Abstract: An imprint apparatus including a mold deformation mechanism configured to deform a mold by applying a pressure to the mold, a substrate deformation mechanism configured to deform the substrate by applying a pressure to the substrate, a measurement unit configured to measure a deformation amount of the mold and a deformation amount of the substrate during separating the mold from the cured imprint material on the substrate, and a control unit configured to control, during the separating, a pressure to be applied to the mold by the mold deformation mechanism and a pressure to be applied to the substrate by the substrate deformation mechanism based on the deformation amounts measured by the measurement unit such that a difference between the deformation amount of the mold and the deformation amount of the substrate falls within an allowable range.

Abstract: An imprint apparatus that transfers a pattern of a mold to an imprint material on a substrate, includes: a mold having a pattern region in which the pattern is formed; a substrate holding unit having a substrate mounting surface on which the substrate is mounted; a driving unit configured to drive the mold and press the mold against the substrate coated with an imprint material at three or more positions; and a control unit configured to control a pressing force of the driving unit based on a distance in an XY plane parallel to the substrate mounting surface between the driving unit and a top portion of a convex shape of at least one of the mold and the substrate deformed by the deformation mechanism.

Abstract: The present invention provides an imprint apparatus that performs imprint processing of forming a pattern of an imprint material on a substrate using a mold, the apparatus including an image sensing unit configured to sense at least one of the mold and the substrate and obtain an image, and a determination unit configured to determine normality/abnormality of the imprint processing, wherein the imprint processing includes a first step of supplying the imprint material onto the substrate, and a second step of bringing the mold and the imprint material on the substrate into contact with each other, and the determination unit changes a reference of determination of the normality/abnormality of the imprint processing for each step of the imprint processing and determines the normality/abnormality of the imprint processing based on the image sensed by the image sensing unit.

Abstract: An imprint method includes: placing a light-curable composition on a workpiece substrate (placement); bringing the light-curable composition and a mold into contact with each other an atmosphere of a condensable gas (contact); aligning the mold and the workpiece substrate (alignment); irradiating the light-curable composition with light to obtain a light-cured composition (irradiation); and separating the light-cured composition and the mold from each other after the irradiation (release). The film thickness of the light-curable composition during the alignment is 20% or more greater than that of the light-cured composition after the release.

Abstract: The present invention provides an imprint apparatus that performs imprint processing of forming a pattern of an imprint material on a substrate using a mold, the apparatus including an image sensing unit configured to sense at least one of the mold and the substrate and obtain an image, and a determination unit configured to determine normality/abnormality of the imprint processing, wherein the imprint processing includes a first step of supplying the imprint material onto the substrate, and a second step of bringing the mold and the imprint material on the substrate into contact with each other, and the determination unit changes a reference of determination of the normality/abnormality of the imprint processing for each step of the imprint processing and determines the normality/abnormality of the imprint processing based on the image sensed by the image sensing unit.

Abstract: An imprint method includes: placing a light-curable composition on a workpiece substrate (placement); bringing the light-curable composition and a mold into contact with each other an atmosphere of a condensable gas (contact); aligning the mold and the workpiece substrate (alignment); irradiating the light-curable composition with light to obtain a light-cured composition (irradiation); and separating the light-cured composition and the mold from each other after the irradiation (release). The film thickness of the light-curable composition during the alignment is 20% or more greater than that of the light-cured composition after the release.

Abstract: An image-pickup display apparatus including a camera unit with: an image-pickup optical system; an image-pickup device having a light intercepting surface at a position of image formation by the image-pickup optical system, a signal processing circuit for generating a picture signal based on an image-pickup signal output by the image-pickup device, and a controller for correcting exposure by controlling the image-pickup device and the signal processing circuit.

Abstract: A powder coating booth a function of supplying air though its ceiling. Sidewalls of the booth is formed from an insulating material or a semiconductor. A belt conveyor is disposed at the bottom of the booth. An electric field is formed so that it extends from a paint gun to the conveyor belt. The majority of oversprayed powder paint produced during painting becomes attached to the upper surface of a portion of the conveyor belt, is carried, together with this belt portion, to the outside of the booth, and is recovered from the conveyor by a blowing-type of static eliminator, thereby minimizing the mount of oversprayed powder paint mixed in an exhaust of the booth drawn through the sidewall.

Abstract: This invention relates to a method for adjusting an electronic circuit used for a television receiver and the like when it is adjusted upon being manufactured, in which connection wires (17) and (18), which can be melt-cut by flowing a current thereto from the outside, are previously connected in series or in parallel to adjusting elements (12) and (13) inserted into a predetermined current path within an electronic circuit (10); the operation state of the electronic circuit (10) is detected by a detector circuit (5); on the basis of the detected result, it is judged whether the connection wires (17) and (18) are melt-cut or not; and under the necessary state, the connection wires (17) and (18) are melt-cut by flowing the current thereto from the outside, whereby a semi-fixed resistor is omitted, the reliability thereof after adjustment can be improved and the adjustment itself can be simplified, thus reducing the adjusting time.