Patents by Inventor Takeaki Saiki

Takeaki Saiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110040000
    Abstract: A bis[tri(hydroxypolyalkyleneoxy)silylalkyl] polysulfide, i.e., a polysulfide that contains bonded hydroxypolyalkyleneoxy groups instead of alkoxy groups in the bis(trialkoxysilylalkyl) polysulfide; a method of manufacturing of the aforementioned polysulfide by heating a bis(trialkoxysilylalkyl) polysulfide and a polyalkyleneglycol; a tire rubber additive to a tire rubber composition that comprises a bis[tri(hydroxypolyalkyleneoxy)silylalkyl] polysulfide alone or a mixture of bis[tri(hydroxypolyalkyleneoxy)silylalkyl] polysulfide and a polyalkyleneglycol; and a tire rubber composition that contains the aforementioned additive.
    Type: Application
    Filed: December 28, 2007
    Publication date: February 17, 2011
    Inventors: Takeaki Saiki, Makoto Iwai, Haruhiko Furukawa, Anil Kumar Tomar
  • Publication number: 20100324254
    Abstract: A reactive hot melt adhesive exhibiting good hardness (flexibility) after curing while maintaining excellent initial adhesion properties is provided. The reactive hot melt adhesive is obtained by reacting a polyether polyol (A), an amorphous polyester polyol (B) having a softening point of less than 40° C., an amorphous polyester polyol (C) having a softening point of 40° C. or more, and a polyisocyanate compound (D).
    Type: Application
    Filed: June 7, 2010
    Publication date: December 23, 2010
    Applicant: THE YOKOHAMA RUBBER CO., LTD.
    Inventor: Takeaki SAIKI
  • Publication number: 20100311999
    Abstract: An organic silicon compound represented by the following general formula: ClCH2CH(CF3)COOR3Si(R1)n(R2)3-n (wherein, R1 independently designates the same or different substituted or unsubstituted hydrocarbon groups having 1 to 20 carbon atoms, R2 independently designates the same or different groups selected from halogen groups or hydrolysable groups having 1 to 20 carbon atoms, R3 designates substituted or unsubstituted alkylene groups having 1 to 20 carbon atoms, and “n” is an integer from 0 to 3). The organic silicon compound is suitable for use as a preferable precursor in the manufacture of silanes that contain (2-trifluoromethylacryloxy)alkyl groups.
    Type: Application
    Filed: December 22, 2008
    Publication date: December 9, 2010
    Inventor: Takeaki Saiki
  • Publication number: 20100280188
    Abstract: The present invention relates to a compound represented by the following general formula (I): wherein R1 and R2 independently represent a monovalent hydrocarbon group; R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; X represents a divalent hydrocarbon group; and R4, R5 and R6 independently represent a monovalent organic group or a group represented by the following general formula (II): in which R7 and R8 independently represent a monovalent hydrocarbon group; and R9 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, with the proviso that R5 and R6 may combine together to form a divalent hydrocarbon group. The aforementioned compounds are useful as a polymerization inhibitor and the like.
    Type: Application
    Filed: December 16, 2008
    Publication date: November 4, 2010
    Inventors: Takeaki Saiki, Keiji Wakita, Yasushi Sugiura, Yoshinori Taniguchi
  • Publication number: 20100120950
    Abstract: A method for manufacturing a bis(silatranylalkyl) polysulfide by heating a bis(trialkoxysilylalkyl) polysulfide and triethanolamine in the presence of a catalytic quantity of an alkali-metal alcoholate, thus substituting all Si-bonded alkoxy groups of the bis(trialkoxysilylalkyl) polysulfide with a (OCH2CH2)3N group; a method for the preparation of a mixture of a bis(silatranylalkyl) polysulfide and a (silatranyalkyl) (trialkoxysilyl) disulfide or a mixture of a bis(silatranylalkyl) polysulfide, a (silatranylalkyl) (trialkoxysilyl) disulfide, and a bis(trialkoxysilylalkyl) polysulfide by heating a bis(trialkoxysilylalkyl) polysulfide and triethanolamine in the presence of a catalytic quantity of an alkali-metal alcoholate, thus substituting a part of Si-bonded alkoxy groups of the bis(trialkoxysilylalkyl) polysulfide with a (OCH2CH2)3N group; a mixture of a bis(silatranylalkyl) polysulfide and a (silatranylalkyl)(trialkoxysilyl) disulfide; a mixture of a bis(silatranylalkyl) polysulfide, a (silatranylalkyl)(t
    Type: Application
    Filed: January 11, 2008
    Publication date: May 13, 2010
    Inventors: Takeaki Saiki, Makoto Iwai, Anil Kumar Tomar
  • Patent number: 7456307
    Abstract: A method for the preparation of a chain hydrocarbon halosilylated at its terminal carbon atom or terminal carbon atoms by subjecting a diene-type compound and a hydrogenhalosilane to a hydrosilylation reaction in the presence of a hydrosilylation catalyst and an ether compound having no aliphatic triple bond. A method of conducting a hydrosilylation reaction between a diene-type compound that has vinyl groups on both terminals and a hydrogenhalosilane in the presence of a hydrosilylation catalyst and an ether compound having no aliphatic triple bond.
