Patents by Inventor Takeo Saitoh

Takeo Saitoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10780530
    Abstract: A solder ball according to the present invention contains 0.2 to 2.2% by mass of Zn, and a balance of Sn, and has a spherical diameter of 0.1 to 120 ?m and a yellowness (b*) in an L*a*b* color system of 2.70 or more and 9.52 or less. An oxide film is formed by performing aging treatment. By producing a solder ball having a yellowness of 2.70 or more and 9.52 or less, it is possible to suppress the growth of a Cu3Sn layer and/or a Cu—Zn(—Sn) layer during joining.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: September 22, 2020
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroki Oshima, Takeo Saitoh, Takahiro Nishizaki, Tomohisa Kawanago, Masato Shiratori, Kaichi Tsuruta
  • Publication number: 20190358752
    Abstract: A solder ball according to the present invention contains 0.2 to 2.2% by mass of Zn, and a balance of Sn, and has a spherical diameter of 0.1 to 120 ?m and a yellowness (b*) in an L*a*b* color system of 2.70 or more and 9.52 or less. An oxide film is formed by performing aging treatment. By producing a solder ball having a yellowness of 2.70 or more and 9.52 or less, it is possible to suppress the growth of a Cu3Sn layer and/or a Cu—Zn(—Sn) layer during joining.
    Type: Application
    Filed: May 22, 2019
    Publication date: November 28, 2019
    Inventors: Hiroki Oshima, Takeo Saitoh, Takahiro Nishizaki, Tomohisa Kawanago, Masato Shiratori, Kaichi Tsuruta
  • Patent number: 10391589
    Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: August 27, 2019
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
  • Patent number: 10137538
    Abstract: In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: November 27, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
  • Patent number: 10111342
    Abstract: Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: October 23, 2018
    Assignees: Senju Metal Industry Co., Ltd., Nitta Corporation
    Inventors: Kaichi Tsuruta, Takeo Saitoh, Manabu Muraoka, Hiroki Oshima, Koji Yamashita, Shinichiro Kawahara
  • Publication number: 20180185967
    Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.
    Type: Application
    Filed: March 30, 2015
    Publication date: July 5, 2018
    Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
  • Publication number: 20170354042
    Abstract: Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.
    Type: Application
    Filed: December 21, 2015
    Publication date: December 7, 2017
    Inventors: Kaichi Tsuruta, Takeo Saitoh, Manabu Muraoka, Hiroki Oshima, Koji Yamashita, Shinichiro Kawahara
  • Publication number: 20160346878
    Abstract: In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.
    Type: Application
    Filed: May 26, 2016
    Publication date: December 1, 2016
    Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
  • Publication number: 20160250719
    Abstract: The present solder transfer sheet addresses the issue of providing a solder transfer sheet having both solder powder holding properties and sheet releasing properties and having excellent solder transfer properties. This solder transfer sheet is for soldering in a section to be soldered in a circuit substrate and has: a support base material; an adhesive layer provided on at least one surface of the support base material; and at least one solder layer including solder particles, provided upon the adhesive layer. The adhesive layer contains a side-chain crystalline polymer, exhibits viscosity by having fluidity at at least the melting point of the side-chain crystalline polymer, and decreases viscosity by crystalizing at temperatures less than the melting point of the side-chain crystalline polymer.
    Type: Application
    Filed: November 5, 2014
    Publication date: September 1, 2016
    Inventors: Kaichi Tsuruta, Takeo Saitoh, Manabu Muraoka, Hiroki Oshima, Koji Yamashita, Tomohiro Nishio, Shinichiro Kawahara
  • Publication number: 20020073987
    Abstract: In a solar energy collector assembly comprising a tubular heat collector member and a reflector extending along a length of the tubular heat collector member, the reflector consists of a modified compound parabolic concentrator having a bottom part defined by a linear segment in cross section. Thus, the shape of the reflector is significantly simplified without substantially impairing the efficiency in the collection of heat.
    Type: Application
    Filed: February 9, 2001
    Publication date: June 20, 2002
    Inventors: Heiji Fukutake, Hitoshi Yano, Takeo Saitoh