Patents by Inventor Takashi Yoshie
Takashi Yoshie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9466556Abstract: A lead frame includes an outer lead and a plating layer that covers a lower surface and side surfaces of the outer lead. The plating layer does not cover the upper surface of the outer lead. A frame base material is exposed from the plating layer at the upper surface of the outer lead.Type: GrantFiled: March 21, 2014Date of Patent: October 11, 2016Assignee: Shinko Electric Industries Co., Ltd.Inventors: Harunobu Sato, Takashi Yoshie, Susumu Kurashima
-
Publication number: 20140291827Abstract: A lead frame includes an outer lead and a plating layer that covers a lower surface and side surfaces of the outer lead. The plating layer does not cover the upper surface of the outer lead. A frame base material is exposed from the plating layer at the upper surface of the outer lead.Type: ApplicationFiled: March 21, 2014Publication date: October 2, 2014Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Harunobu SATO, Takashi YOSHIE, Susumu Kurashima
-
Patent number: 8581379Abstract: A lead frame for a resin-seal type semiconductor device, which includes a semiconductor element having an electrode, a bonding wire connected to the electrode of the semiconductor element, and a sealing resin covering and sealing the semiconductor element and the bonding wire. The lead frame includes a substrate frame, a four-layer plating, and a three-layer plating. The substrate frame include leads, a connection region, which is sealed by the sealing resin and connected to the bonding wire, and an exposed region, which is not sealed by the sealing resin. A four-layer plating is applied to a portion of the substrate frame that is to be connected to the bonding wire and sealed by the sealing resin. A three-layer plating is applied to an exposed region of the substrate frame that is exposed from the sealing resin.Type: GrantFiled: March 15, 2012Date of Patent: November 12, 2013Assignee: Shinko Electric Industries Co., Ltd.Inventors: Muneaki Kure, Takashi Yoshie, Masayuki Okushi
-
Patent number: 8283759Abstract: A lead frame base is coated with a four-layer plating. The four-layer plating includes an underlayer plating (Ni), a palladium plating, a silver plating and a gold plating arranged in this order from bottom to top.Type: GrantFiled: October 19, 2006Date of Patent: October 9, 2012Assignees: Panasonic Corporation, Shinko Electric Industries Co., Ltd.Inventors: Seishi Oida, Takahiro Nakano, Yoshito Miyahara, Takashi Yoshie, Harunobu Satou, Kouichi Kadosaki, Kazumitsu Seki
-
Publication number: 20120248591Abstract: A lead frame for a resin-seal type semiconductor device, which includes a semiconductor element having an electrode, a bonding wire connected to the electrode of the semiconductor element, and a sealing resin covering and sealing the semiconductor element and the bonding wire. The lead frame includes a substrate frame, a four-layer plating, and a three-layer plating. The substrate frame include leads, a connection region, which is sealed by the sealing resin and connected to the bonding wire, and an exposed region, which is not sealed by the sealing resin. A four-layer plating is applied to a portion of the substrate frame that is to be connected to the bonding wire and sealed by the sealing resin. A three-layer plating is applied to an exposed region of the substrate frame that is exposed from the sealing resin.Type: ApplicationFiled: March 15, 2012Publication date: October 4, 2012Applicant: SHINKO ELECTRIC INDUSTRIES, CO., LTD.Inventors: Muneaki KURE, Takashi YOSHIE, Masayuki OKUSHI
-
Patent number: 7408248Abstract: A lead frame for semiconductor device is provided with an inner lead part and an outer lead part. A composite plating layer is provided on the entire plane of a base material constituting the lead frame or at least on the outer lead part. The composite plating layer includes a base layer composed of an Ni-based plating layer formed on the entire plane of the base material constituting the lead frame or at least on the outer lead part, a Pd or Pd alloy plating layer formed on an upper plane of the base layer with a thickness of 0.005-0.01 ?m, and an Au plating layer formed on an upper plane of the Pd or Pd alloy plating layer with a thickness of 0.02-0.1 ?m. The lead frame for semiconductor device has a Pd-PPF structure.Type: GrantFiled: April 19, 2005Date of Patent: August 5, 2008Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kazumitsu Seki, Takashi Yoshie, Koichi Kadosaki
-
Publication number: 20070272441Abstract: A highly reliable plated lead finishing structure for a semiconductor part using a Pd film or a Pd alloy film, instead of a traditional solder plating material, as a brazing metal, without causing a problem of short-circuits between terminals due to whiskers, is provided. In the plated lead finishing structure of the invention, when a plated film having a thickness of not larger than 0.3 ?m is formed using Pd or a Pd alloy (26), instead of a conventional solder-plating material as a brazing metal, on the surfaces of the external connection terminals (10, 12) of a semiconductor part using copper or a copper alloy-based material, the film is plated without interposing any underlying layer or any intermediate metal layer between the material and the Pd— or Pd alloy-plated layer. In some cases, Au or an Au alloy (28) is further plated and has a thickness of not larger than 0.1 ?m on the plated film.Type: ApplicationFiled: May 16, 2005Publication date: November 29, 2007Applicant: Shinko Electric Industries Co., Ltd.Inventors: Kazumitsu Seki, Takashi Yoshie, Muneaki Kure
