Patents by Inventor Takashi Kurimoto

Takashi Kurimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10619261
    Abstract: A manufacturing method for an electronic component according to an aspect of the present invention includes: forming a first metal layer on a substrate; forming a second metal layer on the first metal layer; forming a mask made of an organic resin layer on the second metal layer; performing plasma etching on the second metal layer by using a reactant gas including fluorine via the mask to thereby form a recess portion in a layered film of the organic resin layer and the second metal layer; performing oxygen ashing treatment on an inner surface of the recess portion; and forming a third metal layer in the recess portion by electroplating treatment after the oxygen ashing treatment.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: April 14, 2020
    Assignee: ULVAC, INC.
    Inventors: Daisuke Hironiwa, Takashi Kurimoto, Masahisa Ueda
  • Publication number: 20190177865
    Abstract: A manufacturing method for an electronic component according to an aspect of the present invention includes: forming a first metal layer on a substrate; forming a second metal layer on the first metal layer; forming a mask made of an organic resin layer on the second metal layer; performing plasma etching on the second metal layer by using a reactant gas including fluorine via the mask to thereby form a recess portion in a layered film of the organic resin layer and the second metal layer; performing oxygen ashing treatment on an inner surface of the recess portion; and forming a third metal layer in the recess portion by electroplating treatment after the oxygen ashing treatment.
    Type: Application
    Filed: March 22, 2018
    Publication date: June 13, 2019
    Inventors: DAISUKE HIRONIWA, TAKASHI KURIMOTO, MASAHISA UEDA
  • Patent number: 9466475
    Abstract: An ashing device that prevents the ashing rate from changing over time. The ashing device ashes organic material on a substrate including an exposed metal in a processing chamber. The ashing device includes a path, which is formed in the processing chamber and through which active species supplied to the processing chamber pass. The path is defined by a surface on which the metal scattered from the substrate by the active species is collectible, with the surface being formed so as to expose a metal that is of the same kind.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: October 11, 2016
    Assignee: ULVAC, INC.
    Inventors: Masahisa Ueda, Takashi Kurimoto, Kyuzo Nakamura, Koukou Suu, Toshiya Yogo, Kazushige Komatsu, Nobusuke Tachibana
  • Patent number: 9059105
    Abstract: Disclosed is an ashing apparatus and its method of manufacture wherein decrease in processing efficiency is suppressed. Specifically, a shower plate is arranged to face a substrate stage on which a substrate is placed, and diffuses oxygen radicals supplied into a chamber. A metal blocking plate is arranged between the shower plate and the substrate stage and has a through hole through which oxygen radicals pass. In addition, the metal blocking plate has a first layer, which is made of a metal same as the one exposed in the substrate, on the surface facing the substrate.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: June 16, 2015
    Assignee: Ulvac, Inc.
    Inventors: Masahisa Ueda, Takashi Kurimoto, Michio Ishikawa, Koukou Suu, Toshiya Yogo
  • Publication number: 20150013715
    Abstract: An ashing device that prevents the ashing rate from changing over time. The ashing device ashes organic material on a substrate including an exposed metal in a processing chamber. The ashing device includes a path, which is formed in the processing chamber and through which active species supplied to the processing chamber pass. The path is defined by a surface on which the metal scattered from the substrate by the active species is collectible, with the surface being formed so as to expose a metal that is of the same kind.
    Type: Application
    Filed: September 26, 2014
    Publication date: January 15, 2015
    Inventors: Masahisa Ueda, Takashi Kurimoto, Kyuzo Nakamura, Koukou Suu, Toshiya Yogo, Kazushige Komatsu, Nobusuke Tachibana
  • Patent number: 8532087
    Abstract: An optical network has: sections for establishing optical paths; a plurality of optical edge routers for connecting external IP networks to the optical network (1001); and a plurality of optical cross connects, for connecting the optical edge routers by the optical paths, having switching sections with respect to an optical pulse unit. In the optical network, each of the optical edge routers has both of: (1) an optical network control instance (INSp) for maintaining topology information in the optical network and switching/signaling the optical paths; and (2) an IP network instance (INSi) for maintaining a routing table in each of the external IP networks and activating routing protocols between the external IP networks and the IP network instance. By doing this, it is possible to realize a multi-layer cooperative function and provide highly safe optical networks, etc.
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: September 10, 2013
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Hisashi Kojima, Takashi Kurimoto, Ichiro Inoue, Tomonori Takeda, Takashi Miyamura, Keisuke Kabashima, Nobuaki Matsuura, Michihiro Aoki, Shigeo Urushidani
  • Patent number: 7797444
    Abstract: A data transfer apparatus and a data transfer system are provided that can reduce the cost of installing communication equipment compatible with each of several dissimilar communication protocols in one exchange office and can reduce the cost of constructing the network.
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: September 14, 2010
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Keisuke Kabashima, Michihiro Aoki, Takashi Kurimoto, Takashi Miyamura, Masahiro Goshima, Nobuaki Matsuura, Shigeo Urushidani
  • Publication number: 20100193131
    Abstract: An ashing device that prevents the ashing rate from changing over time. The ashing device ashes organic material on a substrate including an exposed metal in a processing chamber. The ashing device includes a path, which is formed in the processing chamber and through which active species supplied to the processing chamber pass. The path is defined by a surface on which the metal scattered from the substrate by the active species is collectible, with the surface being formed so as to expose a metal that is of the same kind.
