Patents by Inventor Takashi Ohtsuka

Takashi Ohtsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240038754
    Abstract: To reduce the chip size of a chip-type electronic component including a capacitor and an inductor. A chip-type electronic component includes a capacitor constituted by a lower electrode pattern, an upper electrode pattern, and an insulating layer, an insulating layer covering the capacitor, and an inductor pattern disposed on the insulating layer. The inductor pattern has a section overlapping the capacitor, whereby an auxiliary capacitor is added. The inductor pattern is thus made to partly overlap the capacitor, so that a larger inductance can be obtained with a small chip size. In addition, characteristics can also be improved by auxiliary capacitance.
    Type: Application
    Filed: December 9, 2021
    Publication date: February 1, 2024
    Inventors: Yukio MITAKE, Takashi OHTSUKA
  • Publication number: 20230397338
    Abstract: An electronic component has: a conductor layer M1 formed on a substrate and including lower electrodes of a capacitor; a dielectric film covering the top and side surfaces of each of the lower electrodes; upper electrodes of the capacitor which are formed on the top surfaces of the respective lower electrodes through the dielectric film; and an adhesive film disposed between the dielectric film and the top and side surfaces of each of the lower electrodes. The adhesive film is thus disposed between the dielectric film and the top and side surfaces of each of the lower electrodes.
    Type: Application
    Filed: August 14, 2023
    Publication date: December 7, 2023
    Inventors: Atsuhiro TSUYOSHI, Takashi OHTSUKA, Kenichi YOSHIDA
  • Publication number: 20230371175
    Abstract: To prevent interfacial peeling due to the stress of an insulating layer in a capacitor-inductor integrated electronic component having three or more conductor layers. An electronic component includes: a conductor layer M1 including a conductor pattern constituting an inductor; a conductor pattern overlapping a part of the conductor pattern through a dielectric film; an insulating layer covering the conductor layer M1 and conductor pattern; a conductor layer M2 provided on the insulating layer and including a conductor pattern constituting the inductor; and an insulating layer covering the conductor layer M2. The conductor layer M2 is formed to be branching from or independently of the conductor pattern and further includes a dummy pattern overlapping the conductor pattern. This prevents the stress of the insulating layer from being directly applied to the conductor pattern to thereby prevent peeling at the interface between the conductor layer M1 and the dielectric film.
    Type: Application
    Filed: September 13, 2021
    Publication date: November 16, 2023
    Inventors: Yu FUKAE, Tomoya HANAI, Yusuke OBA, Kenichi YOSHIDA, Katsuharu YASUDA, Takashi OHTSUKA
  • Publication number: 20230317352
    Abstract: In an electronic component, a first inductor and a second inductor are disposed side by side in a first direction, and in a region where the first inductor and the second inductor are adjacent to each other in the first direction, at least one of positions in a second direction of an upper surface of a first inductor pattern, and an upper surface of a second inductor pattern and positions in the second direction of a lower surface of the first inductor pattern and a lower surface of a second inductor pattern, are different.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 5, 2023
    Applicant: TDK CORPORATION
    Inventors: Takeshi OOHASHI, Michiyuki NAKAZAWA, Takashi OHTSUKA
  • Patent number: 11776947
    Abstract: Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: October 3, 2023
    Assignee: TDK CORPORATION
    Inventors: Yusuke Oba, Kenichi Yoshida, Takashi Ohtsuka, Yuichiro Okuyama, Tomoya Hanai, Yu Fukae
  • Publication number: 20230213253
    Abstract: A cooling device using a refrigeration cycle in which a refrigerant is circulated through a heat receiver, a compressor, a heat radiator, and an expansion valve includes: a gas-liquid separator configured to perform gas-liquid separation on the refrigerant supplied from the expansion valve; a pump configured to send a liquid phase refrigerant separated by the gas-liquid separator to the heat receiver; and a control unit configured to control opening and closing of a refrigerant flow path of the refrigeration cycle, and an operation and stop of the compressor and the pump, wherein the control unit starts the operation of the pump on condition that a net positive suction head of the pump has reached a predetermined value or more.
    Type: Application
    Filed: September 13, 2021
    Publication date: July 6, 2023
    Applicant: NEC Corporation
    Inventors: Takashi OHTSUKA, Koichi Todoroki, Yoshinori Miyamoto, Masaki Chiba, Mahiro Hachiya, Minoru Yoshikawa
  • Publication number: 20230005667
    Abstract: An electronic component includes: a conductive pattern provided on the main surface of a substrate and constituting a lower electrode; a dielectric film that covers top and side surfaces of the conductive pattern; and a conductive pattern stacked on the top surface of the conductive pattern through the dielectric film and constituting an upper electrode. A part of the dielectric film that is parallel to the main surface of the substrate is removed at least partly. Partially removing a part of the dielectric film that is parallel to the main surface of the substrate allows stress relaxation. This prevents peeling at the interface between the lower electrode and the dielectric film.
    Type: Application
    Filed: December 4, 2020
    Publication date: January 5, 2023
    Inventors: Kazuhiro YOSHIKAWA, Kenichi YOSHIDA, Takashi OHTSUKA
  • Patent number: 11545303
    Abstract: Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: January 3, 2023
    Assignee: TDK CORPORATION
    Inventors: Kazuhiro Yoshikawa, Kenichi Yoshida, Takashi Ohtsuka, Yuichiro Okuyama, Takeshi Oohashi, Hajime Kuwajima
  • Patent number: 11515854
    Abstract: An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: November 29, 2022
    Assignee: TDK Corporation
    Inventors: Yoshihiro Shinkai, Yuichiro Okuyama, Yusuke Ariake, Tomoya Hanai, Isao Kanada, Takashi Ohtsuka
  • Patent number: 11452209
    Abstract: Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.
