Patents by Inventor Takashi Oyamada

Takashi Oyamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140023656
    Abstract: The present invention provides a medicinal agent and a method for each of various testing or the like, which enable the treatment and prevention, particularly preventive treatment, of Th3 march-related diseases. The present invention also provides a pharmaceutical composition for treating and/or preventing Th3 march-related diseases, which comprises zinc, calcium and phosphorus and additionally comprises pumpkin seeds and corn silk, and which preferably can activate the DNA repairing ability of a zinc finger, particularly the ability of repairing defect or mutation of DNA for a filaggrin gene, of a zinc finger.
    Type: Application
    Filed: September 26, 2011
    Publication date: January 23, 2014
    Applicant: BioLT CO., LTD.
    Inventors: Masato Kuwabara, Yasuhiko Kojima, Takashi Oyamada, Michio Honjo, Kazuko Uno, Yukio Yajima, Akina Kuwabara
  • Patent number: 7397662
    Abstract: A heat-radiating structure of an electronic card unit is compact and reinforces a printed circuit board while improving heat radiation efficiency. Card unit 6 has dual function reinforcing plate-heat dissipaters 17 and 18 at the upper and lower edges of a printed circuit board 12 on which a heat-generating component 19 is mounted. Heat generated by component 19 is conducted to the reinforcing plate-heat dissipaters by passing a fluid in a heat pipe 21, a heat-conducting sheet 31 or a heat radiation circulation pipe 41 to be removed into the air. The reinforcing plates-heat dissipaters 17 and 18 are formed with a plurality of air vents 17a and 18a.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: July 8, 2008
    Assignee: NEC Corporation
    Inventor: Takashi Oyamada
  • Patent number: 7161804
    Abstract: A sealed housing is provided with a body, a cover, and a movable fin for radiating heat while suppressing a change in internal pressure, and preventing invasion of water vapor or poisonous gas from the exterior to thereby avoid an accident caused by dew condensation, and corrosion of an electrical circuit component. The movable fin automatically slides toward the inside or outside of the sealed housing depending on a change in internal atmospheric pressure of the sealed housing following a change in internal temperature thereof. When the temperature inside the sealed housing rises due to heat from the electrical circuit component mounted in a package inside the sealed housing, a heat radiation area of the movable fin increases while keeping sealing tightness so that a heat radiation effect can be enhanced.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: January 9, 2007
    Assignee: NEC Corporation
    Inventor: Takashi Oyamada
  • Patent number: 7040383
    Abstract: A telecommunication device includes a housing formed by gas-assist injection molding and having an inner wall, outer wall and a hollow space formed therebetween and receiving therein gas refrigerant. The hollow space has a plurality of vertical channels wherein the gas refrigerant cools the internal of the housing by natural convection within the vertical channels. A movable wall is disposed in the vertical channel for controlling a pressure rise occurring upon a temperature rise.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: May 9, 2006
    Assignee: NEC Corporation
    Inventor: Takashi Oyamada
  • Patent number: 6916203
    Abstract: A water-proof modular connector includes a plug socket to be fixed to an object, and a plug detachably coupled to the plug socket. The plug socket includes a plug socket body having first and second socket-openings directing outwardly and inwardly of the object, respectively, a modular jack unit having first and second jack-openings directed in opposite directions to each other, and a holder which holds the modular jack in the plug socket body such that the first and second jack-openings are directed to the first and second socket-openings, respectively. The plug includes a plug body through which a communication cable passes, a modular plug connected to the communication cable, a first positioning unit which positions the modular plug in the plug body, a cap which detachably couples the plug body to the plug socket body such that the modular plug is inserted into the first socket-opening, and a water-proof unit ensuring water-proof between the plug socket body and the plug body.
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: July 12, 2005
    Assignee: NEC Corporation
    Inventors: Takashi Oyamada, Makoto Ueki
  • Patent number: 6904933
    Abstract: An enclosure for outdoor equipment, which can prevent the enclosure from being damaged by a rise of air pressure inside the enclosure by exhausting air from the enclosure, and further can secure safety of the enclosure and can secure easiness for fixing an inside air pressure adjusting mechanism to the enclosure and also can prevent a dew condensation from occurring in the enclosure, is provided. The enclosure for outdoor equipment provides an inside air pressure adjusting mechanism. The inside air pressure adjusting mechanism provides a valve seat and a valve element which is seated on the valve seat in a state that the valve element can be opened and closed by placing a sealing component between them. The inside air pressure adjusting mechanism is inserted to a hole of the enclosure for outdoor equipment, in which an electronic circuit is disposed, and fixed so that the inside air pressure adjusting mechanism does not stick out largely from the front surface of the enclosure for outdoor equipment.
