Patents by Inventor Takatoyo Yamakami

Takatoyo Yamakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170357063
    Abstract: An optical module includes a substrate with a through-hole formed therein, an optical element member that includes a light receiving or emitting part that receives light or emits light at a position on a surface that is opposite to the substrate, the position corresponding to the through-hole, and a post that is formed of a transparent material, covers the light receiving or emitting part and is inserted into the through-hole.
    Type: Application
    Filed: April 14, 2017
    Publication date: December 14, 2017
    Applicant: FUJITSU LIMITED
    Inventors: Shuichi Takeuchi, NAOKI ISHIKAWA, TAKATOYO YAMAKAMI, Kimio Nakamura, Hiroshi Kobayashi, TETSUYA TAKAHASHI
  • Patent number: 9615464
    Abstract: A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: April 4, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Takashi Kubota, Masayuki Kitajima, Takatoyo Yamakami, Hidehiko Kira
  • Publication number: 20170020000
    Abstract: A component-mounted board includes: a substrate; an electronic component disposed over the substrate; and a conductive via formed in the substrate to be in contact with a bottom surface and a side surface of an electrode of the electronic component in a state where the electronic component is disposed over the substrate.
    Type: Application
    Filed: July 11, 2016
    Publication date: January 19, 2017
    Applicant: FUJITSU LIMITED
    Inventors: TAKATOYO YAMAKAMI, Naoki Ishikawa, Kimio Nakamura, Kenji Iida, Hiromitsu Kobayashi, Kei Fukui
  • Publication number: 20160372441
    Abstract: A semiconductor device includes: a board; a semiconductor chip that is not joined to the board; a wire whose one end is coupled with the semiconductor chip and whose other end is coupled with the board; and a first cover member that covers a first wire coupling portion in which the wire is coupled with the semiconductor chip.
    Type: Application
    Filed: May 24, 2016
    Publication date: December 22, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Hiroshi Kobayashi, Naoki Ishikawa, Shuichi Takeuchi, Takatoyo Yamakami, Kimio Nakamura, Tetsuya Takahashi
  • Patent number: 9266312
    Abstract: A bonding apparatus has a light source, a stage, a component holder formed of a light transparent material, a controller, and a driver configured to drive the stage and the component holder under the control of the controller. The component holder includes an incident surface on which light outputted from the light source is made incident, a first reflection surface which is a surface opposite to the incident surface and reflects the incident light from the incident surface, a second reflection surface which reflects the light reflected by the first reflection surface, and an exit surface from which the light reflected by the second reflection surface exits. The bonding apparatus bonds the first component and the second component together with the photo-curing adhesive while holding the second component on the side of the exit surface of the component holder.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: February 23, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Takatoyo Yamakami, Takashi Kubota, Hidehiko Kira
  • Patent number: 9195003
    Abstract: An optical unit in which an optical part having an optical element is mounted on a base having an optical waveguide includes a hydrophobic first area formed in a region including an optical axis of the optical part, a hydrophobic second area formed in a region facing the first area on a surface of the base, and a hydrophilic filler which fills peripheries of the first area and the second area between the optical part and the base.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: November 24, 2015
    Assignee: FUJITSU LIMITED
    Inventors: Takatoyo Yamakami, Takashi Kubota, Masayuki Kitajima
  • Patent number: 8861903
    Abstract: A method of manufacturing an optical waveguide device, the method includes: inserting an inclined surface of a mold which is inclined relative to a surface of a substrate including an optical waveguide member into a through hole in which the optical waveguide member is exposed from one surface side of the substrate; locating an optical component above an opening of the through hole on the other surface side of the substrate; injecting an underfill material into between the optical component and the other surface and into the through hole; and curing the underfill material to form a mirror surface.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: October 14, 2014
    Assignee: Fujitsu Limited
    Inventors: Takatoyo Yamakami, Takashi Kubota, Kuniko Ishikawa, Hidehiko Kira
  • Publication number: 20140290850
    Abstract: A bonding apparatus has a light source, a stage, a component holder formed of a light transparent material, a controller, and a driver configured to drive the stage and the component holder under the control of the controller. The component holder includes an incident surface on which light outputted from the light source is made incident, a first reflection surface which is a surface opposite to the incident surface and reflects the incident light from the incident surface, a second reflection surface which reflects the light reflected by the first reflection surface, and an exit surface from which the light reflected by the second reflection surface exits. The bonding apparatus bonds the first component and the second component together with the photo-curing adhesive while holding the second component on the side of the exit surface of the component holder.
    Type: Application
    Filed: January 13, 2014
    Publication date: October 2, 2014
    Applicant: FUJITSU LIMITED
    Inventors: TAKATOYO YAMAKAMI, TAKASHI KUBOTA, Hidehiko Kira
  • Publication number: 20140285989
    Abstract: A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material.
