Patents by Inventor Takayoshi Nishi

Takayoshi Nishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6270174
    Abstract: A case for electronic equipment including a main frame having an upper wall and a lower wall, an upper fit plate slidably mounted on the upper wall, and a lower fit plate slidably mounted on the lower wall. The upper wall is formed with a plurality of equally spaced ridges, and the upper fit plate is formed with a plurality of equally spaced ridges arranged with the same pitch as that of the ridges of the upper wall. Similarly, the lower wall is formed with a plurality of equally spaced ridges, and the lower fit plate is formed with a plurality of equally spaced ridges arranged with the same pitch as that of the ridges of the lower wall. The case further includes a first fit lever pivotably mounted to the main frame so as to be operatively connected to the upper fit plate, and a second fit lever pivotably mounted to the main frame so as to be operatively connected to the lower fit plate. The first fit lever and the second fit lever are pivotably and slidably connected with each other.
    Type: Grant
    Filed: December 23, 1999
    Date of Patent: August 7, 2001
    Assignee: Fujitsu Limited
    Inventor: Takayoshi Nishi
  • Patent number: 5521429
    Abstract: A surface mount flat package for a semiconductor device includes a number of leads on a lead frame. At least one of the leads is straight with a thick section and a thin section. Part of the thin section is inside a protective medium and part extends outside. A bottom surface of the part extending outside the protective medium serves as a connection terminal for the semiconductor device. Another lead is an island lead that has a bonding island on an upper surface thereof. The island lead has a thick section and a thin section. The bonding island is on the thin section. The thin section is entirely within the protective medium. A bottom surface of the thick section is exposed outside the protective medium to serve as a connection terminal. The bottom surfaces of the thick sections are coplanar with each other and preferably coplanar with a bottom surface of the package.
    Type: Grant
    Filed: November 23, 1994
    Date of Patent: May 28, 1996
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Tsutomu Aono, Takayoshi Nishi
  • Patent number: 4474352
    Abstract: A vertical angle adjusting mechanism for use in a display device and other devices, including a support on which an object whose vertical angle is to be adjusted is mounted, the support being pivotable upward and downward, the support being provided with an engagement slot formed with a plurality of recesses; a lock element pivotally attached to the object and engaged with the engagement slot in the support; and a slide member attached to the support and engaged with the lock element for selectively exposing or covering the recesses of the engagement slot in the support for engagement, or for preventing engagement, with the lock element according to the direction of the movement of the lock element.
    Type: Grant
    Filed: September 29, 1982
    Date of Patent: October 2, 1984
    Assignee: Fujitsu Limited
    Inventor: Takayoshi Nishi