Patents by Inventor Takatoshi Igarashi

Takatoshi Igarashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210096354
    Abstract: An image pickup apparatus includes an image pickup module in which an image pickup device is laminated, a relay board having a plurality of flying leads which are electrically connected to a proximal end face of the image pickup module through ultrasonic wire bonding, and a plurality of cables electrically connected to a plurality of connection lands of the relay board, and a bent portion is formed on the relay board so that the plurality of cables are fitted within a projection surface of the proximal end face of the image pickup module.
    Type: Application
    Filed: September 22, 2020
    Publication date: April 1, 2021
    Applicant: OLYMPUS CORPORATION
    Inventors: Keiichi KOBAYASHI, Takatoshi IGARASHI, Takahiro SHIMOHATA
  • Publication number: 20210099620
    Abstract: An image pickup apparatus includes: a first member, in which a plurality of optical members are laminated; a second member including an image pickup device; and a third member including a spacer and a frame, a first through-hole that penetrates through the spacer and a second through-hole that has a larger sectional area in a direction that perpendicularly intersects an optical axis than a sectional area of the first through-hole and that penetrates through the frame are provided in the third member, the third member is glued to the first member, the second member is disposed in the second through-hole, and a front surface of the second member abuts on a second main surface of the spacer, and the frame is a frame body that shields light that is incident on the second through-hole from an image pickup side surface that is a side surface of the second member.
    Type: Application
    Filed: October 26, 2020
    Publication date: April 1, 2021
    Applicant: OLYMPUS CORPORATION
    Inventor: Takatoshi IGARASHI
  • Patent number: 10930696
    Abstract: An image pickup unit includes: an image pickup device; a device laminate in which a plurality of semiconductor devices are laminated; and a signal cable having a lead wire and a shield lead wire. The plurality of semiconductor devices have cutouts. A groove in parallel with an optical axis direction is configured on a side surface of the device laminate by a plurality of the cutouts which communicate with one another. On cutout surfaces of the semiconductor devices, side electrodes are arranged. The lead wire and the shield lead wire are housed in the respective cutouts which have diameters in accordance with respective diameters of the lead wire and the shield lead wire. The lead wire is bonded to the side electrode and the shield lead wire is bonded to the side electrode.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: February 23, 2021
    Assignee: OLYMPUS CORPORATION
    Inventors: Takahiro Shimohata, Takatoshi Igarashi
  • Publication number: 20200344386
    Abstract: An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.
    Type: Application
    Filed: July 9, 2020
    Publication date: October 29, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Ken YAMAMOTO, Takatoshi IGARASHI, Takuro SUYAMA, Kazuhiro YOSHIDA, Kensuke SUGA
  • Publication number: 20200333581
    Abstract: An image pickup apparatus for endoscope includes: an optical unit having an incident surface and an emitting surface; an image pickup unit adhering to the emitting surface; an interposer where the image pickup unit is bonded to a first electrode of a first main surface; and an electric cable bonded to the interposer. The image pickup unit is smaller than the optical unit and the interposer in an outer size in a direction orthogonal to an optical axis. The image pickup apparatus for endoscope further includes a heat conductive resin with which a portion among the emitting surface, the first main surface, and a side surface of the image pickup unit is filled. The first electrode extends to a position where the first electrode is brought into contact with the heat conductive resin.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Hiroshi KOBAYASHI, Takatoshi IGARASHI
  • Patent number: 10757301
    Abstract: An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: August 25, 2020
    Assignee: OLYMPUS CORPORATION
    Inventors: Ken Yamamoto, Takuro Suyama, Takahiro Shimohata, Takatoshi Igarashi, Hiroshi Kobayashi
  • Patent number: 10739576
    Abstract: An imaging apparatus includes: an optical system configured to collect incident light; an imaging element including a light receiver configured to receive light input from the optical system and perform photoelectric conversion to generate an electrical signal; and an optical system adhesive layer configured to bond the optical system to a principal surface of the imaging element where the light receiver is provided. The optical system adhesive layer is a photosensitive transparent adhesive for which patterning is performed through a photolithography process and which has a function of determining a position of the optical system relative to the light receiver.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: August 11, 2020
    Assignee: OLYMPUS CORPORATION
    Inventor: Takatoshi Igarashi
  • Patent number: 10660511
    Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: May 26, 2020
    Assignee: OLYMPUS CORPORATION
    Inventors: Takuro Suyama, Takatoshi Igarashi, Kensuke Suga, Yoshiro Nishimura
  • Patent number: 10631719
