Abstract: A photoresist composition comprising: a resin which has a structural unit represented by formula (I): wherein R1 represents a hydrogen atom, a halogen atom, or a C1 to C6 alkyl group which optionally has a halogen atom, and R2 represents a C1 to C42 hydrocarbon group which optionally has a substituent; an alkali-soluble resin; an acid generator; and a solvent.

Abstract: The present invention provides a resist composition which has sufficient resistant to a plating treatment and is capable of forming a resist pattern with high accuracy. The present invention also provides a method for producing a resist pattern using the resist composition, and a method for producing a plated molded article using the resist pattern. The present invention relates to a resist composition comprising a compound (I) having a quinone diazide sulfonyl group, a resin comprising a structural unit having an acid-labile group (A1), an alkali-soluble resin (A2) and an acid generator (B); a method for producing a resist pattern using the resist composition; and a method for producing a plated molded article using the resist pattern.

Abstract: Provided is an error correction decoding device including an inner code iterative decoding circuit, a parameter generation circuit, and a first control circuit. The first control circuit is configured to: receive, as parameters, a threshold and a maximum iteration count which are generated by the parameter generation circuit; and compare, when an iteration count does not reach the maximum iteration count, a non-zero-value count sequentially output from the inner code iterative decoding circuit and the threshold set for each iteration count, and stop an iterative operation by the inner code iterative decoding circuit when a result of the comparison satisfies a stopping condition set in advance.

Abstract: An EGR valve includes: an inner housing including a flow passage; a valve element which opens and closes the flow passage; a valve shaft on which the valve element is provided; an outer housing in which the inner housing is assembled; and a drive unit which drives the valve shaft. The flow passage of the inner housing includes an inlet and an outlet. The outer housing includes an assembly hole and separate flow passages. When the inner housing is assembled in the assembly hole, the inlet and the outlet of the inner housing communicate with the separate flow passages of the outer housing; an inlet sealing member is provided between the inner housing and the outer housing to correspond to the periphery of the inlet; and an outlet sealing member is provided between the inner housing and the outer housing to correspond to the periphery of the outlet.

Abstract: Provided are a silicotitanate molded body having high strength and reduced generation of fine powder, a production method thereof, an adsorbent comprising the silicotitanate molded body, and a decontamination method of radioactive cesium and/or radioactive strontium by using the adsorbent. The silicotitanate molded body comprises: crystalline silicotitanate particles that have a particle size distribution in which 90% or more, on volume basis, of the particles have a particle size within a range of 1 ?m or more and 10 ?m or less and that are represented by a general formula of A2Ti2O3(SiO4).nH2O wherein A represents one or two alkali metal elements selected from Na and K, and n represents a number of 0 to 2; and an oxide of one or more elements selected from the group consisting of aluminum, zirconium, iron, and cerium.

Abstract: Provided is an optical transmission device including: a symbol demapping unit; a likelihood generation circuit configured to generate likelihoods relating to the reception signal; and an error correction decoding unit configured to execute soft decision decoding. The likelihood generation circuit includes: a first one-dimensional-modulation lookup table configured to input the signal of the I-axis component as an argument to output a first likelihood; a second one-dimensional-modulation lookup table configured to input the signal of the Q-axis component as an argument to output a second likelihood; and a two-dimensional-modulation lookup table configured to input, as an argument, the signal being the concatenation of the signal of the I-axis component and the signal of the Q-axis component, to generate a third likelihood. The error correction decoding unit is configured to execute the soft decision decoding based on the first likelihood, the second likelihood, and the third likelihood.

Abstract: A map information correction apparatus includes: a feature point priority determination unit that determines, based on a priority table, a priority for a feature point of own mobile object surrounding information; a feature pair priority determination unit that gives, when there is one or more feature pairs, a priority to the feature pair, based on an own mobile object surrounding information priority of the feature pair and a map information priority of the feature pair, the feature pair being a pair of an own mobile object surrounding information feature point and a received map information feature point that correspond to each other; an error calculation unit that calculates an error in the map information, based on a high-priority own mobile object surrounding information feature point and a high-priority map information feature point, the high-priority own mobile object surrounding information feature point being the own mobile object surrounding information feature point, the high-priority map informati

Abstract: Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.

