Patents by Inventor Takashi Kurita

Takashi Kurita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942751
    Abstract: Disclosed is a laser device including: a laser light source configured to emit laser light; a phase control unit configured to receive the laser light emitted from the laser light source, to control a spatial phase of a portion of the laser light, to emit the portion of the light as control light, and to emit another portion of the laser light as non-control light; a first optical system configured to irradiate an object with the control light emitted from the phase control unit; a detector configured to detect the non-control light emitted from the phase control unit; a second optical system configured to cause the non-control light emitted from the phase control unit to converge toward a detection surface of the detector.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: March 26, 2024
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi Kurita, Ryo Yoshimura, Ryo Makino, Yuu Takiguchi
  • Publication number: 20240082959
    Abstract: A laser processing apparatus includes a support unit that supports a wafer including a plurality of functional elements disposed adjacent to each other via a street, an irradiation unit that irradiates the street with laser light, and a control unit that controls the irradiation unit based on information about the streets so that a first region and a second region of the street are simultaneously irradiated with the laser light, and a power of the laser light for removing a surface layer of the street in the first region is higher than a power for removing the surface layer of the street in the first region. The information about the street includes information that a processing threshold value indicating a difficulty of laser processing in the first region is lower than a processing threshold value in the second region.
    Type: Application
    Filed: December 20, 2021
    Publication date: March 14, 2024
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yo SUGIMOTO, Takeshi SAKAMOTO, Takafumi OGIWARA, Naoki UCHIYAMA, Takashi KURITA, Ryo YOSHIMURA
  • Publication number: 20240051067
    Abstract: A laser processing method includes: a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street; and a second step of, after the first step, irradiating the street with laser light based on information regarding the street such that a surface layer of the street is removed in a first region of the street and the surface layer remains in a second region of the street. The information regarding the street includes information indicating that, when a modified region is formed in the wafer along a line passing through the street, a fracture extending from the modified region does not reach the street along the line in the first region, and reaches the street along the line in the second region.
    Type: Application
    Filed: December 20, 2021
    Publication date: February 15, 2024
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yo SUGIMOTO, Takeshi SAKAMOTO, Takafumi OGIWARA, Naoki UCHIYAMA, Takashi KURITA, Ryo YOSHIMURA
  • Publication number: 20240033859
    Abstract: A laser processing method includes a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street, a second step of, after the first step, forming a modified region in the wafer along a line passing through the street, and a third step of, after the second step, irradiating the street with laser light such that a surface layer of the street is removed, and a fracture extending from the modified region reaches a bottom surface of a recess formed by removing the surface layer, along the line.
    Type: Application
    Filed: December 20, 2021
    Publication date: February 1, 2024
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yo SUGIMOTO, Takeshi SAKAMOTO, Takafumi OGIWARA, Naoki UCHIYAMA, Takashi KURITA, Ryo YOSHIMURA
  • Publication number: 20240030672
    Abstract: Disclosed is a laser device including: a laser light source configured to emit laser light; a phase control unit configured to receive the laser light emitted from the laser light source, to control a spatial phase of a portion of the laser light, to emit the portion of the light as control light, and to emit another portion of the laser light as non-control light; a first optical system configured to irradiate an object with the control light emitted from the phase control unit; a detector configured to detect the non-control light emitted from the phase control unit; a second optical system configured to cause the non-control light emitted from the phase control unit to converge toward a detection surface of the detector.
    Type: Application
    Filed: September 29, 2021
    Publication date: January 25, 2024
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi KURITA, Ryo YOSHIMURA, Ryo MAKINO, Yuu TAKIGUCHI
  • Publication number: 20230330774
    Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes: a first step of expanding an area irradiated with the laser light toward a first side in the objective area; and a second step of expanding the area irradiated with the laser light toward a second side different from the first side in the objective area.
    Type: Application
    Filed: July 5, 2021
    Publication date: October 19, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yuki KABEYA, Takashi KURITA, Ryo YOSHIMURA, Takeshi WATARI
  • Publication number: 20230330779
    Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes a processing step of scanning the objective area with an irradiation spot of the laser light while increasing a moving average in intensity of the laser light per unit area.
