Patents by Inventor Takeo Kikuchi
Takeo Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220024921Abstract: The purpose of the present invention is to provide a compound having PIM inhibitory activity. Examples of the present invention include 1,3,4-oxadiazolone compounds represented by the following formula [1], and pharmaceutically acceptable salts thereof, and solvates thereof. The compounds of the present invention have PIM inhibitory activity. In addition, since the compounds of the present invention have PIM inhibitory activity, the compounds of the present invention are useful as therapeutic agents for systemic lupus erythematosus, lupus nephritis, etc.Type: ApplicationFiled: November 14, 2019Publication date: January 27, 2022Applicant: NIPPON SHINYAKU CO., LTD.Inventors: Hirotaka KAMITANI, Hisaaki ZAIMOKU, Yoshinari HARUTA, Takeo KIKUCHI
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Patent number: 11220722Abstract: Provided are a steel sheet having a tensile strength of 950 MPa or more and good toughness and a method for manufacturing the same. The steel sheet has a specific composition and a metallographic structure containing: a ferrite area fraction of 30% or less (including 0%), a tempered martensite area fraction of 70% or more (including 100%), and a retained austenite area fraction of 4.5% or less (including 0%), wherein the average aspect ratio of an iron based carbide, precipitated in tempered martensite grains, having a grain size in the largest 10% is 3.5 or more.Type: GrantFiled: August 29, 2017Date of Patent: January 11, 2022Assignee: JFE Steel CorporationInventors: Noriaki Kohsaka, Yoshikazu Suzuki, Takeo Kikuchi, Yoshimasa Himei
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Publication number: 20190185954Abstract: Provided are a steel sheet having a tensile strength of 950 MPa or more and good toughness and a method for manufacturing the same. The steel sheet has a specific composition and a metallographic structure containing: a ferrite area fraction of 30% or less (including 0%), a tempered martensite area fraction of 70% or more (including 100%), and a retained austenite area fraction of 4.5% or less (including 0%), wherein the average aspect ratio of an iron based carbide, precipitated in tempered martensite grains, having a grain size in the largest 10% is 3.5 or more.Type: ApplicationFiled: August 29, 2017Publication date: June 20, 2019Applicant: JFE Steel CorporationInventors: Noriaki Kohsaka, Yoshikazu Suzuki, Takeo Kikuchi, Yoshimasa Himei
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Publication number: 20060233790Abstract: The present invention provides an immunoglobulin preparation comprising an immunoglobulin-hydrophilic peptide complex in which an immunoglobulin and a hydrophilic peptide are linked optionally via a divalent group, and a pharmacologically acceptable carrier. The immunoglobulin preparation has cell permeability, or in other words, it can penetrate through a cell membrane and attain inside.Type: ApplicationFiled: March 19, 2003Publication date: October 19, 2006Inventors: Shiroh Futaki, Yukio Sugiura, Shouju Kameyama, Takeo Kikuchi
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Patent number: 6541029Abstract: A nutrient infusion preparation comprises a fat emulsion essentially consisting of fat particles having a mean particle size of 0.003 to 0.100 &mgr;m and a dispersion medium, and a solution containing electrolytes and amino acids. Also the nutrient infusion preparation comprises a fat emulsion (A) consisting essentially of fat particles having a mean particle size of 0.003 to 0.100 &mgr;m and a dispersion medium, and a solution (B) containing electrolytes and/or amino acids. A container having a plurality of chambers which are isolated from each other by partitions capable of being easily opened, whose respective chambers contain the fat emulsion (A) and said solution (B) and optionally a solution (C) containing saccharides. The infusion preparation of the present invention supplies various nutrient components including fatty acids required biologically to patients and enables amelioration or prevention of essential fatty acid deficiencies during TPN therapy.Type: GrantFiled: August 31, 1999Date of Patent: April 1, 2003Assignee: Nipro CorporationInventors: Ryohei Namba, Shunzo Yamashita, Takeo Kikuchi, Makoto Sato
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Patent number: 6214802Abstract: A peritoneal dialysis fluid characterized by the addition of 0.1 to 30 g/L of albumin. The peritoneal dialysis fluid reduces the occurrence of peritonitis during peritoneal dialysis.Type: GrantFiled: May 21, 1999Date of Patent: April 10, 2001Assignee: Nissho CorporationInventors: Yukio Nakamura, Shiho Yamaguchi, Yasuhiro Tsutsui, Takeo Kikuchi
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Patent number: 5798011Abstract: A method of making a combination concrete panel wall, concrete window frame, and concrete sash glazing frame. The sill, lintel, and jambs of the window frame are fiber-reinforced concrete extrusions which are cut to length and cemented together. The hardened frame is placed in a concrete panel molding frame to locate and define a window opening. The concrete panel wall grout is then poured and dovetail-type mortise and tenon joints are precast in the exterior faces of the window frame which abut the poured concrete wall panel plastic grout, to permanently mold and interlock the window frame to the panel wall. The sash members are fitted about a window pane which is located in interior grooves in the sash members and then glazed. Sealing means interconnect the sash to the window frame to provide a condensation-resistant, water-tight, air-tight, heat and fire-resistant concrete wall closure.Type: GrantFiled: August 9, 1996Date of Patent: August 25, 1998Assignees: Kajima Corporation, Kabushiki Kaisha F R CInventors: Tatsuo Suenaga, Hiroaki Nakagawa, Shin Terauchi, Takeo Kikuchi, Shinnosuke Aiba, Mikio Kobayashi, Yutaka Katsuta, Kenji Ago, Katsumi Kosuge, Yasuyuki Matsubara, Masato Tanaami, Shunichi Sugishita, Hideki Ikeda, Toshio Furuya, Shigeyuki Akihama, Takahiro Arai
