Patents by Inventor Takayuki Shinozaki
Takayuki Shinozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11336315Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides of the module board, a transmission power amplifier connected to a transmission path, a first circuit component connected to a reception path, and a control circuit that controls the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.Type: GrantFiled: September 16, 2020Date of Patent: May 17, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takayuki Shinozaki, Yukiya Yamaguchi, Morio Takeuchi, Yoichi Sawada
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Patent number: 11323142Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a diplexer connected to the antenna connection terminal and including at least a first inductor which is a chip inductor; a transmission power amplifier; and a first circuit component disposed on a transmission path connecting the diplexer and the transmission power amplifier. The first inductor is disposed on the first principal surface, and one of the transmission power amplifier and the first circuit component is disposed on the second principal surface.Type: GrantFiled: September 14, 2020Date of Patent: May 3, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yoichi Sawada, Takayuki Shinozaki, Yukiya Yamaguchi
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Patent number: 11310355Abstract: A radio frequency module that simultaneously receives a first reception signal and a second reception signal includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a first reception low noise amplifier that is disposed in a first semiconductor IC and amplifies the first reception signal; a second reception low noise amplifier that is disposed in a second semiconductor IC different from the first semiconductor IC and amplifies the second reception signal; and an external-connection terminal that is disposed on the second principal surface. At least one of the first semiconductor IC or the second semiconductor IC is disposed on the second principal surface.Type: GrantFiled: September 15, 2020Date of Patent: April 19, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Takayuki Shinozaki
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Publication number: 20220094308Abstract: A radio-frequency module includes a mounting substrate, a power amplifier, and a controller. The mounting substrate has first and second main surfaces opposing each other. The power amplifier is disposed on one of the first and second main surfaces (the first main surface, for example) of the mounting substrate. The controller is disposed on the other one of the first and second main surfaces (the second main surface, for example) of the mounting substrate. The controller controls the power amplifier.Type: ApplicationFiled: December 2, 2021Publication date: March 24, 2022Applicant: Murata Manufacturing Co., Ltd.Inventors: Takayuki SHINOZAKI, Shigeru TSUCHIDA
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Publication number: 20220094373Abstract: A radio-frequency module includes a mounting substrate, plural external connecting terminals, a power amplifier, and a controller. The mounting substrate has first and second main surfaces on opposite sides of the mounting substrate. The plural external connecting terminals are disposed on the second main surface of the mounting substrate. The power amplifier is disposed on one of the first and second main surfaces of the mounting substrate. The controller is disposed on the second main surface of the mounting substrate. The plural external connecting terminals include a control terminal. The controller is configured to control the power amplifier based on a control signal obtained via the control terminal.Type: ApplicationFiled: December 2, 2021Publication date: March 24, 2022Applicant: Murata Manufacturing Co., Ltd.Inventors: Shigeru TSUCHIDA, Takayuki SHINOZAKI
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Patent number: 11239868Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof, a transmission power amplifier, a control circuit that controls the transmission power amplifier, and a first inductor connected to an output terminal of the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first inductor is disposed on the second principal surface.Type: GrantFiled: September 10, 2020Date of Patent: February 1, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takayuki Shinozaki, Yukiya Yamaguchi, Morio Takeuchi, Yoichi Sawada
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Publication number: 20210336642Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface; a first power amplifier; a second power amplifier; a first output transformer connected to the first power amplifier; and a second output transformer connected to the second power amplifier. The first power amplifier and the second power amplifier are disposed on the first principal surface. The first output transformer and the second output transformer are disposed inside the module board or on the second principal surface.Type: ApplicationFiled: April 19, 2021Publication date: October 28, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Naoya MATSUMOTO, Takayuki SHINOZAKI
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Publication number: 20210306017Abstract: A radio frequency module includes: a module board; a first semiconductor device containing a first power amplifier and a second power amplifier, the first power amplifier being configured to amplify a radio frequency signal of a first communication band, the second power amplifier being configured to amplify a radio frequency signal of a second communication band, the second communication band being different from the first communication band; and a second semiconductor device containing a control circuit configured to control the first power amplifier and the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board.Type: ApplicationFiled: March 24, 2021Publication date: September 30, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Naoya MATSUMOTO, Takayuki SHINOZAKI
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Publication number: 20210306018Abstract: A radio frequency module includes: a module board; a first semiconductor device containing a first power amplifier and a second power amplifier; and a second semiconductor device containing a first switch, the first switch including a first terminal connected to the first power amplifier and a second terminal connected to the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board.Type: ApplicationFiled: March 24, 2021Publication date: September 30, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Naoya MATSUMOTO, Takayuki SHINOZAKI
