Patents by Inventor Takayuki Enomoto

Takayuki Enomoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220227217
    Abstract: An hybrid electric vehicle (HEV) drives front wheels by a motor-generator via drive shafts by use of electricity generated by an internal combustion engine (ICE). A lower portion of the internal combustion engine is locate on a front side of a lower portion of the motor-generator in the vehicle body with being distanced therefrom. A steering gearbox is placed between the internal combustion engine and the motor-generator and located on a front side of the drive shafts. According to this configuration, driving stability, steering feeling, and noise and vibration can be balanced at a high level.
    Type: Application
    Filed: May 29, 2019
    Publication date: July 21, 2022
    Applicant: Nissan Motor Co., Ltd.
    Inventors: Takayuki Miyakawa, Toshio Enomoto, Koji Tanimura, Tadashi Nagami
  • Publication number: 20220223925
    Abstract: One aspect of an invention is a power receiving apparatus, configured to be able to receive electric power from a plurality of battery units each including a processor configured to control a power feeding function, the power receiving apparatus comprising a plurality of connection portions capable of electrically connecting the plurality of battery units, wherein the plurality of connection portions are configured such that voltages supplied to the plurality of processors of the plurality of battery units have different values when the plurality of battery units are electrically connected to the connection portions
    Type: Application
    Filed: April 4, 2022
    Publication date: July 14, 2022
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Norio Kaneko, Yasuhiro Nakada, Takayuki Enomoto, Toru Yuki
  • Patent number: 11329002
    Abstract: Fabrication of an alignment mark in a semiconductor device is simplified. A semiconductor device including a semiconductor substrate, an epitaxial layer, and an alignment mark is provided. The epitaxial layer included in the semiconductor device includes a single-crystalline semiconductor that is epitaxially grown on a surface of the semiconductor substrate included in the semiconductor device. The alignment mark included in the semiconductor device is disposed between the semiconductor substrate and the epitaxial layer.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: May 10, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Teruyuki Sato, Shinichi Arakawa, Takayuki Enomoto, Yohei Chiba
  • Patent number: 11315968
    Abstract: A solid-state imaging device includes: a first photodiode made up of a first first-electroconductive-type semiconductor region formed on a first principal face side of a semiconductor substrate, and a first second-electroconductive-type semiconductor region formed within the semiconductor substrate adjacent to the first first-electroconductive-type semiconductor region; a second photodiode made up of a second first-electroconductive-type semiconductor region formed on a second principal face side of the semiconductor substrate, and a second second-electroconductive-type semiconductor region formed within the semiconductor substrate adjacent to the second first-electroconductive-type semiconductor region; and a gate electrode formed on the first principal face side of the semiconductor substrate; with impurity concentration of a connection face between the second first-electroconductive-type semiconductor region and the second second-electroconductive-type semiconductor region being equal to or greater than im
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: April 26, 2022
    Assignee: SONY CORPORATION
    Inventors: Hideo Kido, Takayuki Enomoto, Hideaki Togashi
  • Publication number: 20210115397
    Abstract: In order to improve the efficiency of inducing differentiation of pluripotent stem cells, provided is a method for promoting differentiation of pluripotent stem cells, the method including a step of culturing pluripotent stem cells in a medium, wherein the medium is a medium containing a) an insulin-like growth factor, b) an insulin analogue preparation containing no zinc, c) an insulin analogue preparation containing a low concentration of zinc, or d) a compound exhibiting an insulin-like action.
    Type: Application
    Filed: April 25, 2019
    Publication date: April 22, 2021
    Applicants: TOKYO INSTITUTE OF TECHNOLOGY, Ajinomoto Co., Inc.
    Inventors: Shoen KUME, Nobuaki SHIRAKI, Akira CHIBA, Takayuki ENOMOTO
  • Publication number: 20200303317
    Abstract: Fabrication of an alignment mark in a semiconductor device is simplified. A semiconductor device including a semiconductor substrate, an epitaxial layer, and an alignment mark is provided. The epitaxial layer included in the semiconductor device includes a single-crystalline semiconductor that is epitaxially grown on a surface of the semiconductor substrate included in the semiconductor device. The alignment mark included in the semiconductor device is disposed between the semiconductor substrate and the epitaxial layer.
