Patents by Inventor Takaya Wada

Takaya Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160211871
    Abstract: A high frequency power amplifier includes a first high frequency amplifier, a final high frequency amplifier, and a tunable filter. The tunable filter is connected between the first high frequency amplifier and the final high frequency amplifier. The first high frequency amplifier and the final high frequency amplifier are each a multimode/multiband power amplifier. The tunable filter is regulated such that its pass band includes the frequency band of a transmission signal and its attenuation band includes the frequency band of a reception signal in a communication band used in transmission and reception. The pass band and the attenuation band are switched by the tunable filter in accordance with the communication band used in transmission and reception.
    Type: Application
    Filed: March 25, 2016
    Publication date: July 21, 2016
    Inventors: Hidenori Obiya, Hisao Hayafuji, Takaya Wada, Shinya Hitomi
  • Publication number: 20160173056
    Abstract: An isolator includes a core isolator, a main substrate and a circuit-defining section. The main substrate includes a first wiring portion, a second wiring portion and a third wiring portion and has the core isolator and the circuit-defining section mounted thereon. An input port of the core isolator is connected to the first wiring portion. An output port of the core isolator is connected to the second wiring portion. A ground port of the core isolator is connected to the third wiring portion. In the circuit-defining section, a conductor pattern includes a capacitor that is connected in parallel with the core isolator via the first wiring portion and the second wiring portion, and an impedance element that is connected to at least either of the first wiring portion and the second wiring portion.
    Type: Application
    Filed: February 9, 2016
    Publication date: June 16, 2016
    Inventors: Kazutaka MUKAIYAMA, Kenji SAITO, Takaya WADA, Reiji NAKAJIMA, Shingo YANAGIHARA
  • Patent number: 9305958
    Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: April 5, 2016
    Assignee: SONY CORPORATION
    Inventors: Hiroki Hagiwara, Keiji Sasano, Hiroaki Tanaka, Yuki Tuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Noboru Kawabata, Hirokazu Yoshida, Hironori Yokoyama
  • Publication number: 20150372365
    Abstract: An irreversible circuit element includes first and second high pass isolators each including first and second center electrodes intersecting with and being insulated from each other on a ferrite to which a direct-current magnetic field is applied with a permanent magnet. One end of the first center electrode is an output port and the other end thereof is an input port, and one end of the second center electrode is another output port and the other end thereof is a ground port. A pass frequency band of the first isolator is higher than a pass frequency band of the second isolator. Respective output portions of the first and second isolators are electrically connected and defined as one output terminal, and a low pass filter LPF is inserted between the output terminal and the output port of the second isolator.
    Type: Application
    Filed: August 28, 2015
    Publication date: December 24, 2015
    Inventors: Takaya WADA, Yoshiki YAMADA
  • Patent number: 9088064
    Abstract: A non-reciprocal circuit element includes high-pass-type first and second isolators, which are each provided with first and second central electrodes that are arranged on a ferrite so as to cross each other while being insulated from each other, the ferrite being applied with a direct-current magnetic field by permanent magnets. One end of the first central electrode defines an input port and another end of the first central electrode defines an output port, and one end of the second central electrode defines the input port and another end of the second central electrode defines a ground port. A pass frequency band of the first isolator is higher than a pass frequency band of the second isolator. Inputs of the isolators are electrically connected to each other to define a single input terminal IN and a low-pass filter LPF is provided between the input terminal IN and the input port of the second isolator.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: July 21, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takaya Wada
  • Patent number: 9070610
    Abstract: A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.
    Type: Grant
    Filed: June 16, 2011
    Date of Patent: June 30, 2015
    Assignee: SONY CORPORATION
    Inventors: Keiji Sasano, Hiroaki Tanaka, Hiroki Hagiwara, Yuki Tsuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Hirokazu Yoshida, Noboru Kawabata, Hironori Yokoyama
  • Publication number: 20150171499
    Abstract: A non-reciprocal circuit element includes high-pass-type first and second isolators, which are each provided with first and second central electrodes that are arranged on a ferrite so as to cross each other while being insulated from each other, the ferrite being applied with a direct-current magnetic field by permanent magnets. One end of the first central electrode defines an input port and another end of the first central electrode defines an output port, and one end of the second central electrode defines the input port and another end of the second central electrode defines a ground port. A pass frequency band of the first isolator is higher than a pass frequency band of the second isolator. Inputs of the isolators are electrically connected to each other to define a single input terminal IN and a low-pass filter LPF is provided between the input terminal IN and the input port of the second isolator.
    Type: Application
    Filed: February 27, 2015
    Publication date: June 18, 2015
    Inventor: Takaya WADA
  • Publication number: 20150123234
    Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.
    Type: Application
    Filed: January 15, 2015
    Publication date: May 7, 2015
    Applicant: SONY CORPORATION
    Inventors: Hiroki HAGIWARA, Keiji SASANO, Hiroaki TANAKA, Yuki TUJI, Tsuyoshi WATANABE, Koji TSUCHIYA, Kenzo TANAKA, Takaya WADA, Noboru KAWABATA, Hirokazu YOSHIDA, Hironori YOKOYAMA
  • Patent number: 8947593
    Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: February 3, 2015
    Assignee: Sony Corporation
    Inventors: Hiroki Hagiwara, Keiji Sasano, Hiroaki Tanaka, Yuki Tuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Noboru Kawabata, Hirokazu Yoshida, Hironori Yokoyama
  • Publication number: 20140340166
    Abstract: A non-reciprocal circuit element includes a ferrite, a first central electrode and a second central electrode that are arranged on the ferrite so as to cross each other in an insulated state, and a permanent magnet configured to apply a DC magnetic field to a portion where the first and second central electrodes cross each other. One end of the first central electrode defines an input port and the other end thereof defines an output port. One end of the second central electrode defines the input port and the other end thereof defines a ground port. A resistance element and a capacitance element which are connected in parallel with each other are connected in series between the input port and the output port. A switching capacitance unit configured to switch a capacitance is connected in parallel with the resistance element between the input port and the output port.