Abstract: Provided is an error correction decoding device including an inner code iterative decoding circuit, a parameter generation circuit, and a first control circuit. The first control circuit is configured to: receive, as parameters, a threshold and a maximum iteration count which are generated by the parameter generation circuit; and compare, when an iteration count does not reach the maximum iteration count, a non-zero-value count sequentially output from the inner code iterative decoding circuit and the threshold set for each iteration count, and stop an iterative operation by the inner code iterative decoding circuit when a result of the comparison satisfies a stopping condition set in advance.

Abstract: A jet solder bath for performing soldering by jetting molten solder to bring the molten solder into contact with a substrate is provided with a primary jet nozzle that jets the molten solder by a first jet pump, as a first jet nozzle, and a secondary jet nozzle, as a second jet nozzle, which is arranged at a downstream side of the primary jet nozzle along a carrying direction of the substrate and jets the molten solder by a second jet pump. The primary jet nozzle includes a first nozzle body, and a first solder-flow-forming plate that is provided at an upper end of the first nozzle body and has a plurality of jet holes, and the secondary jet nozzle includes a second nozzle body and a second solder-flow-forming plate that is provided at an upper end of the second nozzle body and has a plurality of jet holes.

Abstract: A jet solder bath for performing soldering by jetting molten solder to bring the molten solder into contact with a substrate is provided with a primary jet nozzle that jets the molten solder by a first jet pump, as a first jet nozzle, and a secondary jet nozzle, as a second jet nozzle, which is arranged at a downstream side of the primary jet nozzle along a carrying direction of the substrate and jets the molten solder by a second jet pump. The primary jet nozzle includes a first nozzle body, and a first solder-flow-forming plate that is provided at an upper end of the first nozzle body and has a plurality of jet holes, and the secondary jet nozzle includes a second nozzle body and a second solder-flow-forming plate that is provided at an upper end of the second nozzle body and has a plurality of jet holes.

Abstract: A semiconductor chip includes a memory cell array and a wiring layer. The memory cell array includes a plurality of blocks arranged in a first direction along a surface of the semiconductor chip. The wiring layer includes a plurality of first pattern regions at different positions along the first direction, each first pattern region including a different pattern corresponding to one or more of the blocks. The first pattern regions can be used to identify portions of the semiconductor chip during analysis or the like.

Abstract: A vehicle traveling control device includes: a communicator periodically receiving a dynamic map; a sensor management circuit collecting, from one or more sensors measuring a state of objects around a vehicle, a result of measurement representing the state of objects around the vehicle; a surrounding information comparator comparing object data represented by the dynamic map with object data represented by the result of measurement, and in response to finding mismatching object data, detecting, from the mismatching object data, data of the dynamic map representing an object within a specified range from the vehicle; and a proximity information processor setting, from the data of the dynamic map detected by the surrounding information comparator, data representing the vehicle as an avoidance non-target object in traveling control, and setting data representing an object other than the vehicle as an avoidance target object in traveling control or the avoidance non-target object.

Abstract: Provided is an error correction device including an encoding circuit configured to encode a plurality of error correction code sequences, in which the encoding circuit includes a plurality of encoding circuits connected in parallel, and is configured to execute encoding processing for the plurality of error correction code sequences through use of all the plurality of encoding circuits by adjusting an output bus width and a frequency of an operation clock with respect to a difference in transmission rate for any payloads input in one or more systems.

Abstract: Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.

Abstract: Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.

Abstract: A semiconductor chip includes a memory cell array and a wiring layer. The memory cell array includes a plurality of blocks arranged in a first direction along a surface of the semiconductor chip. The wiring layer includes a plurality of first pattern regions at different positions along the first direction, each first pattern region including a different pattern corresponding to one or more of the blocks. The first pattern regions can be used to identify portions of the semiconductor chip during analysis or the like.

Abstract: Provided is an error correction device including an encoding circuit configured to encode a plurality of error correction code sequences, in which the encoding circuit includes a plurality of encoding circuits connected in parallel, and is configured to execute encoding processing for the plurality of error correction code sequences through use of all the plurality of encoding circuits by adjusting an output bus width and a frequency of an operation clock with respect to a difference in transmission rate for any payloads input in one or more systems.

Abstract: A soldering apparatus including a flux-applying device having a nut that is fitted into the soldering apparatus and the flux-applying device can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each apparatus or device is used for a long time are adhered. The nut screws on to the screw shaft having a predetermined length. The nut is provided with at least one non-meshing part that does not mesh with the screw shaft and is formed parallel to a movement direction thereof. The non-meshing part extends from a forward end of the nut to a rear end thereof along whole length of the nut.

Abstract: Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.