    Type: Application
    Filed: July 24, 2018
    Publication date: September 24, 2020
    Inventors: TERUYUKI SATO, SHINICHI ARAKAWA, TAKAYUKI ENOMOTO, YOHEI CHIBA
  • Publication number: 20200286936
    Abstract: The present technology reduces influence of a crystal defect which has occurred on a semiconductor substrate in the vicinity of an element isolation region. A semiconductor device includes a semiconductor element region, an element isolation region and a high-concentration impurity region. The semiconductor element region is disposed on a surface of the semiconductor substrate. An element isolation region is formed in a predetermined depth from the surface of the semiconductor substrate and isolates the semiconductor element region. The high-concentration impurity region is constituted to have impurity concentration higher than impurity concentration of the semiconductor substrate, is disposed between the semiconductor element region and the element isolation region, and is not disposed below the element isolation region.
    Type: Application
    Filed: October 15, 2018
    Publication date: September 10, 2020
    Inventor: TAKAYUKI ENOMOTO
  • Patent number: 10748949
    Abstract: A solid-state imaging device, method for producing solid-state imaging device and electronic apparatus are provided. The solid-state imaging device includes a substrate, with a plurality of pixels formed in the substrate. In addition, a plurality of groups are formed in the substrate, and in particular in pixel isolation regions between adjacent pixels. The grooves extend from a first surface of the substrate towards a second surface of the substrate. An embedded film extends into the grooves. At least some of the grooves include a first stage near the first surface of the substrate and a second stage near the second surface of the substrate that are defined by walls of the grooves, wherein the first stage is wider than the second stage, and wherein a step is present between the first and second stages. In addition, the device includes a light shielding film adjacent the first surface of the substrate that overlies the grooves.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: August 18, 2020
    Assignee: Sony Corporation
    Inventors: Takayuki Enomoto, Yoshiki Ebiko
  • Patent number: 10622396
    Abstract: A solid-state imaging device includes a plurality of photoelectric conversion portions each provided in a semiconductor substrate and receives incident light through a light sensing surface, and a pixel separation portion provided to electrically separate a plurality of pixels. At least a pinning layer and a light shielding layer are provided in an inner portion of a trench provided on a side portion of each of the photoelectric conversion portions in an incident surface side, the trench includes a first trench and a second trench formed to be wider than the first trench in a portion shallower than the first trench, the pinning layer is formed in an inner portion of the first trench to cover an inside surface of the second trench, and the light shielding layer is formed to bury an inner portion of the second trench at least via the pinning layer.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: April 14, 2020
    Assignee: SONY CORPORATION
    Inventor: Takayuki Enomoto
  • Publication number: 20200001729
    Abstract: A working machine is provided which can suppress the adhesion of rain water, snow, and melting snow to an electrical connecting portion between a battery containing portion side and a battery side. An electrically driven snowplow as a working machine includes a battery pack incorporating a battery, a battery containing portion disposed so as to allow the battery pack to be inserted and removed in a direction inclined from a vertical direction, and an electrode portion configured to be connected with an output terminal of a battery disposed on an upper surface of the battery containing portion.
    Type: Application
    Filed: May 29, 2019
    Publication date: January 2, 2020
    Inventors: Wataru Matsuyama, Takayuki Enomoto, Makoto Yamanaka
  • Patent number: 10504953
    Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: December 10, 2019
    Assignee: Sony Corporation
    Inventors: Takeshi Yanagita, Itaru Oshiyama, Takayuki Enomoto, Harumi Ikeda, Shinichiro Izawa, Atsuhiko Yamamoto, Kazunobu Ota
  • Patent number: 10418404
    Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: September 17, 2019
    Assignee: Sony Corporation
    Inventors: Takeshi Yanagita, Itaru Oshiyama, Takayuki Enomoto, Harumi Ikeda, Shinichiro Izawa, Atsuhiko Yamamoto, Kazunobu Ota
  • Publication number: 20190206911
    Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.
    Type: Application
    Filed: March 7, 2019
    Publication date: July 4, 2019
    Applicant: SONY CORPORATION
    Inventors: Takeshi YANAGITA, Itaru OSHIYAMA, Takayuki ENOMOTO, Harumi IKEDA, Shinichiro IZAWA, Atsuhiko YAMAMOTO, Kazunobu OTA
  • Publication number: 20190172858
    Abstract: A solid-state imaging device includes a plurality of photoelectric conversion portions each provided in a semiconductor substrate and receives incident light through a light sensing surface, and a pixel separation portion provided to electrically separate a plurality of pixels. At least a pinning layer and a light shielding layer are provided in an inner portion of a trench provided on a side portion of each of the photoelectric conversion portions in an incident surface side, the trench includes a first trench and a second trench formed to be wider than the first trench in a portion shallower than the first trench, the pinning layer is formed in an inner portion of the first trench to cover an inside surface of the second trench, and the light shielding layer is formed to bury an inner portion of the second trench at least via the pinning layer.
