio Ohara, Takashi Kurahashi
  • Patent number: 5734055
    Abstract: A process for preparing a N-tert-butyl-2-pyrazinecarboxamide having the formula (2): ##STR1## which comprises reacting a cyanopyrazine having the formula (1): ##STR2## with tert-butyl alcohol in the presence of sulfuric acid and a process for preparing a N-tert-butyl-2-piperazine-carboxamide having the formula (3): ##STR3## which comprises hydrogenating of said N-tert-butyl-2-pyrazinecarboxamide having the formula (2) in the presence of Raney nickel or Raney cobalt.
    Type: Grant
    Filed: July 20, 1995
    Date of Patent: March 31, 1998
    Assignee: Koei Chemical Co. Ltd.
    Inventors: Nanao Watanabe, Sadao Asahi, Hideki Kuranishi, Takashi Kurahashi
  • Patent number: 5669548
    Abstract: A soldering method, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an oxide film, which is naturally grown on the surface of a main connecting material such as solder or brazing between two terminals, to realize a reliable solder wetting (a state of the main connecting material being fused and mixed). For an auxiliary connecting material, hydrocarbon such as n-tetradecane (C.sub.14 H.sub.30), for example, can be used. N-tetradecane boils between connection surfaces and cubically expands; energy generated therefrom physically disperses the oxide film and causes a fresh surface to be exposed; solders on both terminals are mixed; and an electrical and mechanical joint is securely achieved. The residue of the auxiliary connecting material is an insulating material, and therefore does not need cleaning.
    Type: Grant
    Filed: March 22, 1996
    Date of Patent: September 23, 1997
    Assignee: Nippondenso Co., Ltd.
    Inventors: Toshihiro Miyake, Koji Kondo, Takashi Kurahashi, Nozomu Okumura, Makoto Takagi
  • Patent number: 5668033
    Abstract: On a silicon wafer there is formed a movable gate MOS transistor (sensing element: functional element). A bonding frame consisting of a silicon thin film is patterned around an element formation region on the surface of the silicon wafer. On a cap forming silicon wafer there is projectively provided a leg portion on the bottom surface of which a bonding layer consisting of a gold film is formed. The cap forming silicon wafer is disposed on the silicon wafer, whereupon heating with respect thereto is performed at a temperature equal to higher than a gold/silicon eutectic temperature to thereby make bondage between the bonding frame of the silicon wafer and the bonding layer of the cap forming silicon wafer. Thereafter, the both wafers are diced in chip units.
    Type: Grant
    Filed: May 17, 1996
    Date of Patent: September 16, 1997
    Assignee: Nippondenso Co., Ltd.
    Inventors: Fumio Ohara, Shinji Yoshihara, Katuhiko Kanamori, Takashi Kurahashi
  • Patent number: 4648425
    Abstract: A system and a method of confirming the operation of a steam relieving safety valve for a water-cooled nuclear reactor are provided. Acoustic vibration generated by steam relieved from the safety valve when the latter is opened is detected by an acoustic emission sensor. The acoustic emission sensor is mounted on the safety valve or a steam relief pipe connected to the safety valve.
    Type: Grant
    Filed: August 20, 1980
    Date of Patent: March 10, 1987
    Assignee: Doryokuro Kakunenryo Kaihatsu Jigyodan
    Inventors: Kenshu Watanabe, Tadashi Uchikawa, Masashi Takiyama, Takashi Kurahashi
  • Patent number: 4636643
    Abstract: In a fog detecting apparatus with optoelectronic system, comprising infrared-emitting means and infrared-receiving means, is provided means for adjusting a reference which is compared with a voltage value of a detecting signal generated according to an electrical signal produced by the infrared-receiving means in order to distinguish whether a windshield of a vehicle is in the fogging condition or not. The reference is changed according to the detecting signal which is produced when the windshield is in good condition against the fogging after a fog removing apparatus has been actuated to remove the fog attached on the windshield, so that the fogging condition is detected in accuracy independently of the contamination of the optoelectronic system or the like.
