Patents by Inventor Takeshi Mitsuhashi

Takeshi Mitsuhashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912888
    Abstract: A fluoropolyether group-containing compound represented by formula (1) or (2) below: wherein RSi is represented by formula (Si), and the symbols are as defined in the description —X1—SiRa1p1Rb1q1Rc1r1??(S1).
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: February 27, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Tsuneo Yamashita, Hisashi Mitsuhashi, Kenichi Katsukawa, Takeshi Maehira, Yoshimi Motonari
  • Patent number: 11810541
    Abstract: An electronic musical instrument is provided and includes: a musical tone processing circuit processing a musical tone signal; an output jack for connecting the musical tone signal to an amplifier; a phone jack for connecting the musical tone signal to a phone; a switch for turning power supply ON or OFF; and a control circuit that determines whether power supply is necessary and selects power supply from among first, second and third power based on information indicating each power receiving state of the first to third power (respectively from AC adapter, USB cable, and battery), information indicating whether an output plug is inserted into the output jack, a phone plug is inserted into the phone jack, the USB cable is connected to USB jack, and an ON or OFF operation of the switch is performed, and information indicating a power supply ON or OFF state of the electronic musical instrument.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: November 7, 2023
    Assignee: Roland Corporation
    Inventors: Takeshi Mitsuhashi, Hideaki Koyama
  • Publication number: 20230062249
    Abstract: A sound processing device that is capable of setting a plurality of processes to be performed on a sound signal on a time axis. The sound processing device includes a display control part that controls display of a screen on which two or more blocks each indicating input and output of the sound signal and process details for the input sound signal can be disposed, and a signal processing part that performs a process corresponding to each block on the sound signal in a block order defined on the basis of a positional relationship between a block disposed on the screen and a new block disposed on the screen.
    Type: Application
    Filed: March 21, 2022
    Publication date: March 2, 2023
    Applicant: Roland Corporation
    Inventors: Takeshi MITSUHASHI, Hideaki Shiraishi
  • Publication number: 20210201878
    Abstract: An electronic musical instrument is provided and includes: a musical tone processing circuit processing a musical tone signal; an output jack for connecting the musical tone signal to an amplifier; a phone jack for connecting the musical tone signal to a phone; a switch for turning power supply ON or OFF; and a control circuit that determines whether power supply is necessary and selects power supply from among first, second and third power based on information indicating each power receiving state of the first to third power (respectively from AC adapter, USB cable, and battery), information indicating whether an output plug is inserted into the output jack, a phone plug is inserted into the phone jack, the USB cable is connected to USB jack, and an ON or OFF operation of the switch is performed, and information indicating a power supply ON or OFF state of the electronic musical instrument.
    Type: Application
    Filed: December 24, 2020
    Publication date: July 1, 2021
    Applicant: Roland Corporation
    Inventors: Takeshi MITSUHASHI, Hideaki KOYAMA
  • Patent number: 9351418
    Abstract: According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: May 24, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takeshi Mitsuhashi, Hirofumi Katami
  • Publication number: 20160077555
    Abstract: According to one embodiment, a USB memory device includes: a substrate including a semiconductor chip, a plurality of operating terminals, a reference potential terminal and a reference potential wiring; and a housing holding the substrate inside, being electrically connected to the reference potential terminal, and having electric conductivity. The reference potential wiring electrically connects the operating terminal with the reference potential terminal.
    Type: Application
    Filed: September 3, 2015
    Publication date: March 17, 2016
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yuuta YAMADA, Takeshi MITSUHASHI, Junichi ASADA
  • Publication number: 20160073489
    Abstract: A module includes a base substrate, a flexible substrate including a first portion that is disposed on the substrate and a second portion that is bent from an end of the first portion toward the first portion, and a terminal exposed at the second portion of the flexible substrate. Another module includes a substrate, a convex portion disposed on the substrate, a terminal disposed on the substrate, and a first conductive member including a first portion which is disposed on the substrate and the terminal and is connected to the terminal, and a second portion extending from the first portion and along the surface of the convex portion.
    Type: Application
    Filed: March 3, 2015
    Publication date: March 10, 2016
    Inventors: Shiro HARASHIMA, Masayuki DOHI, Masaki HIGA, Takeshi MITSUHASHI, Masaaki TAKAHASHI
  • Publication number: 20150359111
    Abstract: According to one embodiment, a memory device includes a device body including a terminal connectable to an external device, a memory, a controller configured to control the memory, and a plurality of concave portions, and a case including a plurality of convex portions which are capable of fitting into the plurality of concave portions in a state where a part of the device body is inserted into the case.
