Patents by Inventor Takeori Maeda

Takeori Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11302675
    Abstract: A semiconductor device includes a first semiconductor chip having a first surface and a second surface; a first adhesive layer on the first surface; a second semiconductor chip that includes a third surface and a fourth surface, and a connection bump on the third surface. The connection bump is coupled to the first adhesive layer. The semiconductor device includes a wiring substrate connected to the connection bump. The semiconductor device includes a first resin layer covering the connection bump between the second semiconductor chip and the wiring substrate, and covers one side surface of the second semiconductor chip connecting the third surface and the fourth surface. The first adhesive layer covers an upper portion of the at least one side surface. The first resin layer covers a lower portion of the at least one side surface. The first adhesive layer and the first resin layer contact each other.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: April 12, 2022
    Assignee: KIOXIA CORPORATION
    Inventors: Takeori Maeda, Yuusuke Takano, Soichi Homma
  • Publication number: 20220013477
    Abstract: A semiconductor device includes a semiconductor chip having a first face and a second face on an opposite side to the first face, and including semiconductor elements arranged on the first face. Columnar electrodes are arranged above the first face, and electrically connected to any of the semiconductor elements. A first member is located around the columnar electrodes above the first face. An insulant covers the columnar electrodes and the first member. The first member is harder than the columnar electrodes and the insulant. The first member and the columnar electrodes are exposed from a surface of the insulant.
    Type: Application
    Filed: March 2, 2021
    Publication date: January 13, 2022
    Applicant: Kioxia Corporation
    Inventors: Soichi HOMMA, Tatsuo MIGITA, Masayuki MIURA, Takeori MAEDA, Kazuhiro KATO, Susumu YAMAMOTO
  • Publication number: 20210398946
    Abstract: According to one or more embodiments, a semiconductor device includes a support having a recess. A plurality of semiconductor chips are stacked on each other in the recess. A plurality of columnar electrodes in the recess extend from the semiconductor chips toward an opening of the support. A wiring layer is disposed over the opening. The recess is filled with an insulating material to cover the semiconductor chips and the columnar electrodes.
    Type: Application
    Filed: February 26, 2021
    Publication date: December 23, 2021
    Inventors: Takeori MAEDA, Soichi HOMMA
  • Publication number: 20210366748
    Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.
    Type: Application
    Filed: August 6, 2021
    Publication date: November 25, 2021
    Applicant: Toshiba Memory Corporation
    Inventors: Takeori MAEDA, Ryoji MATSUSHIMA, Makoto KAWAGUCHI, Masaaki WAKUI
  • Patent number: 11114322
    Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: September 7, 2021
    Assignee: Toshiba Memory Corporation
    Inventors: Takeori Maeda, Ryoji Matsushima, Makoto Kawaguchi, Masaaki Wakui
  • Publication number: 20210257336
    Abstract: A semiconductor device includes a first semiconductor chip having a first surface and a second surface; a first adhesive layer on the first surface; a second semiconductor chip that includes a third surface and a fourth surface, and a connection bump on the third surface. The connection bump is coupled to the first adhesive layer. The semiconductor device includes a wiring substrate connected to the connection bump. The semiconductor device includes a first resin layer covering the connection bump between the second semiconductor chip and the wiring substrate, and covers one side surface of the second semiconductor chip connecting the third surface and the fourth surface. The first adhesive layer covers an upper portion of the at least one side surface. The first resin layer covers a lower portion of the at least one side surface. The first adhesive layer and the first resin layer contact each other.
