Patents by Inventor Takeshi Morita

Takeshi Morita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120266777
    Abstract: The present invention provides a railroad vehicle having a truck structure in which soundproof effect can sufficiently be enhanced. Soundproof member 22 having flexibility is mounted to support member 21 fixed to axle box 15. The support member is fixed to the axle box at an outer side of a vehicle body at wheel 14 in such a manner that the lower end thereof is located above a position set beforehand. The soundproof member is arranged parallel to the rail at the outer side of the vehicle body at the position where the wheel rolls on rail 17. The upper part of the soundproof member is mounted to the support member in such a manner that the position thereof in the vertical direction can be adjusted, and the lower end of the soundproof member is located above a surface of the rail.
    Type: Application
    Filed: September 23, 2011
    Publication date: October 25, 2012
    Applicant: Nippon Sharyo, Ltd.
    Inventors: Takeshi Morita, Toshiki Kunii
  • Patent number: 8256956
    Abstract: A temperature sensor including a temperature sensing element (102) having a temperature sensing unit (103) and a pair of device electrode wires (104) extending from the temperature sensing unit; a sheath member (106) including a sheath wire (108) connected at a junction (110) to one of the device electrode wires and a sheath outer pipe (107) retaining the sheath wire in an insulating material (114); an inner tube (112) which has a bottomed cylindrical shape, the inner tube accommodating the temperature sensing element and the junction in a bottom portion side of the inner tube serving as a leading end of the temperature sensor, and extending in an extension direction of the device electrode wire and the sheath wire; and an outer tube (120) which has a bottomed cylindrical shape including a gas inlet hole (122a, 122b, 122c), the outer tube covering the inner tube, and being spaced, from the inner tube on a leading end side of the junction when viewed in a direction perpendicular to an axial direction of the in
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: September 4, 2012
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Tatsuya Suzuki, Mitsunori Oi, Takashi Maeda, Norimichi Saito, Toshinori Nishi, Go Hanzawa, Takeshi Morita
  • Patent number: 8192081
    Abstract: A temperature sensor including: a temperature sensing element (102) having a temperature sensing unit (103) and a pair of device electrode wires (104); a sheath member (106) having a sheath wire (108) connected at a junction (110) to at least one of the device electrode wires and a sheath outer pipe (107) retaining the sheath wire in an insulating material (114); an inner tube (112) which has a bottomed cylindrical shape; and a cylindrical outer tube (120) having an open end, covering the inner tube such that the open end is located at a front end side of the junction and in a region to the rear end side of or aligned with the front end of the inner tube, and being spaced from the inner tube at the front end side of the junction.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: June 5, 2012
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Tatsuya Suzuki, Mitsunori Oi, Takashi Maeda, Norimichi Saito, Toshinori Nishi, Go Hanzawa, Takeshi Morita
  • Patent number: 8182145
    Abstract: A temperature sensor including a temperature sensing element (102) having a temperature sensing unit (103) and a pair of device electrode wires (104) extending from the temperature sensing unit; a sheath member (106) including a sheath wire (108) connected at a junction (110) to one of the device electrode wires and a sheath outer pipe (107) retaining the sheath wire in an insulating material (114); an inner tube (112) which has a bottomed cylindrical shape, the inner tube accommodating the temperature sensing element and the junction in a bottom portion side of the inner tube serving as a leading end of the temperature sensor, and extending in an extension direction of the device electrode wire and the sheath wire; and an outer tube (120) which has a bottomed cylindrical shape including a gas inlet hole (122a, 122b, 122c), the outer tube covering the inner tube, and being spaced, from the inner tube on a leading end side of the junction when viewed in a direction perpendicular to an axial direction of the in
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: May 22, 2012
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Tatsuya Suzuki, Mitsunori Oi, Takashi Maeda, