Patents by Inventor TAKATOSHI YOSHINO

TAKATOSHI YOSHINO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11372021
    Abstract: An electronic component handling apparatus, for handling a DUT having a temperature detection circuit and pressing the DUT against a socket electrically connected to a tester testing the DUT, includes: a temperature adjuster adjusting a temperature of the DUT; a first calculator calculating the temperature of the DUT based on a detection result of the temperature detection circuit; a temperature controller controlling the temperature adjuster; and a first receiver receiving a first signal output from the tester, a temperature control including a first temperature control based on the temperature of the DUT calculated by the first calculator and a second temperature control, and the temperature controller switching the temperature control of the DUT from the first temperature control to the second temperature control when the first receiver receives the first signal after the temperature controller starts the first temperature control.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: June 28, 2022
    Assignee: ADVANTEST Corporation
    Inventors: Takatoshi Yoshino, Hideki Ichikawa, Tse-Kun Chen
  • Patent number: 10942218
    Abstract: A load board to which a socket is mounted is electrically connected to a tester. The load board includes a first optical communication unit capable of transmitting and/or receiving signals by optical wireless communication with an electronic component handling apparatus that presses a DUT against the socket.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: March 9, 2021
    Assignee: ADVANTEST Corporation
    Inventors: Takashi Hashimoto, Keishi Oku, Hiroaki Takeuchi, Takatoshi Yoshino
  • Publication number: 20200241040
    Abstract: [Object] Provided is an electronic component handling apparatus capable of controlling a DUT temperature within an appropriate range even in a DUT in which a sudden temperature change occurs under test.
    Type: Application
    Filed: September 19, 2019
    Publication date: July 30, 2020
    Applicant: ADVANTEST Corporation
    Inventors: Takatoshi Yoshino, Hideki Ichikawa, Tse-kun Chen
  • Publication number: 20200033402
    Abstract: A load board to which a socket is mounted is electrically connected to a tester. The load board includes a first optical communication unit capable of transmitting and/or receiving signals by optical wireless communication with an electronic component handling apparatus that presses a DUT against the socket.
    Type: Application
    Filed: March 12, 2019
    Publication date: January 30, 2020
    Applicant: ADVANTEST Corporation
    Inventors: Takashi Hashimoto, Keishi Oku, Hiroaki Takeuchi, Takatoshi Yoshino
  • Publication number: 20190086468
    Abstract: Automated test equipment can generate feed-forward temperature profile information for a device under test (DUT), where the temperature data is determined from measurements performed during execution of a test pattern on the DUT, and can synchronize the temperature data and the cycles of the test pattern.
    Type: Application
    Filed: September 21, 2018
    Publication date: March 21, 2019
    Inventors: TAKATOSHI YOSHINO, DAVID ARMSTRONG, JINLEI LIU, TSE-KUN CHEN