    Type: Grant
    Filed: August 13, 2002
    Date of Patent: June 14, 2005
    Assignee: NEC Corporation
    Inventor: Takashi Oyamada
  • Publication number: 20050122686
    Abstract: A heat-radiating structure of an electronic card unit is compact and reinforces a printed circuit board while improving heat radiation efficiency. Card unit 6 has dual function reinforcing plate-heat dissipaters 17 and 18 at the upper and lower edges of a printed circuit board 12 on which a heat-generating component 19 is mounted. Heat generated by component 19 is conducted to the reinforcing plate-heat dissipaters by passing a fluid in a heat pipe 21, a heat-conducting sheet 31 or a heat radiation circulation pipe 41 to be removed into the air. The reinforcing plates-heat dissipaters 17 and 18 are formed with a plurality of air vents 17a and 18a.
    Type: Application
    Filed: December 6, 2004
    Publication date: June 9, 2005
    Applicant: NEC CORPORATION
    Inventor: Takashi Oyamada
  • Publication number: 20040242067
    Abstract: A water-proof modular connector includes a plug socket to be fixed to an object, and a plug detachably coupled to the plug socket. The plug socket includes a plug socket body having first and second socket-openings directing outwardly and inwardly of the object, respectively, a modular jack unit having first and second jack-openings directed in opposite directions to each other, and a holder which holds the modular jack in the plug socket body such that the first and second jack-openings are directed to the first and second socket-openings, respectively. The plug includes a plug body through which a communication cable passes, a modular plug connected to the communication cable, a first positioning unit which positions the modular plug in the plug body, a cap which detachably couples the plug body to the plug socket body such that the modular plug is inserted into the first socket-opening, and a water-proof unit ensuring water-proof between the plug socket body and the plug body.
    Type: Application
    Filed: May 28, 2004
    Publication date: December 2, 2004
    Applicant: NEC Corporation
    Inventors: Takashi Oyamada, Makoto Ueki
  • Publication number: 20040165352
    Abstract: A sealed housing of the present invention is used in an electronic device such as a communication device, and is provided with a body, a cover, and a movable fin for radiating heat while suppressing a change in internal pressure, and preventing invasion of water vapor or poisonous gas from the exterior to thereby avoid an accident caused by dew condensation, corrosion of an electrical circuit component, or the like. The movable fin is configured to be automatically slidable toward the inside or outside of the sealed housing depending on a change in internal atmospheric pressure of the sealed housing following a change in internal temperature thereof. When the temperature inside the sealed housing rises due to heat from the electrical circuit component mounted in a package inside the sealed housing, it is possible to increase a heat radiation area of the movable fin while keeping sealing tightness so that a heat radiation effect can be enhanced.
    Type: Application
    Filed: February 18, 2004
    Publication date: August 26, 2004
    Applicant: NEC CORPORATION
    Inventor: Takashi Oyamada
  • Publication number: 20030034148
    Abstract: A telecommunication device includes a housing formed by gas-assist injection molding and having an inner wall, outer wall and a hollow space formed therebetween and receiving therein gas refrigerant. The hollow space has a plurality of vertical channels wherein the gas refrigerant cools the internal of the housing by natural convection within the vertical channels. A movable wall is disposed in the vertical channel for controlling a pressure rise occurring upon a temperature rise.
    Type: Application
    Filed: August 15, 2002
    Publication date: February 20, 2003
    Applicant: NEC CORPORATION
    Inventor: Takashi Oyamada
  • Publication number: 20030036307
    Abstract: An enclosure for outdoor equipment, which can prevent the enclosure from being damaged by a rise of air pressure inside the enclosure by exhausting air from the enclosure, and further can secure safety of the enclosure and can secure easiness for fixing an inside air pressure adjusting mechanism to the enclosure and also can prevent a dew condensation from occurring in the enclosure, is provided. The enclosure for outdoor equipment provides an inside air pressure adjusting mechanism. The inside air pressure adjusting mechanism provides a valve seat and a valve element which is seated on the valve seat in a state that the valve element can be opened and closed by placing a sealing component between them. The inside air pressure adjusting mechanism is inserted to a hole of the enclosure for outdoor equipment, in which an electronic circuit is disposed, and fixed so that the inside air pressure adjusting mechanism does not stick out largely from the front surface of the enclosure for outdoor equipment.