    Type: Grant
    Filed: July 25, 1984
    Date of Patent: January 13, 1987
    Assignee: Nippondenso Co., Ltd.
    Inventors: Kanehito Nakamura, Kazuma Matsui, Takashi Kurahashi, Hiroshi Ishikawa
  • Patent number: 4625329
    Abstract: An image analyzer for analyzing the position of a vehicle driver in a three-dimensional coordinate system. The analyzer comprises a light emitting element for emitting an infrared light the driver's face portion and an image detector arranged to receive reflected infrared light to generate an optical image of the driver's face portion. A microcomputer includes a memory for storing an electronic image corresponding to the optical image and processes the stored image to determine the position of a facial feature, such as an eye, in a three-dimensional coordinate system. Position indicating data is utilized in a driver assistance system.
    Type: Grant
    Filed: January 18, 1985
    Date of Patent: November 25, 1986
    Assignee: Nippondenso Co., Ltd.
    Inventors: Hiroshi Ishikawa, Kazuma Matsui, Takashi Kurahashi, Hidehiko Akatsuka, Motokazu Yamada
  • Patent number: 4595866
    Abstract: An automotive wiper control apparatus has an infrared emitting unit outside an occupant compartment, a photodetector unit inside the compartment in optical alignment with the infrared emitting unit, and an electric control for automatically controlling the wiper operation in dependence on the state in which infrared rays emitted by the infrared emitting unit through a predetermined area of the windshield are received by the photodetector unit. The photodetector unit has an infrared transmission plate formed of an infrared transmissive material and carrying infrared shielding layers applied in a striped pattern to one surface of the plate. The infrared transmission plate is disposed in front of a plurality of photodetectors so that a contrast is produced on the photodetectors by the infrared rays passing through the uncoated zones of the plate which are free from the infrared shielding layers. The contrast is varied with variation in the quantity of raindrops on the predetermined area of the windshield.
    Type: Grant
    Filed: October 26, 1984
    Date of Patent: June 17, 1986
    Assignee: Nippondenso Co., Ltd.
    Inventors: Yoshiaki Fukatsu, Takashi Kurahashi, Kazuma Matsui
  • Patent number: 4476419
    Abstract: A windshield wiper control device for use on a vehicle includes a light-emitting unit mounted on the vehicle outside of a compartment for emitting a ray of infrared radiation, a photodetector unit mounted on the vehicle within the compartment and having a slit plate for producing an image of a striped pattern with bright and dark areas in response to exposure to the ray of electromagnetic radiation through the windshield and an array of photodetectors for sensing the bright and dark areas of the striped image and generating signals indicative of the bright and dark areas, and an arithmetic circuit arrangement for computing a contrast of the bright and dark areas based on the signals from the photodetectors and controlling the speed and/or period of operation of the windshield wiper based on the computed contrast.
    Type: Grant
    Filed: May 31, 1983
    Date of Patent: October 9, 1984
    Assignee: Nippondenso Co., Ltd.
    Inventors: Yoshiaki Fukatsu, Takashi Kurahashi, Kazuma Matsui, Hiroki Ito
  • Patent number: 4361927
    Abstract: A device for preventing the vibration of a windshield wiper including a weight having two ends each secured to one of opposite ends of a pin extending through the end of a holder and separated from each other a suitable distance for the holder and the weight to move relative to each other between the two ends of the pin. The device is mounted on an auxiliary support member of a wiper blade for avoiding the wiper blade being separated from the surface of the windshield by the pressure of air when the vehicle travels at high speed.
    Type: Grant
    Filed: May 21, 1981
    Date of Patent: December 7, 1982
    Assignee: Kazuma Matsui
    Inventors: Kazuma Matsui, Takashi Kurahashi, Masahiko Suzuki, Kiyoshi Kawaguchi