    Type: Application
    Filed: July 5, 2021
    Publication date: October 19, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yuki KABEYA, Takashi KURITA, Ryo YOSHIMURA, Takeshi WATARI
  • Publication number: 20230226639
    Abstract: A processed product manufacturing method includes preparing a workpiece containing metal and forming a plurality of first regions and a second region along a surface of the workpiece by the irradiation of a laser beam. The first regions are applied with a tensile residual stress. In the second region applied with a compressive residual stress, a plurality of irradiation points separated from each other in the surface of the workpiece are irradiated with the laser beam. The first regions are formed to be separated from each other and each of the first regions is surrounded by the second region when viewed from a direction orthogonal to the surface.
    Type: Application
    Filed: June 4, 2021
    Publication date: July 20, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi KURITA, Takeshi WATARI, Yuki KABEYA, Ryo YOSHIMURA
  • Publication number: 20230185238
    Abstract: A laser processing apparatus includes a spatial light modulator for inputting laser light output from a laser light source and outputting laser light after phase modulation by a hologram, and a control unit for presenting, on the spatial light modulator, the hologram for focusing the laser light after the phase modulation output from the spatial light modulator on a plurality of irradiation points in a processing object by a focusing optical system. The control unit sets at least one of a shape and a size of a processing region defined by the irradiation points in a first plane intersecting an optical axis of the laser light and a processing region defined by the irradiation points in a second plane intersecting the optical axis and separated from the first plane in a direction of the optical axis to be different from each other.
    Type: Application
    Filed: February 17, 2021
    Publication date: June 15, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi KURITA, Yuu TAKIGUCHI
  • Publication number: 20230143460
    Abstract: A laser processing apparatus includes a spatial light modulator for inputting laser light output from a laser light source and outputting laser light after phase modulation by a hologram, and a control unit for presenting, on the spatial light modulator, the hologram for focusing the laser light after the phase modulation output from the spatial light modulator on a plurality of irradiation points in a processing object by a focusing optical system. The control unit controls light intensities of at least two irradiation points included in the plurality of irradiation points independently of each other.
    Type: Application
    Filed: February 17, 2021
    Publication date: May 11, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi KURITA, Yuu TAKIGUCHI
  • Publication number: 20230120938
    Abstract: A vehicle mounting structure for an electric unit 1 includes a side member 10, a suspension member 5 including a high rigidity portion 5a and a low rigidity portion 5b in a vehicle front-rear direction, and an electric unit 1 in which an inverter 2 and a motor 3 are integrated. The side member 10 includes a curved portion 10c having an upwardly convex curved shape. The curved portion 10c is disposed at a position overlapping with the inverter 2 in the vehicle front-rear direction. The electric unit 1 is fixed to the low rigidity portion 5b.
    Type: Application
    Filed: March 4, 2020
    Publication date: April 20, 2023
    Applicant: NISSAN MOTOR CO., LTD.
    Inventors: Daisuke ASAKURA, Takashi KURITA
  • Publication number: 20230075209
    Abstract: A laser processing apparatus includes a semiconductor laser element, a waveform output unit for outputting input waveform data, a driver circuit for supplying a drive current having a time waveform according to the input waveform data to the semiconductor laser element, and a processing optical system for irradiating a processing object with laser light. The semiconductor laser element outputs the laser light in which two or more light pulse groups each including one or a plurality of light pulses are provided with a time interval therebetween. Time waveforms of at least two light pulse are different from each other. The time waveform includes at least one of a time waveform of each of the one or plurality of light pulses, a time width of each of the one or plurality of light pulses, and a time interval of the plurality of light pulses.
    Type: Application
    Filed: February 10, 2021
    Publication date: March 9, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi KURITA, Kazuki KAWAI
  • Publication number: 20230049067
    Abstract: A hybrid system for a vehicle includes a drive unit provided with a motor for driving wheels and a power generation unit provided with an engine and a generator driven by the engine. The power generation unit is provided so as to be adjacent to the drive unit in a separated state. One of the drive unit and the power generation unit is mounted on a vehicle body via a first mount member at a lower portion of the one unit. The other one of the drive unit and the power generation unit is mounted on the vehicle body via a second mount member at an upper portion of the other one unit.
    Type: Application
    Filed: February 4, 2020
    Publication date: February 16, 2023
    Applicant: NISSAN MOTOR CO., LTD.