    Type: Application
    Filed: January 30, 2019
    Publication date: June 6, 2019
    Inventor: Takayuki Enomoto
  • Publication number: 20190165023
    Abstract: A solid-state imaging device, method for producing solid-state imaging device and electronic apparatus are provided. The solid-state imaging device includes a substrate, with a plurality of pixels formed in the substrate. In addition, a plurality of groups are formed in the substrate, and in particular in pixel isolation regions between adjacent pixels. The grooves extend from a first surface of the substrate towards a second surface of the substrate. An embedded film extends into the grooves. At least some of the grooves include a first stage near the first surface of the substrate and a second stage near the second surface of the substrate that are defined by walls of the grooves, wherein the first stage is wider than the second stage, and wherein a step is present between the first and second stages. In addition, the device includes a light shielding film adjacent the first surface of the substrate that overlies the grooves.
    Type: Application
    Filed: February 1, 2019
    Publication date: May 30, 2019
    Inventors: Takayuki ENOMOTO, Yoshiki EBIKO
  • Patent number: 10229947
    Abstract: A solid-state imaging device, method for producing solid-state imaging device and electronic apparatus are provided. The solid-state imaging device includes a substrate, with a plurality of pixels formed in the substrate. In addition, a plurality of groups are formed in the substrate, and in particular in pixel isolation regions between adjacent pixels. The grooves extend from a first surface of the substrate towards a second surface of the substrate. An embedded film extends into the grooves. At least some of the grooves include a first stage near the first surface of the substrate and a second stage near the second surface of the substrate that are defined by walls of the grooves, wherein the first stage is wider than the second stage, and wherein a step is present between the first and second stages. In addition, the device includes a light shielding film adjacent the first surface of the substrate that overlies the grooves.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: March 12, 2019
    Assignee: Sony Corporation
    Inventors: Takayuki Enomoto, Yoshiki Ebiko
  • Patent number: 10211247
    Abstract: A solid-state imaging device includes a plurality of photoelectric conversion portions each provided in a semiconductor substrate and receives incident light through a light sensing surface, and a pixel separation portion provided to electrically separate a plurality of pixels. At least a pinning layer and a light shielding layer are provided in an inner portion of a trench provided on a side portion of each of the photoelectric conversion portions in an incident surface side, the trench includes a first trench and a second trench formed to be wider than the first trench in a portion shallower than the first trench, the pinning layer is formed in an inner portion of the first trench to cover an inside surface of the second trench, and the light shielding layer is formed to bury an inner portion of the second trench at least via the pinning layer.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: February 19, 2019
    Assignee: Sony Corporation
    Inventor: Takayuki Enomoto
  • Publication number: 20190027520
    Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.
    Type: Application
    Filed: September 13, 2018
    Publication date: January 24, 2019
    Applicant: SONY CORPORATION
    Inventors: Takeshi YANAGITA, Itaru OSHIYAMA, Takayuki ENOMOTO, Harumi IKEDA, Shinichiro IZAWA, Atsuhiko YAMAMOTO, Kazunobu OTA
  • Patent number: 10128291
    Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: November 13, 2018
    Assignee: Sony Corporation
    Inventors: Takeshi Yanagita, Itaru Oshiyama, Takayuki Enomoto, Harumi Ikeda, Shinichiro Izawa, Atsuhiko Yamamoto, Kazunobu Ota
  • Patent number: 10096638
    Abstract: The present technology relates to a solid-state imaging device, manufacturing method of a solid-state imaging device, and an electronic device, which can provide a solid-state imaging device having further improved features such as reduced optical color mixing and the like. Also, an electronic device using the solid-state imaging device thereof is provided. According to a solid-state imaging device having a substrate and multiple photoelectric converters that are formed on the substrate, an insulating film forms an embedded element separating unit. The element separating unit is configured of an insulating film having a fixed charge that is formed so as to coat the inner wall face of a groove portion, within the groove portion which is formed in the depth direction from the light input side of the substrate.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: October 9, 2018
    Assignee: Sony Corporation
    Inventors: Takeshi Yanagita, Itaru Oshiyama, Takayuki Enomoto, Harumi Ikeda, Shinichiro Izawa, Atsuhiko Yamamoto, Kazunobu Ota