Abstract: A high-frequency module includes an antenna terminal and an input terminal. A second switch is connected between the antenna terminal and the input terminal, and a power amplifier is connected between the second switch and the input terminal. A mounting substrate has a first main surface and a second main surface on opposite sides of the mounting surface. The power amplifier includes a driver stage amplifier and an output stage amplifier. The driver stage amplifier and the second switch are arranged on the second main surface of the mounting substrate, and the output stage amplifier is arranged on the first main surface of the mounting substrate. The driver stage amplifier and the second switch are included in one semiconductor chip.

Abstract: A high-frequency module includes an antenna terminal and an input terminal. A second switch is connected between the antenna terminal and the input terminal, and a power amplifier is connected between the second switch and the input terminal. A mounting substrate has a first main surface and a second main surface on opposite sides of the mounting surface. The power amplifier includes a driver stage amplifier and an output stage amplifier. The driver stage amplifier and the second switch are arranged on the second main surface of the mounting substrate, and the output stage amplifier is arranged on the first main surface of the mounting substrate. The driver stage amplifier and the second switch are included in one semiconductor chip.

Abstract: A radio-frequency module includes a mounting substrate, a power amplifier, and a controller. The mounting substrate has first and second main surfaces opposing each other. The power amplifier is disposed on one of the first and second main surfaces (the first main surface, for example) of the mounting substrate. The controller is disposed on the other one of the first and second main surfaces (the second main surface, for example) of the mounting substrate. The controller controls the power amplifier.

Abstract: A radio-frequency module includes a mounting substrate, plural external connecting terminals, a power amplifier, and a controller. The mounting substrate has first and second main surfaces on opposite sides of the mounting substrate. The plural external connecting terminals are disposed on the second main surface of the mounting substrate. The power amplifier is disposed on one of the first and second main surfaces of the mounting substrate. The controller is disposed on the second main surface of the mounting substrate. The plural external connecting terminals include a control terminal. The controller is configured to control the power amplifier based on a control signal obtained via the control terminal.

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a transmission signal; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier and the PA control circuit are stacked on the first principal surface, and the first circuit component is disposed on the second principal surface.

Abstract: An electronic device 10 includes an image-capturing unit 11, a line-of-sight detector 12, and a controller 14. The image-capturing unit 11 generates an image corresponding to a view by performing image capturing. The line-of-sight detector 12 detects a line of sight of a subject with respect to the view. The controller 14 determines, based on the image, the reliability of the image as a source of estimation of the degree of concentration of the subject. The controller 14 estimates the degree of concentration of the subject based on the reliability, the image, and the line of sight.

Abstract: An electronic device 10 includes an image-capturing unit 11, a line-of-sight detector 12, and a controller 14. The controller 14 functions as a low-concentration heat map group estimator 15 and a high-concentration heat map estimator 16. The low-concentration heat map group estimator 15 can estimate a low-concentration heat map group based on an image. The high-concentration heat map estimator 16 can estimate a high-concentration heat map based on the image. The controller 14 calculates the degree of concentration of a subject based on the low-concentration heat map group, the high-concentration heat map, and a line of sight of the subject. The low-concentration heat map group estimator 15 is constructed using learning data obtained by machine learning the relationship between learning images and lines of sight for each load factor.

Abstract: An electronic device 10 includes an imaging unit 11, a gaze-line detector 12, and a controller 14. The imaging unit 11 is configured to create at least one image corresponding to a view by image capturing. The gaze-line detector is configured to detect a gaze line of a subject, the gaze line being directed to the view. The controller 14 is configured to serve as a first inference unit 15 and a second inference unit 16. The first inference unit 15 is capable of inferring a gaze-line prediction map based on the at least one image. The second inference unit 16 is capable of inferring biological information regarding an alertness level of the subject based on the gaze-line prediction map and the gaze line of the subject.

Abstract: A high-frequency module includes an antenna terminal and an input terminal. A second switch is connected between the antenna terminal and the input terminal, and a power amplifier is connected between the second switch and the input terminal. A mounting substrate has a first main surface and a second main surface on opposite sides of the mounting surface. The power amplifier includes a driver stage amplifier and an output stage amplifier. The driver stage amplifier and the second switch are arranged on the second main surface of the mounting substrate, and the output stage amplifier is arranged on the first main surface of the mounting substrate. The driver stage amplifier and the second switch are included in one semiconductor chip.