    Type: Application
    Filed: August 31, 2020
    Publication date: August 19, 2021
    Applicant: Kioxia Corporation
    Inventors: Takeori MAEDA, Yuusuke TAKANO, Soichi HOMMA
  • Patent number: 10896825
    Abstract: A mold according to an embodiment includes a first surface to be in contact with a surface of a substrate to be processed. A cavity portion recedes in a first direction being away from the first surface. A vent portion recedes in the first direction and is closer to the first surface than the cavity portion. The vent portion communicates with the cavity portion and serves as a discharge path for gas in the cavity portion. A suction portion recedes in the first direction and is farther from the first surface than the vent portion. The suction portion communicates with the vent portion. A first opening/closing portion is provided between the vent portion and the suction portion, and opens and closes or narrows down the discharge path. A second opening/closing portion is provided between the first opening/closing portion and the suction portion, and opens and closes the discharge path.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: January 19, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takeori Maeda, Ryoji Matsushima, Makoto Minaminaka, Naoki Iwamasa
  • Patent number: 10262879
    Abstract: According to one embodiment, a mold device includes a first mold. The first mold includes a substrate clamping surface, a cavity, a suction part, a vent, first and second intermediate cavities and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, and is recessed from the substrate clamping surface to a vent depth. The first intermediate cavity is provided between the vent and the suction part, and is recessed from the substrate clamping surface. The second intermediate cavity is provided between the first intermediate cavity and the suction part, and is recessed from the substrate clamping surface to a second intermediate cavity depth. The opening/closing part opens and closes the path.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: April 16, 2019
    Assignee: Toshiba Memory Corporation
    Inventors: Takeori Maeda, Ryoji Matsushima
  • Publication number: 20180254198
    Abstract: A mold according to an embodiment includes a first surface to be in contact with a surface of a substrate to be processed. A cavity portion recedes in a first direction being away from the first surface. A vent portion recedes in the first direction and is closer to the first surface than the cavity portion. The vent portion communicates with the cavity portion and serves as a discharge path for gas in the cavity portion. A suction portion recedes in the first direction and is farther from the first surface than the vent portion. The suction portion communicates with the vent portion. A first opening/closing portion is provided between the vent portion and the suction portion, and opens and closes or narrows down the discharge path. A second opening/closing portion is provided between the first opening/closing portion and the suction portion, and opens and closes the discharge path.
    Type: Application
    Filed: September 14, 2017
    Publication date: September 6, 2018
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Takeori MAEDA, Ryoji MATSUSHIMA, Makoto MINAMINAKA, Naoki IWAMASA
  • Patent number: 9997484
    Abstract: A semiconductor device includes a wiring substrate, a first semiconductor element, a second semiconductor element, a bump, a bonding portion, and a resin portion. The second semiconductor element is between the wiring substrate and the first semiconductor element. The bump is between the first and second semiconductor elements and electrically connects the first and second semiconductor elements. The bonding portion is between the first and second semiconductor elements, bonds the first semiconductor element to the second semiconductor element, and has a first elastic modulus. The resin portion has a second elastic modulus higher than the first elastic modulus. The resin portion is between the first and second semiconductor elements. The first semiconductor element is between a second portion of the resin portion and the wiring substrate. A third portion of the resin portion is overlapped with the first and second semiconductor elements.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: June 12, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takeori Maeda, Masatoshi Fukuda, Ryoji Matsushima, Hideo Aoki
  • Publication number: 20170271186
    Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.
    Type: Application
    Filed: March 10, 2017
    Publication date: September 21, 2017
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: TAKEORI MAEDA, RYOJI MATSUSHIMA, MAKOTO KAWAGUCHI, MASAAKI WAKUI
  • Publication number: 20170263582
    Abstract: A semiconductor device includes a wiring substrate, a first semiconductor element, a second semiconductor element, a bump, a bonding portion, and a resin portion. The second semiconductor element is between the wiring substrate and the first semiconductor element. The bump is between the first and second semiconductor elements and electrically connects the first and second semiconductor elements. The bonding portion is between the first and second semiconductor elements, bonds the first semiconductor element to the second semiconductor element, and has a first elastic modulus. The resin portion has a second elastic modulus higher than the first elastic modulus. The resin portion is between the first and second semiconductor elements. The first semiconductor element is between a second portion of the resin portion and the wiring substrate. A third portion of the resin portion is overlapped with the first and second semiconductor elements.
    Type: Application
    Filed: August 30, 2016
    Publication date: September 14, 2017
    Inventors: Takeori MAEDA, Masatoshi FUKUDA, Ryoji MATSUSHIMA, Hideo AOKI
  • Publication number: 20170263476
    Abstract: According to one embodiment, a mold device includes a first mold. The first mold includes a substrate clamping surface, a cavity, a suction part, a vent, first and second intermediate cavities and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, and is recessed from the substrate clamping surface to a vent depth. The first intermediate cavity is provided between the vent and the suction part, and is recessed from the substrate clamping surface. The second intermediate cavity is provided between the first intermediate cavity and the suction part, and is recessed from the substrate clamping surface to a second intermediate cavity depth. The opening/closing part opens and closes the path.
    Type: Application
    Filed: January 24, 2017
    Publication date: September 14, 2017
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takeori Maeda, Ryoji Matsushima