Abstract: An alignment apparatus for use in an exposure system for exposing fine patterns on a wafer, the alignment apparatus comprising a light source optical system for emitting coherent alignment light, a positional deviation detecting optical system for receiving the alignment light reflected from the wafer, and a light-receiving optical system for detecting a positional deviation of the wafer on the basis of the alignment light received by the positional deviation detecting optical system. These three optical systems are arranged to be coupled through flexible optical fibers to each other. This coupling arrangement using the flexible optical fiber can reduce the size of the positional deviation detecting optical system whereby the positional deviation detecting optical system can be disposed directly under a projection lens of the exposure system, thereby accurately effecting the alignment of the wafer with respect to the projection lens.