Patents by Inventor Takaya KOUCHI

Takaya KOUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240292528
    Abstract: A wiring circuit board includes a base insulating layer, a conductive layer, and a cover insulating layer. The conductive layer has a terminal and a wiring. The wiring has a body portion and a connecting portion. The connecting portion connects the body portion to the terminal. The cover insulating layer has a cover body portion and a protruding portion. The cover body portion covers the body portion. The protruding portion covers the connecting portion. The protruding portion protrudes from the cover body portion.
    Type: Application
    Filed: February 16, 2024
    Publication date: August 29, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Takaya KOUCHI, Teppei NIINO