Patents by Inventor Takashi NAKAMITSU

Takashi NAKAMITSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10985132
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: April 20, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
  • Publication number: 20200343216
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Application
    Filed: July 14, 2020
    Publication date: October 29, 2020
    Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
  • Patent number: 10756046
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: August 25, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
  • Publication number: 20190385973
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Application
    Filed: August 28, 2019
    Publication date: December 19, 2019
    Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
  • Publication number: 20190312006
    Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.
    Type: Application
    Filed: October 10, 2017
    Publication date: October 10, 2019
    Inventors: Takashi Nakamitsu, Shuhei Matsumoto, Toshifumi Inamasu
  • Patent number: 10438920
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: October 8, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
  • Publication number: 20190273063
    Abstract: A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.
    Type: Application
    Filed: October 11, 2017
    Publication date: September 5, 2019
    Inventors: Takashi Nakamitsu, Shuhei Matsumoto, Yosuke Omori
  • Publication number: 20180158796
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Application
    Filed: November 27, 2017
    Publication date: June 7, 2018
    Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA