Patents by Inventor Takashi Sugihara

Takashi Sugihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11213799
    Abstract: An adsorbent capable of adsorbing radioactive antimony, radioactive iodine and radioactive ruthenium, the adsorbent containing cerium(IV) hydroxide in a particle or granular form having a particle size of 250 ?m or more and 1200 ?m or less; and a treatment method of radioactive waste water containing radioactive antimony, radioactive iodine and radioactive ruthenium, the treatment method comprising passing the radioactive waste water containing radioactive antimony, radioactive iodine and radioactive ruthenium through an adsorption column packed with the adsorbent, to adsorb the radioactive antimony, radioactive iodine and radioactive ruthenium on the adsorbent, wherein the absorbent is packed to a height of 10 cm or more and 300 cm or less of the adsorption column, and wherein the radioactive waste water is passed through the adsorption column at a linear velocity (LV) of 1 m/h or more and 40 m/h or less and a space velocity (SV) of 200 h?1 or less.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: January 4, 2022
    Assignees: EBARA CORPORATION, NIPPON CHEMICAL INDUSTRIAL CO., LTD.
    Inventors: Takashi Sakuma, Makoto Komatsu, Takeshi Izumi, Shinsuke Miyabe, Yutaka Kinose, Kiyoshi Satou, Kenta Kozasu, Mari Tokutake, Takeshi Sakamoto, Kaori Sugihara
  • Publication number: 20210384921
    Abstract: Provided is an optical transmission device including: a symbol demapping unit; a likelihood generation circuit configured to generate likelihoods relating to the reception signal; and an error correction decoding unit configured to execute soft decision decoding. The likelihood generation circuit includes: a first one-dimensional-modulation lookup table configured to input the signal of the I-axis component as an argument to output a first likelihood; a second one-dimensional-modulation lookup table configured to input the signal of the Q-axis component as an argument to output a second likelihood; and a two-dimensional-modulation lookup table configured to input, as an argument, the signal being the concatenation of the signal of the I-axis component and the signal of the Q-axis component, to generate a third likelihood. The error correction decoding unit is configured to execute the soft decision decoding based on the first likelihood, the second likelihood, and the third likelihood.
    Type: Application
    Filed: August 18, 2021
    Publication date: December 9, 2021
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yoshiaki KONISHI, Kenji ISHII, Hideo YOSHIDA, Takashi SUGIHARA, Tsuyoshi YOSHIDA
  • Publication number: 20210348943
    Abstract: A map information correction apparatus includes: a feature point priority determination unit that determines, based on a priority table, a priority for a feature point of own mobile object surrounding information; a feature pair priority determination unit that gives, when there is one or more feature pairs, a priority to the feature pair, based on an own mobile object surrounding information priority of the feature pair and a map information priority of the feature pair, the feature pair being a pair of an own mobile object surrounding information feature point and a received map information feature point that correspond to each other; an error calculation unit that calculates an error in the map information, based on a high-priority own mobile object surrounding information feature point and a high-priority map information feature point, the high-priority own mobile object surrounding information feature point being the own mobile object surrounding information feature point, the high-priority map informati
    Type: Application
    Filed: July 23, 2021
    Publication date: November 11, 2021
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kyoko HOSOI, Takashi SUGIHARA
  • Patent number: 11167364
    Abstract: Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: November 9, 2021
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Ryoichi Suzuki, Yasuji Kawashima, Tetuya Okuno, Shigeo Komine, Takashi Sugihara
  • Publication number: 20210328602
    Abstract: Provided is an error correction decoding device including an inner code iterative decoding circuit, a parameter generation circuit, and a first control circuit. The first control circuit is configured to: receive, as parameters, a threshold and a maximum iteration count which are generated by the parameter generation circuit; and compare, when an iteration count does not reach the maximum iteration count, a non-zero-value count sequentially output from the inner code iterative decoding circuit and the threshold set for each iteration count, and stop an iterative operation by the inner code iterative decoding circuit when a result of the comparison satisfies a stopping condition set in advance.