    Type: Application
    Filed: October 29, 2008
    Publication date: August 5, 2010
    Applicant: ULVAC, INC.
    Inventors: Masahisa Ueda, Takashi Kurimoto, Kyuzo Nakamura, Koukou Suu, Toshiya Yogo, Kazushige Komatsu, Nobusuke Tachibana
  • Publication number: 20100089533
    Abstract: Disclosed is an ashing apparatus wherein decrease in processing efficiency is suppressed. Specifically, a shower plate is arranged to face a substrate stage on which a substrate is placed, and diffuses oxygen radicals supplied into a chamber. A metal blocking plate is arranged between the shower plate and the substrate stage and has a through hole through which oxygen radicals pass. In addition, the metal blocking plate has a first layer, which is made of a metal same as the one exposed in the substrate, on the surface facing the substrate.
    Type: Application
    Filed: December 26, 2007
    Publication date: April 15, 2010
    Applicant: ULVAC, INC.
    Inventors: Masahisa Ueda, Takashi Kurimoto, Michio Ishikawa, Koukou Suu, Toshiya Yogo
  • Patent number: 7142507
    Abstract: The purpose of the present invention is to provide a datagram transfer network that can operate stably by avoiding a state of congestion collapse by utilizing information derived from evaluating the impact of datagrams on the operation of the network. To achieve this objective, the results of evaluation is expressed as a preference value related to datagrams, and are inserted in the header in each datagram so that the datagrams are processed by an approach other than the methods based on arrival sequence of datagrams, when derived to the destination indicated in the header. In this approach, datagrams are protocol is controlled by priority order derived from the preference value which reflects traffic information obtained by a traffic monitoring equipment.
    Type: Grant
    Filed: February 22, 2000
    Date of Patent: November 28, 2006
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Takashi Kurimoto, Takashi Shimizu, Ikuo Yamasaki
  • Publication number: 20060168316
    Abstract: A data transfer apparatus and a data transfer system are provided that can reduce the cost of installing communication equipment compatible with each of several dissimilar communication protocols in one exchange office and can reduce the cost of constructing the network.
    Type: Application
    Filed: February 2, 2004
    Publication date: July 27, 2006
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Keisuke Kabashima, Michihiro Aoki, Takashi Kurimoto, Takashi Miyamura, Masahiro Goshima, Nobuaki Matsuura, Shigeo Urushidani
  • Publication number: 20060078333
    Abstract: A routing table generating unit that generates a routing table describing a next hop to which a packet is to be sent according to a destination address of the packet that is input via an input channel, including a ternary content addressable memory (TCAM); an external memory; a unit that classifies items in information that is received; and a unit that stores an item that uniquely identifies the information among the classified items in the TCAM and stores the rest of the items to the external memory.
    Type: Application
    Filed: August 18, 2004
    Publication date: April 13, 2006
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Masanori Uga, Takashi Kurimoto, Michihiro Aoki
  • Patent number: 6043004
    Abstract: The ashing method comprises the steps of forming resist on a part of an underlying layer, ion-implanting elements into the underlying layer and the resist, placing the resist in radical atmosphere including oxygen radical and then ashing an upper layer portion which includes the impurity elements and is formed an a surface of the resist, and ashing remaining portion of the resist by increasing an amount of the oxygen radical in the radical atmosphere.
    Type: Grant
    Filed: March 13, 1998
    Date of Patent: March 28, 2000
    Assignee: Fujitsu Limited
    Inventor: Takashi Kurimoto
  • Patent number: 5472564
    Abstract: Plasma etching with hydrogen bromide or bromine as an etching gas allows a precise control in attaining vertical etching or taper etching with a desired taper angle by controlling the temperature of a mass to be etched, which mass is usually a semiconductor wafer.
    Type: Grant
    Filed: August 11, 1993
    Date of Patent: December 5, 1995
    Assignee: Fujitsu Limited
    Inventors: Moritaka Nakamura, Takashi Kurimoto, Katsuhiko Iizuka
  • Patent number: 5316616
    Abstract: Plasma etching with hydrogen bromide or bromine as an etching gas allows a precise control of attaining vertical etching or taper etching with a desired taper angle by controlling a temperature of a mass to be etched, which mass is a phosphorus-doped n-type polycrystalline silicon, phosphorus-doped single crystalline or phosphorus-doped silicides semiconductor wafer.
    Type: Grant
    Filed: May 27, 1993
    Date of Patent: May 31, 1994
    Assignee: Fujitsu Limited
    Inventors: Moritaka Nakamura, Takashi Kurimoto, Katsuhiko Iizuka
  • Patent number: 4798650
    Abstract: A method of reactive ion etching (RIE) of aluminum or an alloy thereof (Al) in which a substrate with an Al layer coated thereon is maintained at a temperature of 60.degree. C. or less by cooling the substrate, so that the Al layer is taperingly etched to form conductor lines having sloped sidewalls. The substrate is clamped to a cooled electrode stage by an electrostatic chuck.
    Type: Grant
    Filed: March 28, 1988
    Date of Patent: January 17, 1989
    Assignee: Fujitsu Limited
    Inventors: Moritaka Nakamura, Takashi Kurimoto