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Publication number: 20210288679Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a transmission signal; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier and the PA control circuit are stacked on the first principal surface, and the first circuit component is disposed on the second principal surface.Type: ApplicationFiled: March 1, 2021Publication date: September 16, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Yoichi SAWADA, Takayuki SHINOZAKI
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Publication number: 20210203366Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.Type: ApplicationFiled: March 11, 2021Publication date: July 1, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Takayuki SHINOZAKI, Yukiya YAMAGUCHI, Morio TAKEUCHI, Yoichi SAWADA
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Patent number: 10979087Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.Type: GrantFiled: September 16, 2020Date of Patent: April 13, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takayuki Shinozaki, Yukiya Yamaguchi, Morio Takeuchi, Yoichi Sawada
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Publication number: 20210091797Abstract: A radio frequency module is capable of at least one of simultaneously transmitting, simultaneously receiving, or simultaneously transmitting and receiving a radio frequency signal of a first communication band and a radio frequency signal of a second communication band. The radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a first duplexer having, as pass bands, a transmission band and a reception band of the first communication band; and a second duplexer having, as pass bands, a transmission band and a reception band of the second communication band. The first duplexer is disposed on the first principal surface and the second duplexer is disposed on the second principal surface.Type: ApplicationFiled: September 16, 2020Publication date: March 25, 2021Applicant: Murata Manufacturing Co., Ltd.Inventor: Takayuki SHINOZAKI
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Publication number: 20210091807Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides of the module board, a transmission power amplifier connected to a transmission path, a first circuit component connected to a reception path, and a control circuit that controls the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.Type: ApplicationFiled: September 16, 2020Publication date: March 25, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Takayuki SHINOZAKI, Yukiya YAMAGUCHI, Morio TAKEUCHI, Yoichi SAWADA
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Publication number: 20210092209Abstract: A radio frequency module that simultaneously receives a first reception signal and a second reception signal includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a first reception low noise amplifier that is disposed in a first semiconductor IC and amplifies the first reception signal; a second reception low noise amplifier that is disposed in a second semiconductor IC different from the first semiconductor IC and amplifies the second reception signal; and an external-connection terminal that is disposed on the second principal surface. At least one of the first semiconductor IC or the second semiconductor IC is disposed on the second principal surface.Type: ApplicationFiled: September 15, 2020Publication date: March 25, 2021Applicant: Murata Manufacturing Co., Ltd.Inventor: Takayuki SHINOZAKI
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Publication number: 20210091802Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a diplexer connected to the antenna connection terminal and including at least a first inductor which is a chip inductor; a transmission power amplifier; and a first circuit component disposed on a transmission path connecting the diplexer and the transmission power amplifier. The first inductor is disposed on the first principal surface, and one of the transmission power amplifier and the first circuit component is disposed on the second principal surface.Type: ApplicationFiled: September 14, 2020Publication date: March 25, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Yoichi SAWADA, Takayuki SHINOZAKI, Yukiya YAMAGUCHI
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Publication number: 20210092213Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board, a transmission input terminal, an antenna connection terminal, and a transmission power amplifier. At least one of one or more first circuit components that are disposed on a transmission input path connecting the transmission input terminal and the transmission power amplifier is mounted on the first principal surface, and at least one of one or more second circuit components that are disposed on a first transmission output path or a second transmission output path each connecting an output terminal of the transmission power amplifier and the antenna connection terminal is mounted on the second principal surface.Type: ApplicationFiled: September 15, 2020Publication date: March 25, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Takayuki SHINOZAKI, Yoichi SAWADA
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Publication number: 20210091801Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof, a transmission power amplifier, a control circuit that controls the transmission power amplifier, and a first inductor connected to an output terminal of the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first inductor is disposed on the second principal surface.Type: ApplicationFiled: September 10, 2020Publication date: March 25, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Takayuki SHINOZAKI, Yukiya YAMAGUCHI, Morio TAKEUCHI, Yoichi SAWADA
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Publication number: 20210091800Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission power amplifier configured to amplify a transmission signal; a first switch; and a first inductor included in a matching circuit connected between an output terminal of the transmission power amplifier and the first switch. The first inductor is disposed on the first principal surface, and the first switch is disposed on the second principal surface.Type: ApplicationFiled: September 1, 2020Publication date: March 25, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Yoichi SAWADA, Takayuki SHINOZAKI, Yukiya YAMAGUCHI
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Publication number: 20210091796Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.Type: ApplicationFiled: September 16, 2020Publication date: March 25, 2021Applicant: Murata Manufacturing Co., Ltd.Inventors: Takayuki SHINOZAKI, Yukiya YAMAGUCHI, Morio TAKEUCHI, Yoichi SAWADA