Patents by Inventor Takayuki Masada

Takayuki Masada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11254029
    Abstract: A wafer dividing apparatus for dividing a wafer stuck to an adhesive tape and supported at an opening of a frame into individual chips along a scheduled division line is provided. The wafer dividing apparatus includes a cassette table movable upwardly and downwardly in a Z axis direction, a first carry-out/in unit that carries out the frame from the cassette placed on the cassette table or carry in the frame to the cassette, a first temporary receiving unit including a pair of first guide rails extending in the X axis direction and a guide rail opening/closing portion that increases the distance between the pair of first guide rails, a reversing unit including a holding portion that holds the frame and rotates by 180 degrees to reverse the front and back of the frame, and a transport unit that moves the reversed frame.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: February 22, 2022
    Assignee: DISCO CORPORATION
    Inventors: Takayuki Masada, Yoshihiro Kawaguchi, Tomohito Matsuda, Yuhei Fujii, Susumu Inakazu, Ryota Saito, Naoya Takesue, Hideaki Ishida
  • Publication number: 20210028063
    Abstract: An expanding method includes a frame securing step of securing an annular frame of a workpiece unit with frame securing means, an expanding step of, after the frame securing step, pressing a portion of an expandable sheet that lies between an outer circumferential edge of the workpiece and an inner circumferential edge of the annular frame, with an expanding drum to expand the expandable sheet, and a heating step of, after the expanding step, heating and shrinking a slackening portion of the expandable sheet which has been formed by expansion of the expandable sheet. The heating step includes a fully circumferential heating step of heating a full outer circumferential portion of the workpiece and an additional heating step of additionally heating a local area of the full outer circumferential portion of the workpiece.
    Type: Application
    Filed: July 8, 2020
    Publication date: January 28, 2021
    Inventors: Jinyan ZHAO, Takayuki MASADA
  • Publication number: 20200171707
    Abstract: A wafer dividing apparatus for dividing a wafer stuck to an adhesive tape and supported at an opening of a frame into individual chips along a scheduled division line is provided. The wafer dividing apparatus includes a cassette table movable upwardly and downwardly in a Z axis direction, a first carry-out/in unit that carries out the frame from the cassette placed on the cassette table or carry in the frame to the cassette, a first temporary receiving unit including a pair of first guide rails extending in the X axis direction and a guide rail opening/closing portion that increases the distance between the pair of first guide rails, a reversing unit including a holding portion that holds the frame and rotates by 180 degrees to reverse the front and back of the frame, and a transport unit that moves the reversed frame.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 4, 2020
    Inventors: Takayuki MASADA, Yoshihiro KAWAGUCHI, Tomohito MATSUDA, Yuhei FUJII, Susumu INAKAZU, Ryota SAITO, Naoya TAKESUE, Hideaki ISHIDA
  • Patent number: 9453820
    Abstract: A crack and thickness detecting apparatus for detecting a crack in a wafer and also detecting the thickness of the wafer. The apparatus includes an ultrasonic oscillating unit oscillating a first ultrasonic wave toward the upper surface of the wafer at a predetermined incident angle, an ultrasonic oscillating and receiving unit oscillating a second ultrasonic wave toward the upper surface of the wafer in a direction perpendicular thereto and also receiving reflected waves obtained by the reflection of the first and second ultrasonic waves from the wafer, a crack determining unit determining whether or not the crack is present in the wafer according to the first reflected wave, and a thickness calculating unit calculating the thickness of the wafer according to the second reflected wave. The ultrasonic oscillating and receiving unit alternately receives the first reflected wave and the second reflected wave.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: September 27, 2016
    Assignee: DISCO CORPORATION
    Inventor: Takayuki Masada
  • Publication number: 20150027227
    Abstract: A crack and thickness detecting apparatus for detecting a crack in a wafer and also detecting the thickness of the wafer. The apparatus includes an ultrasonic oscillating unit oscillating a first ultrasonic wave toward the upper surface of the wafer at a predetermined incident angle, an ultrasonic oscillating and receiving unit oscillating a second ultrasonic wave toward the upper surface of the wafer in a direction perpendicular thereto and also receiving reflected waves obtained by the reflection of the first and second ultrasonic waves from the wafer, a crack determining unit determining whether or not the crack is present in the wafer according to the first reflected wave, and a thickness calculating unit calculating the thickness of the wafer according to the second reflected wave. The ultrasonic oscillating and receiving unit alternately receives the first reflected wave and the second reflected wave.
    Type: Application
    Filed: July 24, 2014
    Publication date: January 29, 2015
    Inventor: Takayuki Masada