    Type: Application
    Filed: November 7, 2013
    Publication date: September 25, 2014
    Applicant: FUJITSU LIMITED
    Inventors: Takashi KUBOTA, Masayuki KITAJIMA, Takatoyo YAMAKAMI, Hidehiko KIRA
  • Patent number: 8720519
    Abstract: A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: May 13, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Takatoyo Yamakami, Hidehiko Kira, Takashi Kubota, Kiyoshi Oi, Kiyoaki Iida, Takashi Kurihara
  • Publication number: 20140086525
    Abstract: An optical unit in which an optical part having an optical element is mounted on a base having an optical waveguide includes a hydrophobic first area formed in a region including an optical axis of the optical part, a hydrophobic second area formed in a region facing the first area on a surface of the base, and a hydrophilic filler which fills peripheries of the first area and the second area between the optical part and the base.
    Type: Application
    Filed: July 29, 2013
    Publication date: March 27, 2014
    Applicant: FUJITSU LIMITED
    Inventors: TAKATOYO YAMAKAMI, TAKASHI KUBOTA, Masayuki KITAJIMA
  • Publication number: 20130313309
    Abstract: A conductive bonding material includes: a solder component including a metal foamed body of a first metal having at least one pore, the pore absorbs melted first metal when the metal foamed body is heated at a temperature higher than the melting point of the first metal, and a second metal having a melting point lower than the melting point of the first metal.
    Type: Application
    Filed: March 28, 2013
    Publication date: November 28, 2013
    Inventors: Masayuki KITAJIMA, Takatoyo YAMAKAMI, Takashi KUBOTA, Kuniko ISHIKAWA
  • Publication number: 20130259421
    Abstract: A method of manufacturing an optical waveguide device, the method includes: inserting an inclined surface of a mold which is inclined relative to a surface of a substrate including an optical waveguide member into a through hole in which the optical waveguide member is exposed from one surface side of the substrate; locating an optical component above an opening of the through hole on the other surface side of the substrate; injecting an underfill material into between the optical component and the other surface and into the through hole; and curing the underfill material to form a mirror surface.
    Type: Application
    Filed: December 11, 2012
    Publication date: October 3, 2013
    Applicant: FUJITSU LIMITED
    Inventors: Takatoyo YAMAKAMI, Takashi KUBOTA, Kuniko ISHIKAWA, Hidehiko KIRA
  • Patent number: 8418910
    Abstract: An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: April 16, 2013
    Assignee: Fujitsu Limited
    Inventors: Takatoyo Yamakami, Takashi Kubota, Kuniko Ishikawa, Masayuki Kitajima
  • Publication number: 20130087605
    Abstract: A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle.
    Type: Application
    Filed: August 28, 2012
    Publication date: April 11, 2013
    Applicant: FUJITSU LIMITED
    Inventors: Takashi KUBOTA, Masayuki KITAJIMA, Takatoyo YAMAKAMI, Kuniko ISHIKAWA
  • Publication number: 20120248616
    Abstract: To provide an electronic component, containing: a wiring board containing electrode pads; a component including a plurality of electrodes, the component being mounted on the wiring board; a sealing resin covering the component; and a plurality of terminals configured to connect a wiring provided within the wiring board to an external substrate, wherein the plurality of electrodes and the electrode pads are connected with solder, and wherein a first resin layer and a second resin layer are provided between the solder and the sealing resin in this order from the side of the solder, where the first resin layer has a first Young's modulus and the second resin layer has a second Young's modulus larger than the first Young's modulus.
    Type: Application
    Filed: January 30, 2012
    Publication date: October 4, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Masayuki KITAJIMA, Takatoyo Yamakami, Takashi Kubota, Kuniko Ishikawa
  • Publication number: 20120211549
    Abstract: An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.
    Type: Application
    Filed: February 7, 2012
    Publication date: August 23, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Takatoyo YAMAKAMI, Takashi KUBOTA, Kuniko ISHIKAWA, Masayuki KITAJIMA
  • Publication number: 20120043005
    Abstract: A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material.
    Type: Application
    Filed: May 27, 2011
    Publication date: February 23, 2012
    Applicants: SHINKO ELECTRIC INDUSTRIES CO., LTD., FUJITSU LIMITED
    Inventors: Takatoyo YAMAKAMI, Hidehiko KIRA, Takashi KUBOTA, Kiyoshi OI, Kiyoaki IIDA, Takashi KURIHARA
  • Publication number: 20110074020
    Abstract: A method for mounting a semiconductor device by mounting a semiconductor chip on a board by flip chip bonding, comprising: contacting an Au bump of the semiconductor chip with a Sn—Bi solder; and heating the Sn—Bi solder at a temperature which is not lower than the melting point thereof and which is not higher than 180° C. for 30 minutes or more.
    Type: Application
    Filed: September 28, 2010
    Publication date: March 31, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Takatoyo YAMAKAMI, Takashi KUBOTA, Hidehiko KIRA, Takayoshi MATSUMURA
  • Patent number: 7699235
    Abstract: A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: April 20, 2010
    Assignee: Fujitsu Limited
    Inventors: Shunji Baba, Naoki Ishikawa, Hiroshi Kobayashi, Takatoyo Yamakami, Masumi Katayama