    Type: Application
    Filed: August 13, 2002
    Publication date: February 20, 2003
    Applicant: NEC CORPORATION
    Inventor: Takashi Oyamada
  • Patent number: 6427762
    Abstract: A mounting structure for communication equipment comprises two housings (a main body portion and a fixing portion) which are designed to be separable from each other, and the fixing portion is equipped with a heat exchanger for heat-exchanging heat generated in the main body portion with cold air, thereby radiating the heat from the inside of the main body portion to the outside.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: August 6, 2002
    Assignee: NEC Corporation
    Inventor: Takashi Oyamada
  • Patent number: 6337438
    Abstract: A casing structure for a communication equipment in which panels mounted in the casing are electrically insulated from a messenger wire. When the casing of the communication equipment is mounted on the messenger wire, the insulation prohibits impediments otherwise caused by extraneous noise current flowing in the messenger wire. The mounting portion of the case has a handle structure which provides improved operability and convenience.
    Type: Grant
    Filed: November 10, 1997
    Date of Patent: January 8, 2002
    Assignee: NEC Corporation
    Inventor: Takashi Oyamada
  • Publication number: 20010054494
    Abstract: In a mount structure of the communication equipment, communication equipment comprises two housings (a main body portion and a fixing portion) which are designed to be separable from each other, and the fixing portion is equipped with a heat exchanger for heat-exchanging heat generated in the main body portion with cold air, thereby radiating the heat from the inside of the main body portion to the outside.
    Type: Application
    Filed: June 21, 2001
    Publication date: December 27, 2001
    Applicant: NEC CORPORATION
    Inventor: Takashi Oyamada
  • Patent number: 6166905
    Abstract: A sealed type casing comprises a casing body 10, a cover 9, one motor 12 fixed to a rear face plate 10a of the casing body, a plurality of inner and outer heat exchange fins 11a, 11b integral with and formed on inner and outer surfaces of the rear face plate so that the heat exchange fins are arranged vortically in an overlapping manner around a rotary shaft 12a of the motor, a first centrifugal fan 13 adapted to be rotated inside the casing body by the motor and sending the air to the inner heat exchange fins, and a second centrifugal fan 13 adapted to be rotated outside the casing body by the motor and sending outside air to the outer heat exchange fins. When the motor is rotated, the centrifugal fans apply a centrifugal force to the air sucked from a region close to the rotary shaft of the motor, and send out the air toward the heat exchange fins.
    Type: Grant
    Filed: June 15, 1999
    Date of Patent: December 26, 2000
    Assignee: NEC Corporation
    Inventors: Takashi Oyamada, Yasuo Ueno
  • Patent number: 5969943
    Abstract: A communication device for use in a base station of a portable telephone system has a radiation section including a spiral projection formed on an external surface of a casing to define a spiral air passage on the casing, a fan disposed on the casing inside a central space of the spiral passage, and a motor disposed inside the casing to drive the fan through a shaft penetrating the wall of the casing. A spiral air flow generated by the fan functions for efficient heat radiation through the casing. The spiral projection is formed by drawing the wall of the casing.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: October 19, 1999
    Assignee: NEC Corporation
    Inventor: Takashi Oyamada
  • Patent number: 5946191
    Abstract: A heat sink structure for an electronic device of the type having a chassis and a plug-in unit provides efficient heat dissipation for a heat-generating component on a printed circuit board within the unit. In a preferred embodiment, a first heat pipe is fixedly attached to a heat dissipating plate for the heat generating component. At the opposite end, the first heat pipe is held by a connector plug attached to the unit. At one end, a second heat pipe is held by a plug-receiving seat that is fixedly attached to a backboard of the chassis. At the opposite end, the second heat pipe is fixedly attached to a heat dissipating portion on the chassis. The first heat pipe, plug, plug-receiving seat and second heat pipe transfer heat from the heat-generating component to the heat-dissipating portion.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: August 31, 1999
    Assignee: NEC Corporation
    Inventor: Takashi Oyamada
  • Patent number: D311188
    Type: Grant
    Filed: May 18, 1987
    Date of Patent: October 9, 1990
    Assignee: NEC Corporation
    Inventors: Takashi Oyamada, Mamoru Takahashi
  • Patent number: D317014
    Type: Grant
    Filed: November 30, 1988
    Date of Patent: May 21, 1991
    Assignee: NEC Corporation
    Inventors: Takashi Oyamada, Mamoru Takahashi
  • Patent number: D338465
    Type: Grant
    Filed: August 23, 1989
    Date of Patent: August 17, 1993
    Assignee: NEC Corporation
    Inventors: Sigeki Hayasaka, Takashi Oyamada, Kozo Maemura