-
Publication number: 20070090501Abstract: A lead frame base is coated with a four-layer plating. The four-layer plating includes an underlayer plating (Ni), a palladium plating, a silver plating and a gold plating arranged in this order from bottom to top.Type: ApplicationFiled: October 19, 2006Publication date: April 26, 2007Inventors: Seishi Oida, Takahiro Nakano, Yoshito Miyahara, Takashi Yoshie, Harunobu Satou, Kouichi Kadosaki, Kazumitsu Seki
-
Patent number: 7190057Abstract: A packaging component used for constituting a package mounting a semiconductor element, and a semiconductor package using the packaging component. The packaging component has on at least a portion of the surface thereof a covered surface which is sealed with an insulating resin or on which an adhesive layer is applied, and the packaging component comprises a conductor substrate and an electrically conducting layer partly or entirely covering the surface thereof, and the electrically conducting layer comprises a rough-surface plated layer having a roughened surface profile on the covered surface. The packaging component includes, for example, a lead frame and a heat-radiating or heat-dissipating plate.Type: GrantFiled: April 30, 2004Date of Patent: March 13, 2007Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kazumitsu Seki, Takashi Yoshie, Harunobu Sato, Yoshihito Miyahara
-
Publication number: 20060125073Abstract: Lead frames of a Pd-PPF structure for use in a semiconductor device comprising inner leads and outer leads, wherein a whole surface of the substrate constituting the lead frame or at least the outer leads has a composite plated layer, and the composite plated layer comprises an underlayer consisting of an Ni-based plating layer deposited on the whole surface of the substrate constituting the lead frame or on at least the outer leads, a Pd— or Pd alloy-plating layer deposited at a thickness of 0.005 to 0.01 ?m on an upper surface of the underlayer, and an Au-plating layer deposited at a thickness of 0.02 to 0.1 ?m on an upper surface of the Pd— or Pd alloy-plating layer. When a semiconductor device is mounted on a packaging substrate by using a lead-free Sn—Zn-based solder or any other lead-free solder, the wettability between the lead frame and the lead-free Sn—Zn-based solder or any other lead-free solder is improved to thereby improve the packaging property of the semiconductor device.Type: ApplicationFiled: April 19, 2005Publication date: June 15, 2006Inventors: Kazumitsu Seki, Takashi Yoshie, Koichi Kadosaki
-
Publication number: 20040232534Abstract: A packaging component used for constituting a package mounting a semiconductor element, and a semiconductor package using the packaging component. The packaging component has on at least a portion of the surface thereof a covered surface which is sealed with an insulating resin or on which an adhesive layer is applied, and the packaging component comprises a conductor substrate and an electrically conducting layer partly or entirely covering the surface thereof, and the electrically conducting layer comprises a rough-surface plated layer having a roughened surface profile on the covered surface. The packaging component includes, for example, a lead frame and a heat-radiating or heat-dissipating plate.Type: ApplicationFiled: April 30, 2004Publication date: November 25, 2004Applicant: SHINKO ELECTRIC INDUSTRIES, CO., LTD.Inventors: Kazumitsu Seki, Takashi Yoshie, Harunobu Sato, Yoshihito Miyahara
-
Patent number: 6593643Abstract: A semiconductor device lead frame made of copper or a copper alloy used for a resin sealing type semiconductor device, comprising a lead frame body made of copper or a copper alloy, a double-layer under plating film formed on the lead frame body and comprising a lower layer made of zinc or a copper-zinc alloy and an upper layer made of copper having a thickness of 0.02 to 0.4 &mgr;m and a precious metal plating film formed on at least a wire bonding portion of an inner lead of the copper upper layer of the under plating film. This lead frame is excellent in adhesion with a sealing resin, is free from contaminate a precious metal plating solution (particularly a silver plating solution), has a good appearance of the precious metal plating film, is excellent in corrosion resistance and moisture resistance, and has a good appearance and adhesion of an external solder plating film.Type: GrantFiled: December 7, 2000Date of Patent: July 15, 2003Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kazumitsu Seki, Takashi Yoshie, Harunobu Sato
-
Patent number: 6196625Abstract: The invention improves a connection portion between a guide rail and a front rail in a sliding roof apparatus and make a mounting operation easy. In the sliding roof apparatus, a gutter is supported to a protruding portion of the guide rail, a side end portion of the front rail is overlapped with a front portion of the gutter from the above, an opening thereof is opposed to a bottom wall of the gutter, and a bracket of the side end portion is fixed to the protruding portion of the guide rail.Type: GrantFiled: March 29, 1999Date of Patent: March 6, 2001Assignee: Aisin Seiki Kabushiki KaishaInventors: Youji Nagashima, Kenji Maeta, Kenichi Fukura, Akira Matsuura, Takashi Yoshie, Yasuo Oyama, Masaji Ishikawa