Patents by Inventor Takashi Kurimoto
Takashi Kurimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10619261Abstract: A manufacturing method for an electronic component according to an aspect of the present invention includes: forming a first metal layer on a substrate; forming a second metal layer on the first metal layer; forming a mask made of an organic resin layer on the second metal layer; performing plasma etching on the second metal layer by using a reactant gas including fluorine via the mask to thereby form a recess portion in a layered film of the organic resin layer and the second metal layer; performing oxygen ashing treatment on an inner surface of the recess portion; and forming a third metal layer in the recess portion by electroplating treatment after the oxygen ashing treatment.Type: GrantFiled: March 22, 2018Date of Patent: April 14, 2020Assignee: ULVAC, INC.Inventors: Daisuke Hironiwa, Takashi Kurimoto, Masahisa Ueda
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Publication number: 20190177865Abstract: A manufacturing method for an electronic component according to an aspect of the present invention includes: forming a first metal layer on a substrate; forming a second metal layer on the first metal layer; forming a mask made of an organic resin layer on the second metal layer; performing plasma etching on the second metal layer by using a reactant gas including fluorine via the mask to thereby form a recess portion in a layered film of the organic resin layer and the second metal layer; performing oxygen ashing treatment on an inner surface of the recess portion; and forming a third metal layer in the recess portion by electroplating treatment after the oxygen ashing treatment.Type: ApplicationFiled: March 22, 2018Publication date: June 13, 2019Inventors: DAISUKE HIRONIWA, TAKASHI KURIMOTO, MASAHISA UEDA
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Patent number: 9466475Abstract: An ashing device that prevents the ashing rate from changing over time. The ashing device ashes organic material on a substrate including an exposed metal in a processing chamber. The ashing device includes a path, which is formed in the processing chamber and through which active species supplied to the processing chamber pass. The path is defined by a surface on which the metal scattered from the substrate by the active species is collectible, with the surface being formed so as to expose a metal that is of the same kind.Type: GrantFiled: September 26, 2014Date of Patent: October 11, 2016Assignee: ULVAC, INC.Inventors: Masahisa Ueda, Takashi Kurimoto, Kyuzo Nakamura, Koukou Suu, Toshiya Yogo, Kazushige Komatsu, Nobusuke Tachibana
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Patent number: 9059105Abstract: Disclosed is an ashing apparatus and its method of manufacture wherein decrease in processing efficiency is suppressed. Specifically, a shower plate is arranged to face a substrate stage on which a substrate is placed, and diffuses oxygen radicals supplied into a chamber. A metal blocking plate is arranged between the shower plate and the substrate stage and has a through hole through which oxygen radicals pass. In addition, the metal blocking plate has a first layer, which is made of a metal same as the one exposed in the substrate, on the surface facing the substrate.Type: GrantFiled: December 26, 2007Date of Patent: June 16, 2015Assignee: Ulvac, Inc.Inventors: Masahisa Ueda, Takashi Kurimoto, Michio Ishikawa, Koukou Suu, Toshiya Yogo
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Publication number: 20150013715Abstract: An ashing device that prevents the ashing rate from changing over time. The ashing device ashes organic material on a substrate including an exposed metal in a processing chamber. The ashing device includes a path, which is formed in the processing chamber and through which active species supplied to the processing chamber pass. The path is defined by a surface on which the metal scattered from the substrate by the active species is collectible, with the surface being formed so as to expose a metal that is of the same kind.Type: ApplicationFiled: September 26, 2014Publication date: January 15, 2015Inventors: Masahisa Ueda, Takashi Kurimoto, Kyuzo Nakamura, Koukou Suu, Toshiya Yogo, Kazushige Komatsu, Nobusuke Tachibana
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Patent number: 8532087Abstract: An optical network has: sections for establishing optical paths; a plurality of optical edge routers for connecting external IP networks to the optical network (1001); and a plurality of optical cross connects, for connecting the optical edge routers by the optical paths, having switching sections with respect to an optical pulse unit. In the optical network, each of the optical edge routers has both of: (1) an optical network control instance (INSp) for maintaining topology information in the optical network and switching/signaling the optical paths; and (2) an IP network instance (INSi) for maintaining a routing table in each of the external IP networks and activating routing protocols between the external IP networks and the IP network instance. By doing this, it is possible to realize a multi-layer cooperative function and provide highly safe optical networks, etc.Type: GrantFiled: February 2, 2004Date of Patent: September 10, 2013Assignee: Nippon Telegraph and Telephone CorporationInventors: Hisashi Kojima, Takashi Kurimoto, Ichiro Inoue, Tomonori Takeda, Takashi Miyamura, Keisuke Kabashima, Nobuaki Matsuura, Michihiro Aoki, Shigeo Urushidani
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Patent number: 7797444Abstract: A data transfer apparatus and a data transfer system are provided that can reduce the cost of installing communication equipment compatible with each of several dissimilar communication protocols in one exchange office and can reduce the cost of constructing the network.Type: GrantFiled: February 2, 2004Date of Patent: September 14, 2010Assignee: Nippon Telegraph and Telephone CorporationInventors: Keisuke Kabashima, Michihiro Aoki, Takashi Kurimoto, Takashi Miyamura, Masahiro Goshima, Nobuaki Matsuura, Shigeo Urushidani
