Patents by Inventor Takeo Saitoh
Takeo Saitoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10780530Abstract: A solder ball according to the present invention contains 0.2 to 2.2% by mass of Zn, and a balance of Sn, and has a spherical diameter of 0.1 to 120 ?m and a yellowness (b*) in an L*a*b* color system of 2.70 or more and 9.52 or less. An oxide film is formed by performing aging treatment. By producing a solder ball having a yellowness of 2.70 or more and 9.52 or less, it is possible to suppress the growth of a Cu3Sn layer and/or a Cu—Zn(—Sn) layer during joining.Type: GrantFiled: May 22, 2019Date of Patent: September 22, 2020Assignee: Senju Metal Industry Co., Ltd.Inventors: Hiroki Oshima, Takeo Saitoh, Takahiro Nishizaki, Tomohisa Kawanago, Masato Shiratori, Kaichi Tsuruta
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Publication number: 20190358752Abstract: A solder ball according to the present invention contains 0.2 to 2.2% by mass of Zn, and a balance of Sn, and has a spherical diameter of 0.1 to 120 ?m and a yellowness (b*) in an L*a*b* color system of 2.70 or more and 9.52 or less. An oxide film is formed by performing aging treatment. By producing a solder ball having a yellowness of 2.70 or more and 9.52 or less, it is possible to suppress the growth of a Cu3Sn layer and/or a Cu—Zn(—Sn) layer during joining.Type: ApplicationFiled: May 22, 2019Publication date: November 28, 2019Inventors: Hiroki Oshima, Takeo Saitoh, Takahiro Nishizaki, Tomohisa Kawanago, Masato Shiratori, Kaichi Tsuruta
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Patent number: 10391589Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.Type: GrantFiled: March 30, 2015Date of Patent: August 27, 2019Assignee: Senju Metal Industry Co., Ltd.Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
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Patent number: 10137538Abstract: In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.Type: GrantFiled: May 26, 2016Date of Patent: November 27, 2018Assignee: Senju Metal Industry Co., Ltd.Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
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Patent number: 10111342Abstract: Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.Type: GrantFiled: December 21, 2015Date of Patent: October 23, 2018Assignees: Senju Metal Industry Co., Ltd., Nitta CorporationInventors: Kaichi Tsuruta, Takeo Saitoh, Manabu Muraoka, Hiroki Oshima, Koji Yamashita, Shinichiro Kawahara
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Publication number: 20180185967Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.Type: ApplicationFiled: March 30, 2015Publication date: July 5, 2018Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
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Publication number: 20170354042Abstract: Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.Type: ApplicationFiled: December 21, 2015Publication date: December 7, 2017Inventors: Kaichi Tsuruta, Takeo Saitoh, Manabu Muraoka, Hiroki Oshima, Koji Yamashita, Shinichiro Kawahara
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Publication number: 20160346878Abstract: In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.Type: ApplicationFiled: May 26, 2016Publication date: December 1, 2016Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
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Publication number: 20160250719Abstract: The present solder transfer sheet addresses the issue of providing a solder transfer sheet having both solder powder holding properties and sheet releasing properties and having excellent solder transfer properties. This solder transfer sheet is for soldering in a section to be soldered in a circuit substrate and has: a support base material; an adhesive layer provided on at least one surface of the support base material; and at least one solder layer including solder particles, provided upon the adhesive layer. The adhesive layer contains a side-chain crystalline polymer, exhibits viscosity by having fluidity at at least the melting point of the side-chain crystalline polymer, and decreases viscosity by crystalizing at temperatures less than the melting point of the side-chain crystalline polymer.Type: ApplicationFiled: November 5, 2014Publication date: September 1, 2016Inventors: Kaichi Tsuruta, Takeo Saitoh, Manabu Muraoka, Hiroki Oshima, Koji Yamashita, Tomohiro Nishio, Shinichiro Kawahara
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Publication number: 20020073987Abstract: In a solar energy collector assembly comprising a tubular heat collector member and a reflector extending along a length of the tubular heat collector member, the reflector consists of a modified compound parabolic concentrator having a bottom part defined by a linear segment in cross section. Thus, the shape of the reflector is significantly simplified without substantially impairing the efficiency in the collection of heat.Type: ApplicationFiled: February 9, 2001Publication date: June 20, 2002Inventors: Heiji Fukutake, Hitoshi Yano, Takeo Saitoh