    Type: Grant
    Filed: October 1, 2004
    Date of Patent: November 25, 2008
    Assignee: Dow Corning Toray Company, Ltd.
    Inventor: Takeaki Saiki
  • Publication number: 20070055074
    Abstract: A method for the preparation of a chain hydrocarbon halosilylated at its terminal carbon atom or terminal carbon atoms by subjecting a diene-type compound and a hydrogenhalosilane to a hydrosilylation reaction in the presence of a hydrosilylation catalyst and an ether compound having no aliphatic triple bond. A method of conducting a hydrosilylation reaction between a diene-type compound that has vinyl groups on both terminals and a hydrogenhalosilane in the presence of a hydrosilylation catalyst and an ether compound having no aliphatic triple bond.
    Type: Application
    Filed: October 1, 2004
    Publication date: March 8, 2007
    Inventor: Takeaki Saiki
  • Publication number: 20060235120
    Abstract: To provide a highly efficient and stable method for the preparation of a silicon-containing polysulfide-type polymer, in particular, a polysulfide-type polymer with organosilyl groups, the method being carried out without generation of by-products that could have high impact on the environment. A method for the preparation of a silicon-containing polysulfide-type polymer characterized by mixing (A) a silicon-containing compound having a silicon atom-bonded monovalent organic group having an aliphatic unsaturated bond; (B) a polysulfide polymer with at least two mercapto groups in one molecule; and (C) an organic base or ammonia; the mixing being carried out in the presence of (D) sulfur.
    Type: Application
    Filed: October 28, 2003
    Publication date: October 19, 2006
    Inventors: Takeaki Saiki, Makoto Iwai
  • Patent number: 6001918
    Abstract: A silicone gel composition comprising: (A) 100 parts by weight of an organopolysiloxane containing at least two alkenyl groups per molecule and having a viscosity of 0.01 to 100 Pa.s at 25.degree. C.; (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule and having a viscosity of 0.001 to 10 Pa.s at 25.degree. C. in an amount sufficient to provide from 0.2 to 5 moles of silicon-bonded hydrogen atoms per one mole of alkenyl groups in component (A); (C) 0.01 to 15 parts by weight of a silica powder having a specific surface area of at least 50 m.sup.2 /g; (D) 0.0001 to 1.0 part by weight of a diamine compound represented by the following general formula: R.sup.1.sub.2 N--R.sup.2 --NR.sup.1.sub.2 wherein each R.sup.1 is independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R.sup.
    Type: Grant
    Filed: July 6, 1998
    Date of Patent: December 14, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroji Enami, Akihiro Nakamura, Yuji Hamada, Takeaki Saiki
  • Patent number: 6001943
    Abstract: The present invention provides a silicone gel composition for use in sealing and filling of electrical and electronic parts, which are characterized by the fact that when said composition is cured, said composition forms a silicone gel in which the loss elastic modulus at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and in which the complex elastic modulus is 1.0.times.10.sup.5 Pa or less, and a silicone gel which is characterized by the fact that in a silicone gel which seals or fills electrical or electronic parts, the loss elastic modulus of this silicone gel at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and the complex elastic modulus is 1.0.times.10.sup.5 Pa or less.
    Type: Grant
    Filed: January 28, 1998
    Date of Patent: December 14, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroji Enami, Yuji Hamada, Akihiro Nakamura, Takeaki Saiki
  • Patent number: 5969023
    Abstract: A curable silicone composition cures to form a silicone cured product with improved fire-retarding properties. The composition comprises a hydrosilylation-reaction curable silicone composition Fire-retarding properties are imparted to the composition using a silica powder with a specific surface area of not less than 50 sq. m/g and a diamine compound. The cured product is preferably a silicone gel.
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: October 19, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroji Enami, Yuji Hamada, Takeaki Saiki
  • Patent number: 5548038
    Abstract: The present invention provides organosiloxane compositions that cure to optically transparent gels by a hydrosilation reaction and contain a) two types of alkenyl-substituted organopolysiloxanes, and b) a diorganopolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule that are located on non-terminal silicon atoms. The molar ratio of silicon-bonded hydrogen atoms to alkenyl radicals in the composition is from 0.1 to 1.2.
    Type: Grant
    Filed: March 14, 1995
    Date of Patent: August 20, 1996
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroji Enami, Takeaki Saiki