Abstract: An electronic device 10 includes an image-capturing unit 11, a line-of-sight detector 12, and a controller 14. The image-capturing unit 11 generates an image corresponding to a view by performing image capturing. The line-of-sight detector detects a line of sight of a subject with respect to the view. The controller 14 estimates an alertness level of the subject based on an image and a line of sight. The controller 14 functions as an estimator. The estimator is constructed based on learning data obtained by machine learning a relationship between a learning image, a line of sight of a training subject with respect to the learning image, and biological information relating to an alertness level of the training subject.

Abstract: An electronic device 10 includes an image-capturing unit 11, a line-of-sight detector 12, and a controller 14. The image-capturing unit 11 generates an image corresponding to the view by performing image capturing. The line-of-sight detector detects a line of sight of a subject with respect to the view. The controller 14 functions as a first estimator 15. The first estimator 15 is capable of estimating a first heat map based on the image. The controller 14 calculates the alertness level of the subject based on the first heat map and the line of sight of the subject. The first estimator 15 is constructing using learning data obtained by machine learning the relationship between a learning image and a line of sight of a training subject when an alertness level of the training subject is in a first range.

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a transmission signal; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier and the PA control circuit are stacked on the first principal surface, and the first circuit component is disposed on the second principal surface.

Abstract: To achieve miniaturization, a high-frequency module includes a mounting substrate, a power amplifier, and an electronic component. The mounting substrate has a first main surface and a second main surface on opposite sides. The power amplifier is arranged on a mounting substrate. The power amplifier has a driver stage amplifier and an output stage amplifier. The driver stage amplifier is arranged on the second main surface of the mounting substrate. The output stage amplifier is arranged on the first main surface of the mounting substrate. The electronic component is arranged on the first main surface of the mounting substrate. The electronic component overlaps the driver stage amplifier in a plan view from a thickness direction of the mounting substrate.

Abstract: A radio frequency module is capable of at least one of simultaneously transmitting, simultaneously receiving, or simultaneously transmitting and receiving a radio frequency signal of a first communication band and a radio frequency signal of a second communication band. The radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a first duplexer having, as pass bands, a transmission band and a reception band of the first communication band; and a second duplexer having, as pass bands, a transmission band and a reception band of the second communication band. The first duplexer is disposed on the first principal surface and the second duplexer is disposed on the second principal surface.

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a transmission signal; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier and the PA control circuit are stacked on the first principal surface, and the first circuit component is disposed on the second principal surface.

Abstract: A radio frequency module includes a module board; a first semiconductor device containing a first power amplifier and a second power amplifier; and a second semiconductor device containing a first switch, the first switch including a first terminal connected to the first power amplifier and a second terminal connected to the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board. An aspect of such a radio frequency module is that it is possible to achieve a compact form factor, although still provide RF transmit and receive capability. The RF module also includes external-connection terminals and a LNA, and the first semiconductor device and the low noise amplifier are disposed on mutually opposite surfaces of the module board.

Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission power amplifier configured to amplify a transmission signal; a first switch; and a first inductor included in a matching circuit connected between an output terminal of the transmission power amplifier and the first switch. The first inductor is disposed on the first principal surface, and the first switch is disposed on the second principal surface.

Abstract: A radio frequency module includes: a module board; a first semiconductor device containing a first power amplifier and a second power amplifier, the first power amplifier being configured to amplify a radio frequency signal of a first communication band, the second power amplifier being configured to amplify a radio frequency signal of a second communication band, the second communication band being different from the first communication band; and a second semiconductor device containing a control circuit configured to control the first power amplifier and the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board.

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a transmission signal; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier and the PA control circuit are stacked on the first principal surface, and the first circuit component is disposed on the second principal surface.

Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board, a transmission input terminal, an antenna connection terminal, and a transmission power amplifier. At least one of one or more first circuit components that are disposed on a transmission input path connecting the transmission input terminal and the transmission power amplifier is mounted on the first principal surface, and at least one of one or more second circuit components that are disposed on a first transmission output path or a second transmission output path each connecting an output terminal of the transmission power amplifier and the antenna connection terminal is mounted on the second principal surface.