    Type: Application
    Filed: July 1, 2021
    Publication date: October 21, 2021
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hideo YOSHIDA, Yoshiaki KONISHI, Kenji ISHII, Takashi SUGIHARA
  • Patent number: 11130188
    Abstract: A jet solder bath for performing soldering by jetting molten solder to bring the molten solder into contact with a substrate is provided with a primary jet nozzle that jets the molten solder by a first jet pump, as a first jet nozzle, and a secondary jet nozzle, as a second jet nozzle, which is arranged at a downstream side of the primary jet nozzle along a carrying direction of the substrate and jets the molten solder by a second jet pump. The primary jet nozzle includes a first nozzle body, and a first solder-flow-forming plate that is provided at an upper end of the first nozzle body and has a plurality of jet holes, and the secondary jet nozzle includes a second nozzle body and a second solder-flow-forming plate that is provided at an upper end of the second nozzle body and has a plurality of jet holes.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: September 28, 2021
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Takashi Sugihara, Kaname Nagata
  • Publication number: 20210245282
    Abstract: A jet solder bath for performing soldering by jetting molten solder to bring the molten solder into contact with a substrate is provided with a primary jet nozzle that jets the molten solder by a first jet pump, as a first jet nozzle, and a secondary jet nozzle, as a second jet nozzle, which is arranged at a downstream side of the primary jet nozzle along a carrying direction of the substrate and jets the molten solder by a second jet pump. The primary jet nozzle includes a first nozzle body, and a first solder-flow-forming plate that is provided at an upper end of the first nozzle body and has a plurality of jet holes, and the secondary jet nozzle includes a second nozzle body and a second solder-flow-forming plate that is provided at an upper end of the second nozzle body and has a plurality of jet holes.
    Type: Application
    Filed: December 10, 2018
    Publication date: August 12, 2021
    Inventors: Takashi Sugihara, Kaname Nagata
  • Patent number: 11004787
    Abstract: A semiconductor chip includes a memory cell array and a wiring layer. The memory cell array includes a plurality of blocks arranged in a first direction along a surface of the semiconductor chip. The wiring layer includes a plurality of first pattern regions at different positions along the first direction, each first pattern region including a different pattern corresponding to one or more of the blocks. The first pattern regions can be used to identify portions of the semiconductor chip during analysis or the like.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: May 11, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Masaya Ichikawa, Takashi Sugihara, Kaito Shirai, Satoshi Kotomari
  • Publication number: 20210086791
    Abstract: A vehicle traveling control device includes: a communicator periodically receiving a dynamic map; a sensor management circuit collecting, from one or more sensors measuring a state of objects around a vehicle, a result of measurement representing the state of objects around the vehicle; a surrounding information comparator comparing object data represented by the dynamic map with object data represented by the result of measurement, and in response to finding mismatching object data, detecting, from the mismatching object data, data of the dynamic map representing an object within a specified range from the vehicle; and a proximity information processor setting, from the data of the dynamic map detected by the surrounding information comparator, data representing the vehicle as an avoidance non-target object in traveling control, and setting data representing an object other than the vehicle as an avoidance target object in traveling control or the avoidance non-target object.
    Type: Application
    Filed: December 4, 2020
    Publication date: March 25, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kyoko HOSOI, Kenichi NAKURA, Takeshi SUEHIRO, Takashi SUGIHARA
  • Patent number: 10917116
    Abstract: Provided is an error correction device including an encoding circuit configured to encode a plurality of error correction code sequences, in which the encoding circuit includes a plurality of encoding circuits connected in parallel, and is configured to execute encoding processing for the plurality of error correction code sequences through use of all the plurality of encoding circuits by adjusting an output bus width and a frequency of an operation clock with respect to a difference in transmission rate for any payloads input in one or more systems.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: February 9, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hideo Yoshida, Kazuo Kubo, Kenji Ishii, Kenya Sugihara, Takashi Sugihara
  • Patent number: 10894294
    Abstract: Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: January 19, 2021
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Ryoichi Suzuki, Yasuji Kawashima, Shigeo Komine, Takashi Sugihara, Hiroyuki Inoue
  • Publication number: 20200290143
    Abstract: Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.
    Type: Application
    Filed: November 27, 2018
    Publication date: September 17, 2020
    Inventors: Ryoichi Suzuki, Yasuji Kawashima, Shigeo Komine, Takashi Sugihara, Hiroyuki Inoue
  • Publication number: 20200266144
    Abstract: A semiconductor chip includes a memory cell array and a wiring layer. The memory cell array includes a plurality of blocks arranged in a first direction along a surface of the semiconductor chip. The wiring layer includes a plurality of first pattern regions at different positions along the first direction, each first pattern region including a different pattern corresponding to one or more of the blocks. The first pattern regions can be used to identify portions of the semiconductor chip during analysis or the like.