    Abstract: An endoscope includes: an imaging unit disposed at a distal end portion of an insertion section inserted into a body of a subject; and a built-in component provided parallel with the imaging unit at the distal end portion, and extending substantially parallel with an axial direction of the insertion section. The imaging unit includes: a solid state image sensor including a light receiving unit; a flexible circuit board electrically connecting the solid state image sensor; and a rigid circuit board at least partially disposed on a proximal end side of the endoscope relative to the solid state image sensor, and electrically connected to the flexible circuit board.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: April 28, 2020
    Assignees: OLYMPUS CORPORATION, PANASONIC CORPORATION
    Inventors: Hironobu Ichimura, Tomohisa Takahashi, Tomokazu Yamashita, Noriyuki Fujimori, Takatoshi Igarashi, Yoshiki Takayama
  • Patent number: 10617285
    Abstract: An imaging module includes: an image sensor; a substrate having a conductor layer and extending from the image sensor; a multi-layer substrate having therein conductor layers on the substrate; electronic components mounted on/in the multi-layer substrate; an image signal electrode pad and a drive signal electrode pad on the image sensor; an image signal cable; a drive signal cable; an image signal wiring pattern through which an image signal is transmitted from the image signal electrode pad to the image signal cable; and a drive signal wiring pattern through which a drive signal is transmitted from the drive signal cable to the drive signal electrode pad. At least one of the electronic components is embedded inside the multi-layer substrate. The image signal wiring pattern and the drive signal wiring pattern are separated into different conductor layers of the substrate and the multi-layer substrate due to the embedded electronic component.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: April 14, 2020
    Assignee: OLYMPUS CORPORATION
    Inventor: Takatoshi Igarashi
  • Patent number: 10582839
    Abstract: An image pickup unit includes: an image pickup device on which an image pickup section is formed; a circuit board having a main surface on which a connection terminal electrically connected with the image pickup section is disposed; an intermediate wiring board including a substrate, an adhesive layer and a wiring pattern, in which a first electrode of the wiring pattern is electrically connected with the connection terminal; a cable having a core wire; and a holding substrate configured to hold the core wire with a second electrode and fixed to the intermediate wiring board by the adhesive layer in a state that the core wire and the second electrode are electrically connected by being in close contact.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: March 10, 2020
    Assignee: OLYMPUS CORPORATION
    Inventor: Takatoshi Igarashi
  • Patent number: 10571680
    Abstract: An image pickup apparatus includes an optical unit in which a plurality of lenses have relative positions fixed by a transparent resin that fills spaces among the plurality of lenses, and an image pickup substrate in which a light receiving section configured to receive light that is caused to be incident from the optical unit is formed on a principal surface, the optical unit being bonded to the principal surface via an adhesive, and the optical system includes an objective optical system including a plurality of lenses, and inter-lens distances of the plurality of lenses are defined by a spacer, a diaphragm, or the transparent resin.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: February 25, 2020
    Assignee: OLYMPUS CORPORATION
    Inventor: Takatoshi Igarashi
  • Patent number: 10574866
    Abstract: An imaging unit includes: an image sensor having an electrode pad and a light-receiving surface; a flexible printed circuit board having an inner lead connected to the electrode pad and extending from the image sensor in a direction opposite to where the light-receiving surface is provided; and one or more electronic components mounted on a first surface of the flexible printed circuit board, the first surface being on a side where the image sensor is provided. The flexible printed circuit board includes: an insulating base material; a first wiring layer on the base material on a side of the first surface; a first film for insulating the first wiring layer; a second wiring layer on the base material on a side of a second surface opposite to the first surface; and a second film for insulating the second wiring layer. The inner lead extends from the first wiring layer.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: February 25, 2020
    Assignee: OLYMPUS CORPORATION
    Inventor: Takatoshi Igarashi
  • Publication number: 20200058693
    Abstract: An endoscope includes an image pickup module, and the image pickup module includes: an image pickup device an external electrode being disposed on a back surface of the image pickup device; a wiring element provided with a through-hole passing through a first main surface and a second main surface, a first electrode on the first main surface being bonded with the external electrode; a signal cable bonded with a second electrode on the second main surface of the wiring element; and a first resin that seals a first bump bonding the first electrode and the external electrode and a second bump bonding the second electrode and the signal cable, and fills the through-hole.