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Publication number: 20100193131Abstract: An ashing device that prevents the ashing rate from changing over time. The ashing device ashes organic material on a substrate including an exposed metal in a processing chamber. The ashing device includes a path, which is formed in the processing chamber and through which active species supplied to the processing chamber pass. The path is defined by a surface on which the metal scattered from the substrate by the active species is collectible, with the surface being formed so as to expose a metal that is of the same kind.Type: ApplicationFiled: October 29, 2008Publication date: August 5, 2010Applicant: ULVAC, INC.Inventors: Masahisa Ueda, Takashi Kurimoto, Kyuzo Nakamura, Koukou Suu, Toshiya Yogo, Kazushige Komatsu, Nobusuke Tachibana
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Publication number: 20100089533Abstract: Disclosed is an ashing apparatus wherein decrease in processing efficiency is suppressed. Specifically, a shower plate is arranged to face a substrate stage on which a substrate is placed, and diffuses oxygen radicals supplied into a chamber. A metal blocking plate is arranged between the shower plate and the substrate stage and has a through hole through which oxygen radicals pass. In addition, the metal blocking plate has a first layer, which is made of a metal same as the one exposed in the substrate, on the surface facing the substrate.Type: ApplicationFiled: December 26, 2007Publication date: April 15, 2010Applicant: ULVAC, INC.Inventors: Masahisa Ueda, Takashi Kurimoto, Michio Ishikawa, Koukou Suu, Toshiya Yogo
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Patent number: 7142507Abstract: The purpose of the present invention is to provide a datagram transfer network that can operate stably by avoiding a state of congestion collapse by utilizing information derived from evaluating the impact of datagrams on the operation of the network. To achieve this objective, the results of evaluation is expressed as a preference value related to datagrams, and are inserted in the header in each datagram so that the datagrams are processed by an approach other than the methods based on arrival sequence of datagrams, when derived to the destination indicated in the header. In this approach, datagrams are protocol is controlled by priority order derived from the preference value which reflects traffic information obtained by a traffic monitoring equipment.Type: GrantFiled: February 22, 2000Date of Patent: November 28, 2006Assignee: Nippon Telegraph and Telephone CorporationInventors: Takashi Kurimoto, Takashi Shimizu, Ikuo Yamasaki
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Publication number: 20060168316Abstract: A data transfer apparatus and a data transfer system are provided that can reduce the cost of installing communication equipment compatible with each of several dissimilar communication protocols in one exchange office and can reduce the cost of constructing the network.Type: ApplicationFiled: February 2, 2004Publication date: July 27, 2006Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Keisuke Kabashima, Michihiro Aoki, Takashi Kurimoto, Takashi Miyamura, Masahiro Goshima, Nobuaki Matsuura, Shigeo Urushidani
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Publication number: 20060078333Abstract: A routing table generating unit that generates a routing table describing a next hop to which a packet is to be sent according to a destination address of the packet that is input via an input channel, including a ternary content addressable memory (TCAM); an external memory; a unit that classifies items in information that is received; and a unit that stores an item that uniquely identifies the information among the classified items in the TCAM and stores the rest of the items to the external memory.Type: ApplicationFiled: August 18, 2004Publication date: April 13, 2006Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Masanori Uga, Takashi Kurimoto, Michihiro Aoki
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Patent number: 6043004Abstract: The ashing method comprises the steps of forming resist on a part of an underlying layer, ion-implanting elements into the underlying layer and the resist, placing the resist in radical atmosphere including oxygen radical and then ashing an upper layer portion which includes the impurity elements and is formed an a surface of the resist, and ashing remaining portion of the resist by increasing an amount of the oxygen radical in the radical atmosphere.Type: GrantFiled: March 13, 1998Date of Patent: March 28, 2000Assignee: Fujitsu LimitedInventor: Takashi Kurimoto
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Patent number: 5472564Abstract: Plasma etching with hydrogen bromide or bromine as an etching gas allows a precise control in attaining vertical etching or taper etching with a desired taper angle by controlling the temperature of a mass to be etched, which mass is usually a semiconductor wafer.Type: GrantFiled: August 11, 1993Date of Patent: December 5, 1995Assignee: Fujitsu LimitedInventors: Moritaka Nakamura, Takashi Kurimoto, Katsuhiko Iizuka
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Patent number: 5316616Abstract: Plasma etching with hydrogen bromide or bromine as an etching gas allows a precise control of attaining vertical etching or taper etching with a desired taper angle by controlling a temperature of a mass to be etched, which mass is a phosphorus-doped n-type polycrystalline silicon, phosphorus-doped single crystalline or phosphorus-doped silicides semiconductor wafer.Type: GrantFiled: May 27, 1993Date of Patent: May 31, 1994Assignee: Fujitsu LimitedInventors: Moritaka Nakamura, Takashi Kurimoto, Katsuhiko Iizuka
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Patent number: 4798650Abstract: A method of reactive ion etching (RIE) of aluminum or an alloy thereof (Al) in which a substrate with an Al layer coated thereon is maintained at a temperature of 60.degree. C. or less by cooling the substrate, so that the Al layer is taperingly etched to form conductor lines having sloped sidewalls. The substrate is clamped to a cooled electrode stage by an electrostatic chuck.Type: GrantFiled: March 28, 1988Date of Patent: January 17, 1989Assignee: Fujitsu LimitedInventors: Moritaka Nakamura, Takashi Kurimoto