    Inventors: Takashi KURITA, Daisuke ASAKURA, Ryo WATANABE
  • Patent number: 11504803
    Abstract: A laser processing apparatus includes a light source which outputs a laser light, and a waveform control unit which controls a pulse waveform of the laser light irradiating the workpiece, in which the pulse waveform of the laser light controlled by the waveform control unit includes a main pulse and a foot pulse temporally preceding the main pulse, and a peak intensity of the foot pulse is smaller than a peak intensity of the main pulse, and a peak position of the main pulse is positioned in a retention time period of plasma generated due to an incidence of the foot pulse on the workpiece.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: November 22, 2022
    Assignee: HAMAMATSU PHOTONICS K.K
    Inventors: Yoshio Mizuta, Takashi Kurita, Takeshi Watari, Yuki Kabeya, Norio Kurita, Toshiyuki Kawashima
  • Patent number: 11424591
    Abstract: A laser device is a laser device that includes an output unit that outputs seed light to a light amplifying unit. The output unit has a light source unit that outputs, as the seed light, rays of light with a plurality of wavelengths lying within a gain range of the light amplifying unit, and a seed light control unit that controls an intensity-time waveform of the seed light output from the light source unit.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: August 23, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi Kurita, Yoshinori Kato, Toshiyuki Kawashima
  • Publication number: 20220263292
    Abstract: A laser apparatus includes a light source unit and a light combining unit. The light source unit outputs first laser light and second laser light having a wavelength different from that of the first laser light to different optical paths. The light combining unit is optically coupled to the light source unit, and combines the first laser light and the second laser light to generate a burst pulse with a frequency according to a difference between the wavelength of the first laser light and the wavelength of the second laser light. In the light source unit, the wavelengths of the first laser light and the second laser light are set in advance or settable such that the frequency of the burst pulse is 1 GHz or more.
    Type: Application
    Filed: June 25, 2020
    Publication date: August 18, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi KURITA, Yoshinori KATO, Toshiyuki KAWASHIMA
  • Publication number: 20210273407
    Abstract: A laser apparatus includes a semiconductor laser element, a waveform calculation unit for calculating input waveform data, a driver circuit for supplying a drive current having a temporal waveform according to the input waveform data to the semiconductor laser element, an optical amplifier for amplifying laser light output from the semiconductor laser element, and a light waveform detection unit for detecting a waveform of laser light after the amplification output from the optical amplifier. The waveform calculation unit compares the waveform of the laser light after the amplification detected by the light waveform detection unit with a target waveform, adjusts a temporal waveform of the input waveform data, and brings the waveform of the laser light after the amplification close to the target waveform.
    Type: Application
    Filed: July 2, 2019
    Publication date: September 2, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi KURITA, Yoshinori KATO, Toshiyuki KAWASHIMA
  • Publication number: 20200106237
    Abstract: A laser device is a laser device that includes an output unit that outputs seed light to a light amplifying unit. The output unit has a light source unit that outputs, as the seed light, rays of light with a plurality of wavelengths lying within a gain range of the light amplifying unit, and a seed light control unit that controls an intensity-time waveform of the seed light output from the light source unit.
    Type: Application
    Filed: November 21, 2017
    Publication date: April 2, 2020
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi KURITA, Yoshinori KATO, Toshiyuki KAWASHIMA
  • Patent number: 10374377
    Abstract: A plate-like laser medium has a through-hole for providing a flow of a cooling medium. The laser medium unit includes the plurality of laser media. A laser beam amplification device includes a laser medium unit 10, an excitation light source 21 that causes excitation light to enter the laser medium unit 10, a through-hole 16a of a window member as a unit for supplying the cooling medium in a through-hole 14a of the laser medium 14, and a cooling medium flow path F1 arranged around the laser medium unit 10.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: August 6, 2019
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takashi Sekine, Yoshinori Kato, Yoshinori Tamaoki, Takashi Kurita, Toshiyuki Kawashima, Takaaki Morita
  • Publication number: 20190232423
    Abstract: A laser processing apparatus includes a light source which outputs a laser light, and a waveform control unit which controls a pulse waveform of the laser light irradiating the workpiece, in which the pulse waveform of the laser light controlled by the waveform control unit includes a main pulse and a foot pulse temporally preceding the main pulse, and a peak intensity of the foot pulse is smaller than a peak intensity of the main pulse, and a peak position of the main pulse is positioned in a retention time period of plasma generated due to an incidence of the foot pulse on the workpiece.
    Type: Application
    Filed: January 24, 2019
    Publication date: August 1, 2019
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yoshio MIZUTA, Takashi KURITA, Takeshi WATARI, Yuki KABEYA, Norio KURITA, Toshiyuki KAWASHIMA