Patents by Inventor Takayoshi TAWARAGI

Takayoshi TAWARAGI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190287716
    Abstract: A transformer includes a core configured to form a magnetic circuit and including a gap in at least a part of the core; a bobbin mounted on the core; a first winding wire that is wound on the bobbin in two or more separate layers including a layer closest to the gap and a layer farther away from the gap than the layer; and a second winding wire insulated from the first winding wire, and including a layer of the second winding wire wound between the layer and the layer of the first winding wire. The layer and the layer of the first winding wire are connected in series.
    Type: Application
    Filed: September 20, 2017
    Publication date: September 19, 2019
    Applicant: OMRON Corporation
    Inventors: Takeo NISHIKAWA, Toshiyuki YOKOI, Takayoshi TAWARAGI
  • Patent number: 10381834
    Abstract: The disclosure reduces the size and cost of a power conditioner. A power conditioner including a DC/DC converter connected to a power supply device and an inverter connected to the DC/DC converter includes: a plus side wiring connecting the DC/DC converter and the inverter; a minus side wiring connecting the DC/DC converter and the inverter; a capacitor having one end connected to the plus side wiring and an other end connected to the minus side wiring; and a fuse provided on the minus side wiring, wherein the DC/DC converter has at least one switching element; the other end of the capacitor is connected to a first connection point provided on the minus side wiring on the DC/DC converter side with respect to the fuse; and the switching element is connected to a second connection point provided on the minus side wiring on the inverter side with respect to the fuse.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: August 13, 2019
    Assignee: OMRON Corporation
    Inventors: Kenji Kobayashi, Kazumi Tsuchimichi, Wataru Okada, Mamoru Yoshida, Gun Eto, Koji Fujita, Takayoshi Tawaragi
  • Patent number: 10304754
    Abstract: A heat dissipation structure of a semiconductor device is provided, the semiconductor device including: an electrical bonding surface electrically connected to a substrate; and a heat dissipation surface as an opposite side of the electrical bonding surface. The heat dissipation surface makes contact with a heat spreader via a conductive TIM while the heat spreader makes contact with a heat sink via an insulating TIM. A surface of the heat spreader facing the semiconductor device includes a recess part formed in at least one part in a vicinity of an outer periphery of the semiconductor device.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: May 28, 2019
    Assignee: OMRON Corporation
    Inventors: Takeo Nishikawa, Takayoshi Tawaragi, Eiichi Omura
  • Patent number: 10211756
    Abstract: An inverter circuit provided in a power conversion device includes a full-bridge inverter, and a short circuit part. The short circuit part includes switching elements and clamp elements connected to the switching elements. The clamp elements suppress application of an excessive voltage such as a surge voltage to the switching elements.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: February 19, 2019
    Assignee: OMRON Corporation
    Inventors: Takeo Nishikawa, Wataru Okada, Takayoshi Tawaragi, Satoshi Iwai
  • Publication number: 20190027421
    Abstract: A heat dissipation structure of a semiconductor device is provided, the semiconductor device including: an electrical bonding surface electrically connected to a substrate; and a heat dissipation surface as an opposite side of the electrical bonding surface. The heat dissipation surface makes contact with a heat spreader via a conductive TIM while the heat spreader makes contact with a heat sink via an insulating TIM. A surface of the heat spreader facing the semiconductor device includes a recess part formed in at least one part in a vicinity of an outer periphery of the semiconductor device.
    Type: Application
    Filed: January 25, 2017
    Publication date: January 24, 2019
    Applicant: OMRON Corporation
    Inventors: Takeo NISHIKAWA, Takayoshi TAWARAGI, Eiichi OMURA
  • Publication number: 20180041138
    Abstract: An inverter circuit provided in a power conversion device includes a full-bridge inverter, and a short circuit part. The short circuit part includes switching elements and clamp elements connected to the switching elements. The clamp elements suppress application of an excessive voltage such as a surge voltage to the switching elements.
    Type: Application
    Filed: October 18, 2017
    Publication date: February 8, 2018
    Applicant: OMRON Corporation
    Inventors: Takeo NISHIKAWA, Wataru OKADA, Takayoshi TAWARAGI, Satoshi IWAI