    Type: Application
    Filed: October 24, 2019
    Publication date: February 20, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Takuro SUYAMA, Takatoshi IGARASHI
  • Publication number: 20200046210
    Abstract: An image pickup module includes a stacked device in which a plurality of elements are stacked, adjacent elements are electrically connected together by element joints and a rear surface electrode is arranged on a rear surface, a wiring board in which a first electrode electrically connected to the rear surface electrode by a relay joint and a second electrode electrically connected to the first electrode via a relay wiring pattern are arranged, and a signal cable electrically connected to the second electrode via a cable joint, and in the stacked device, of a first region and a second region obtained by dividing the rear surface into two portions, the element joints are arranged only in a first space in which the first region is extended in an optical axis direction and the rear surface electrode is arranged only in the second region.
    Type: Application
    Filed: October 18, 2019
    Publication date: February 13, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Takatoshi IGARASHI, Takahiro SHIMOHATA, Takuro SUYAMA
  • Publication number: 20200049972
    Abstract: An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.
    Type: Application
    Filed: October 18, 2019
    Publication date: February 13, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Takatoshi IGARASHI, Takahiro SHIMOHATA, Takuro SUYAMA
  • Patent number: 10542226
    Abstract: An imaging element includes: a pixel chip where a pixel unit and a vertical selecting unit are arranged, the pixel unit including plural pixels that are arranged in a two-dimensional matrix, the pixels being configured to generate and output imaging signals; a transmission chip where at least a power source unit and a transmission unit are arranged; plural capacitative chips, each capacitative chip having capacitance functioning as a bypass condenser for a power source in the power source unit; and plural connecting portions configured to electrically connect the pixel chip, the transmission chip, and the capacitative chip respectively to another chip. The transmission chip is layered and connected at a back surface side of the pixel chip. The capacitative chips are layered and connected at a back surface side of the transmission chip. The connecting portions are arranged so as to overlap one another.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: January 21, 2020
    Assignee: OLYMPUS CORPORATION
    Inventors: Takanori Tanaka, Masashi Saito, Takatoshi Igarashi, Satoru Adachi, Katsumi Hosogai, Nana Akahane
  • Patent number: 10456022
    Abstract: An imaging device includes: a first chip including a light receiving unit, and a read circuit; a second chip including a timing control circuit, an A/D conversion circuit, and a cable transmission circuit; and a connection unit configured to connect the first and the second chips. The read circuit includes a column read circuit and a horizontal selection circuit, and a vertical selection circuit. The connection unit of the first chip is provided in a first area along a side of the rectangular light receiving unit, and in a second area adjacent to the column read circuit, the horizontal selection circuit, and the vertical selection circuit. The connection unit of the second chip is provided in a third area around the timing control circuit, the A/D conversion circuit, and the cable transmission circuit and in a fourth area adjacent to the timing control circuit and the A/D conversion circuit.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: October 29, 2019
    Assignee: OLYMPUS CORPORATION
    Inventors: Takatoshi Igarashi, Noriyuki Fujimori, Makoto Ono, Masashi Saito, Satoru Adachi, Nana Akahane, Takanori Tanaka, Katsumi Hosogai
  • Publication number: 20190274529
    Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.
    Type: Application
    Filed: May 20, 2019
    Publication date: September 12, 2019
    Applicant: OLYMPUS CORPORATION
    Inventors: Takuro SUYAMA, Takatoshi IGARASHI, Kensuke SUGA, Yoshiro NISHIMURA
  • Publication number: 20190260917
    Abstract: An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 22, 2019
    Applicant: OLYMPUS CORPORATION
    Inventors: Ken YAMAMOTO, Takuro SUYAMA, Takahiro SHIMOHATA, Takatoshi IGARASHI, Hiroshi KOBAYASHI