    Type: Application
    Filed: September 10, 2014
    Publication date: December 10, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Takeshi MITSUHASHI
  • Publication number: 20140126153
    Abstract: According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller.
    Type: Application
    Filed: January 13, 2014
    Publication date: May 8, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takeshi MITSUHASHI, Hirofumi KATAMI
  • Patent number: 8670243
    Abstract: According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller.
    Type: Grant
    Filed: March 14, 2011
    Date of Patent: March 11, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takeshi Mitsuhashi, Hirofumi Katami
  • Publication number: 20110228467
    Abstract: According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller.
    Type: Application
    Filed: March 14, 2011
    Publication date: September 22, 2011
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takeshi MITSUHASHI, Hirofumi Katami
  • Publication number: 20070127223
    Abstract: A portable storage device that is connected to an external device to receive and output a signal, has a cover case that has an opening in a front surface thereof and a slit penetrating a wall thereof, a potential of the inner surface of the cover case being kept at the ground potential by connecting to the external device; a circuit board held in said cover case; a connector terminal for connection to said external device that is connected to a front part of said circuit board and disposed to be exposed through the opening of said cover case; a semiconductor memory for storing data that is mounted on said circuit board and connected to said connector terminal; and a controller mounted on said circuit board for controlling said semiconductor memory.
    Type: Application
    Filed: November 28, 2006
    Publication date: June 7, 2007
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Takeshi Mitsuhashi
  • Publication number: 20060006508
    Abstract: A semiconductor device including a lead frame having a plurality of inner leads having end portions and a plurality of outer leads integrated with the inner leads, the inner leads having first surfaces and second surfaces which are opposite to the first surfaces, first plating provided at the end portions of the first surfaces of the inner leads, second plating provided on the second surfaces of the inner leads, a first semiconductor chip mounted on the second surfaces of the inner leads by means of an intervening first adhesion member, a plurality of first bonding pads arranged on the first semiconductor chip, a plurality of first bonding wires connecting the first bonding pads to one of the first plating and second plating, a second semiconductor chip mounted on the first semiconductor chip by means of an intervening second adhesion member, a plurality of second bonding pads arranged on the second semiconductor chip, a plurality of bonding wires connecting the second bonding pads to the other of the first p
    Type: Application
    Filed: July 5, 2005
    Publication date: January 12, 2006
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Takeshi Mitsuhashi
  • Patent number: 6326747
    Abstract: A synchronization control device and a synchronization control method are provided in which it includes controllers Am and As1 of a master section and a slave section for accurately synchronizing rotational frequency and rotation phases of driving electric motors Mm and Ms1. The controller As1 includes rotational frequency detectors Ss1, Fs1, a master phase counter Cm1, and a slave phase counter Cs1, and detects at all times both of a rotational frequency and a rotation phase of the electric motors Mm of the master based upon an output of the rotary encoder Pm, and further detects at all times both of a rotational frequency and a rotation phase of the electric motor Ms1 of the slave.
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: December 4, 2001
    Assignee: Kabushiki Kaisya Tokyo Kikai Seisakusho
    Inventors: Noriyuki Shiba, Keiichi Fukushima, Takeshi Mitsuhashi, Ikuo Kotani
  • Patent number: RE40165
    Abstract: A synchronization control device and a synchronization control method are provided in which it includes controllers Am and As1 of a master section and a slave section for accurately synchronizing rotational frequency and rotation phases of driving electric motors Mm and Ms1. The controller As1 includes rotational frequency detectors Ss1, Fs1, a master phase counter Cm1, and a slave phase counter Cs1, and detects at all times both of a rotational frequency and a rotation phase of the electric motors Mm of the master based upon an output of the rotary encoder Pm, and further detects at all times both of a rotational frequency and a rotation phase of the electric motor Ms1 of the slave.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: March 25, 2008
    Assignee: Kabushiki Kaisya Tokyo Kikai Seisakusho
    Inventors: Noriyuki Shiba, Keiichi Fukushima, Takeshi Mitsuhashi, Ikuo Kotani
  • Patent number: D873908
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: January 28, 2020
    Assignee: Roland Corporation
    Inventors: Tetsuya Uesugi, Norihiko Wada, Takeshi Mitsuhashi
  • Patent number: D995547
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: August 15, 2023
    Assignee: Roland Corporation
    Inventors: Takeshi Mitsuhashi, Hideaki Shiraishi
  • Patent number: D1009900
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: January 2, 2024
    Assignee: Roland Corporation
    Inventors: Takeshi Mitsuhashi, Hideaki Shiraishi