    Type: Application
    Filed: July 31, 2014
    Publication date: November 20, 2014
    Inventor: Takaya WADA
  • Publication number: 20140218573
    Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.
    Type: Application
    Filed: April 3, 2014
    Publication date: August 7, 2014
    Applicant: SONY CORPORATION
    Inventors: Hiroki HAGIWARA, Keiji Sasano, Hiroaki Tanaka, Yuki Tuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Noboru Kawabata, Hirokazu Yoshida, Hironori Yokoyama
  • Patent number: 8711280
    Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: April 29, 2014
    Assignee: Sony Corporation
    Inventors: Hiroki Hagiwara, Keiji Sasano, Hiroaki Tanaka, Yuki Tuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Noboru Kawabata, Hirokazu Yoshida, Hironori Yokoyama
  • Publication number: 20140080431
    Abstract: A non-reciprocal circuit element includes a ferrite, a first central electrode and a second central electrode arranged on the ferrite so as to cross each other in an insulated state, and a permanent magnet that applies a DC magnetic field to a portion where the first and second central electrodes cross each other. One end of the first central electrode defines an input port, and the other end thereof defines an output port. One end of the second central electrode defines the input port, and the other end thereof defines a ground port. A resistance element and a capacitance element, which are connected in parallel with each other, are connected in series with and between the input port and the output port. Input impedance is lowered by making inductance of the second central electrode relatively large.
    Type: Application
    Filed: November 25, 2013
    Publication date: March 20, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Takaya WADA, Reiji NAKAJIMA
  • Publication number: 20130010145
    Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.
    Type: Application
    Filed: June 22, 2012
    Publication date: January 10, 2013
    Applicant: Sony Corporation
    Inventors: Hiroki Hagiwara, Keiji Sasano, Hiroaki Tanaka, Yuki Tuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Noboru Kawabata, Hirokazu Yoshida, Hironori Yokoyama
  • Patent number: 8253510
    Abstract: A non-reciprocal circuit element includes first and second isolators of a high-pass type, each of the first and second isolators including a permanent magnet, a ferrite body to which a direct-current magnetic field is applied by the permanent magnet, and first and second center electrodes arranged on the ferrite body so as to cross each other in an insulated state. The first isolator has a passing frequency band that is higher than a passing frequency band of the second isolator. The first and second isolators include input portions that are electrically connected to define a single input port. A low pass filter is provided between the input port and the input portion of the second isolator.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: August 28, 2012
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takaya Wada
  • Publication number: 20120008025
    Abstract: A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.
    Type: Application
    Filed: June 16, 2011
    Publication date: January 12, 2012
    Applicant: SONY CORPORATION
    Inventors: Keiji Sasano, Hiroaki Tanaka, Hiroki Hagiwara, Yuki Tsuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Hirokazu Yoshida, Noboru Kawabata, Hironori Yokoyama
  • Patent number: 8058945
    Abstract: A ferrite magnet device, a nonreciprocal circuit device, and a composite electronic component are provided. The ferrite magnet device includes a ferrite element having a plurality of central electrodes arranged to intersect one another in an electrically insulated state, and a pair of permanent magnets fixed to both main surfaces of the ferrite element so as to apply a direct current magnetic field to the ferrite element. The central electrodes are made of metal foils provided on both main surfaces of the ferrite element, with adhesive layers therebetween. Electrodes provided on the upper and lower surfaces of the ferrite element are formed by plating in through holes.
    Type: Grant
    Filed: June 15, 2009
    Date of Patent: November 15, 2011
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaya Wada, Atsushi Konishi
  • Publication number: 20110204989
    Abstract: A non-reciprocal circuit element includes first and second isolators of a high-pass type, each of the first and second isolators including a permanent magnet, a ferrite body to which a direct-current magnetic field is applied by the permanent magnet, and first and second center electrodes arranged on the ferrite body so as to cross each other in an insulated state. The first isolator has a passing frequency band that is higher than a passing frequency band of the second isolator. The first and second isolators include input portions that are electrically connected to define a single input port. A low pass filter is provided between the input port and the input portion of the second isolator.
    Type: Application
    Filed: February 10, 2011
    Publication date: August 25, 2011
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Takaya WADA
  • Patent number: 7834716
    Abstract: A nonreciprocal circuit device (2-port isolator) includes a ferrite-magnet assembly including a ferrite, a first center electrode, and a second center electrode. The ferrite is sandwiched between a pair of permanent magnets and receives a direct-current magnetic field applied thereto. The first and second center electrodes are arranged on the ferrite. The ferrite includes a center layer and an outer layer ensuring an insulation state of the first and second center electrodes. The saturation magnetization of the outer layer is larger than the saturation magnetization of the center layer.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: November 16, 2010
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaya Wada, Hiroaki Kikuta
  • Patent number: 7834717
    Abstract: A nonreciprocal circuit device (2-port isolator) includes a ferrite-magnet assembly including a ferrite, a first center electrode, and a second center electrode. The ferrite is sandwiched between a pair of permanent magnets and receives a direct-current magnetic field applied thereto. The first and second center electrodes are arranged on the ferrite. The ferrite includes a center layer and an outer layer ensuring an insulation state of the first and second center electrodes. The saturation magnetization of the outer layer is smaller than that of the center layer.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: November 16, 2010
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaya Wada, Hiroaki Kikuta