    Type: Grant
    Filed: December 26, 2020
    Date of Patent: September 20, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichiro Okuyama, Takeshi Oohashi, Hajime Kuwajima, Takashi Ohtsuka, Kazuhiro Yoshikawa, Kenichi Yoshida
  • Patent number: 11387442
    Abstract: Provided is a lithium ion secondary battery having high energy density and excellent cycle characteristics. The present invention relates to a negative electrode for a lithium ion secondary battery comprising: (i) a negative electrode mixture layer comprising a negative electrode active material and a negative electrode binder and (ii) a negative electrode current collector, wherein the negative electrode active material comprises an alloy comprising silicon (Si alloy), the Si alloy is crystalline and has a median diameter (D50 particle size) of 1.2 ?m or less, and an amount of the negative electrode binder based on the weight of the negative electrode mixture layer is 12% by weight or more and 50% by weight or less.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: July 12, 2022
    Assignee: NEC CORPORATION
    Inventors: Daisuke Kawasaki, Takuya Hasegawa, Takashi Ohtsuka
  • Patent number: 11357110
    Abstract: Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: June 7, 2022
    Assignee: TDK CORPORATION
    Inventors: Takeshi Oohashi, Shinichiro Toda, Daiki Kusunoki, Takashi Ohtsuka, Kazuhiro Yoshikawa, Kenichi Yoshida
  • Publication number: 20220151113
    Abstract: To efficiently cool down heat of a heating element 20, this electronic device 100 is provided with a circuit board 10 having a heating element 20 that is attached to a first main surface 11 thereof, a case 30 having an opening part 31 that is formed in a surface facing the heating element 20 and housing a refrigerant COO therein, and a connection part 40 connecting the opening part 31 and the heating element 20 so as to enclose the refrigerant COO, the connecting part has a thickness of at most 0.21 mm.
    Type: Application
    Filed: February 14, 2020
    Publication date: May 12, 2022
    Applicant: NEC Corporation
    Inventors: Mahiro HACHIYA, Minoru YOSHIKAWA, Takashi OHTSUKA, Nobuo KANEKO
  • Patent number: 11328872
    Abstract: An LC composite component includes a non-magnetic substrate, a magnetic layer with magnetism, capacitors, inductors, and core parts with magnetism. The non-magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the non-magnetic substrate. The inductors and the capacitors are disposed between the first surface of the non-magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the non-magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core parts is 1.0 or more times the thickness of the magnetic layer in a direction perpendicular to the first surface of the non-magnetic substrate, and each of the magnetic layer and the core parts contains magnetic metal particles and resin.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: May 10, 2022
    Assignee: TDK CORPORATION
    Inventors: Yoshihiro Shinkai, Yuichiro Okuyama, Tomoya Hanai, Yusuke Ariake, Isao Kanada, Takashi Ohtsuka
  • Publication number: 20210407737
    Abstract: Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.
    Type: Application
    Filed: May 26, 2021
    Publication date: December 30, 2021
    Applicant: TDK CORPORATION
    Inventors: Hajime KUWAJIMA, Takashi OHTSUKA, Takeshi OOHASHI, Yuichiro OKUYAMA
  • Publication number: 20210305231
    Abstract: Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 30, 2021
    Applicant: TDK CORPORATION
    Inventors: Yusuke OBA, Kenichi YOSHIDA, Takashi OHTSUKA, Yuichiro OKUYAMA, Tomoya HANAI, Yu FUKAE
  • Publication number: 20210225593
    Abstract: Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.
    Type: Application
    Filed: January 7, 2021
    Publication date: July 22, 2021
    Applicant: TDK CORPORATION
    Inventors: Kazuhiro YOSHIKAWA, Kenichi YOSHIDA, Takashi OHTSUKA, Yuichiro OKUYAMA, Takeshi OOHASHI, Hajime KUWAJIMA
  • Publication number: 20210219430
    Abstract: Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.
    Type: Application
    Filed: December 26, 2020
    Publication date: July 15, 2021
    Applicant: TDK CORPORATION
    Inventors: Yuichiro OKUYAMA, Takeshi OOHASHI, Hajime KUWAJIMA, Takashi OHTSUKA, Kazuhiro YOSHIKAWA, Kenichi YOSHIDA
  • Publication number: 20210204406
    Abstract: Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.
    Type: Application
    Filed: December 23, 2020
    Publication date: July 1, 2021
    Inventors: Takeshi OOHASHI, Shinichiro TODA, Daiki KUSUNOKI, Takashi OHTSUKA, Kazuhiro YOSHIKAWA, Kenichi YOSHIDA
  • Publication number: 20210057721
    Abstract: Provided is a lithium ion secondary battery having high energy density and excellent cycle characteristics, and hardly causing burning. The present invention relates to a lithium ion secondary battery comprising an electrode mixture layer comprising an electrode active material comprising Si alloy having a median diameter of 1.2 ?m or less and 12% by weight or more and 50% by weight or less of an electrode binder; and an electrolyte solution comprising 60% by volume or more and 99% by volume or less of a phosphoric acid ester compound, 0% by volume or more and 30% by volume or less of a fluorinated ether compound, and 1% by volume or more and 35% by volume or less of a fluorinated carbonate compound, wherein the total amount of the phosphoric acid ester compound and the fluorinated ether compound is 65% by volume or more.
    Type: Application
    Filed: November 21, 2018
    Publication date: February 25, 2021
    Applicant: NEC CORPORATION
    Inventors: Daisuke KAWASAKI, Takashi OHTSUKA, Kazuhiko INOUE