    Type: Application
    Filed: September 3, 2019
    Publication date: August 20, 2020
    Inventors: Masaya ICHIKAWA, Takashi SUGIHARA, Kaito SHIRAI, Satoshi KOTOMARI
  • Publication number: 20200021311
    Abstract: Provided is an error correction device including an encoding circuit configured to encode a plurality of error correction code sequences, in which the encoding circuit includes a plurality of encoding circuits connected in parallel, and is configured to execute encoding processing for the plurality of error correction code sequences through use of all the plurality of encoding circuits by adjusting an output bus width and a frequency of an operation clock with respect to a difference in transmission rate for any payloads input in one or more systems.
    Type: Application
    Filed: March 9, 2017
    Publication date: January 16, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hideo YOSHIDA, Kazuo KUBO, Kenji ISHII, Kenya SUGIHARA, Takashi SUGIHARA
  • Patent number: 10293439
    Abstract: A soldering apparatus including a flux-applying device having a nut that is fitted into the soldering apparatus and the flux-applying device can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each apparatus or device is used for a long time are adhered. The nut screws on to the screw shaft having a predetermined length. The nut is provided with at least one non-meshing part that does not mesh with the screw shaft and is formed parallel to a movement direction thereof. The non-meshing part extends from a forward end of the nut to a rear end thereof along whole length of the nut.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: May 21, 2019
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Takashi Sugihara, Hiroshi Taguchi, Tsutomu Hiyama
  • Publication number: 20190039159
    Abstract: Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 7, 2019
    Inventors: Ryoichi Suzuki, Yasuji Kawashima, Tetuya Okuno, Shigeo Komine, Takashi Sugihara
  • Patent number: 10128940
    Abstract: An optical transmission method wavelength-multiplexing and transmitting multiple channels including data. The data are composed of data areas independent between the channels and data areas non-independent between the channels. Data patterns of the data areas non-independent between the channels are variable. The data patterns of the data areas non-independent between the channels are set so that in time periods of the non-independent data areas on an optical transmission section, a time period during which polarization states of the multiple channels are correlated in the optical transmission section has a length such that an error rate is less than or equal to a threshold value, the error rate being determined from a temporal distribution of bit errors obtained from a result of error decision after demodulation in an optical receiver.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: November 13, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroki Goto, Tsuyoshi Yoshida, Kiyoshi Onohara, Takashi Sugihara, Kazuo Kubo, Tatsuya Kobayashi, Keisuke Matsuda, Masashi Binkai
  • Patent number: 10076041
    Abstract: Provided are a nut, an attachment for nut and a screw shaft, which are fitted to a coating material coating device or a soldering device and can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each device is used for a long time are fixed, and a soldering device using the same. The nut 10 screws on to the screw shaft 2 having a predetermined length. The nut 10 is provided with a non-meshing part 11 composed of a notch 12 that is formed parallel to a movement direction thereof by cutting off screw threads and a flange portion 13, which has connecting holes 14 for connecting another member. Under such a configuration, by forward and/or backward movement of the nut 10, the notch 12 functions as if it scraps the fixed matters 6.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: September 11, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Takashi Sugihara, Hiroshi Taguchi, Tsutomu Hiyama
  • Publication number: 20180141168
    Abstract: A soldering apparatus including a flux-applying device having a nut that is fitted into the soldering apparatus and the flux-applying device can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each apparatus or device is used for a long time are adhered. The nut screws on to the screw shaft having a predetermined length. The nut is provided with at least one non-meshing part that does not mesh with the screw shaft and is formed parallel to a movement direction thereof. The non-meshing part extends from a forward end of the nut to a rear end thereof along whole length of the nut.
    Type: Application
    Filed: February 17, 2016
    Publication date: May 24, 2018
    Inventors: Takashi Sugihara, Hiroshi Taguchi, Tsutomu Hiyama
  • Publication number: 20170311453
    Abstract: Provided are a nut, an attachment for nut and a screw shaft, which are fitted to a coating material coating device or a soldering device and can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each device is used for a long time are fixed, and a soldering device using the same. The nut 10 screws on to the screw shaft 2 having a predetermined length. The nut 10 is provided with a non-meshing part 11 composed of a notch 12 that is formed parallel to a movement direction thereof by cutting off screw threads and a flange portion 13, which has connecting holes 14 for connecting another member. Under such a configuration, by forward and/or backward movement of the nut 10, the notch 12 functions as if it scraps the fixed matters 6.
    Type: Application
    Filed: October 7, 2015
    Publication date: October 26, 2017
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Takashi Sugihara, Hiroshi Taguchi, Tsutomu Hiyama