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Patent number: 5591286Abstract: A method of making a combination concrete panel wall, concrete window frame, and concrete sash glazing frame. The sill, lintel, and jambs of the window frame are fiber-reinforced concrete extrusions. The hardened frame is placed in a concrete panel molding frame to locate and define a window opening. The concrete panel wall grout is then poured and dovetail-type mortise and tenon joints are precast in the exterior faces of the window frame which abut the poured concrete wall panel plastic grout, to permanently mold and interlock the window frame to the panel wall. The sash members are fitted about a window pane which is located in interior grooves in the sash members and then glazed. Sealing means interconnects the sash to the window frame to provide a condensation-resistant, water-tight, air-tight, heat and fire-resistant concrete wall closure.Type: GrantFiled: July 20, 1994Date of Patent: January 7, 1997Assignees: Kajima Corporation, Kabushiki Kaisha FRCInventors: Tatsuo Suenaga, Hiroaki Nakagawa, Shin Terauchi, Takeo Kikuchi, Shinnosuke Aiba, Mikio Kobayashi, Yutaka Katsuta, Kenji Ago, Katsumi Kosuge, Yasuyuki Matsubara, Masato Tanaami, Shunichi Sugishita, Hideki Ikeda, Toshio Furuya, Shigeyuki Akihama, Takahiro Arai
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Patent number: 5575870Abstract: A method of making a combination concrete panel wall, concrete window frame, and concrete sash glazing frame. The sill, lintel, and jambs of the window frame are fiber-reinforced concrete extrusions which are cut to length and cemented together. The hardened frame is placed in a concrete panel molding frame to locate and define a window opening. The concrete panel wall grout is then poured and dovetail-type mortise and tenon joints are precast in the exterior faces of the window frame which abut the poured concrete wall panel plastic grout, to permanently mold and interlock the window frame to the panel wall. The sash members are fitted about a window pane which is located in interior grooves in the sash members and then glazed. Sealing means interconnect the sash to the window frame to provide a condensation-resistant, water-tight, air-tight, heat and fire-resistant concrete wall closure.Type: GrantFiled: June 1, 1995Date of Patent: November 19, 1996Assignees: Kajima Corporation, Kabushiki Kaisha FRCInventors: Tatsuo Suenaga, Hiroaki Nakagawa, Shin Terauchi, Takeo Kikuchi, Shinnosuke Aiba, Mikio Kobayashi, Yutaka Katsuta, Kenji Ago, Katsumi Kosuge, Yasuyuki Matsubara, Masato Tanaami, Shunichi Sugishita, Hideki Ikeda, Toshio Furuya, Shigeyuki Akihama, Takahiro Arai
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Patent number: 5356687Abstract: A combination concrete panel wall, concrete window frame, and concrete sash glazing frame. The sill, lintel, and jambs of the window frame are fiber-reinforced concrete extrusions which are cut to length and cemented together. The hardened frame is placed in a concrete panel molding frame to locate and define a window opening. The concrete panel wall grout is then poured and dovetail-type mortise and tenon joints are precast in the exterior faces of the window frame which abut the poured concrete wall panel plastic grout, to permanently mold and interlock the window frame to the panel wall. The sash members are also reinforced concrete extrusions which are cut to length, cemented together, and fitted about a window pane which is located in interior grooves in the sash members and then glazed. An elastoplastic seal interconnects the sash to the window frame to provide a condensation-resistant, water-tight, air-tight, heat and fire-resistant concrete wall closure.Type: GrantFiled: April 6, 1993Date of Patent: October 18, 1994Assignees: Kajima Corporation, Kabushiki Kaisha F R CInventors: Tatsuo Suenaga, Hiroaki Nakagawa, Shin Terauchi, Takeo Kikuchi, Shinnosuke Aiba, Mikio Kobayashi, Yutaka Katsuta, Kenji Ago, Katsumi Kosuge, Yasuyuki Matsubara, Masato Tanaami, Shunichi Sugishita, Hideki Ikeda, Toshio Furuya, Shigeyuki Akihama, Takahiro Arai
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Patent number: 5349219Abstract: A wafer-scale semiconductor integrated circuit device includes a wafer, a plurality of chips formed on the wafer, each of the chips having an internal logic circuit, interconnection lines mutually connecting the chips, and clamping circuits which are coupled to chips from among the chips which are located at a periphery of an arrangement of the chips and which prevent the interconnection lines related to the chips located at the periphery from being in a floating state.Type: GrantFiled: December 30, 1993Date of Patent: September 20, 1994Assignees: Fujitsu Limited, Fujitsu VLSI LimitedInventors: Toshiaki Murao, Takeo Kikuchi, Toshihiko Iryu, Hidenori Nomura, Hiroyuki Sugamoto
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Patent number: 5032889Abstract: A wafer-scale integrated circuit includes a plurality of functional blocks, a plurality of respectively corresponding connection terminals being provided in each of the functional blocks. Respectively corresponding pluralities of layered wirings and bonding wires interconnect predetermined, respective ones of said corresponding connection terminals in parallel for supplying power source and other voltages in common to the plurality of functional blocks. The parallel interconnections by the layered wirings and bonding wires, due to different, respective failure modes, affording increased reliability.Type: GrantFiled: September 20, 1990Date of Patent: July 16, 1991Assignee: Fujitsu LimitedInventors: Toshiaki Murao, Takeo Kikuchi, Toshihiko Iryu, Hiroyuki Sugamoto, Hidenori Nomura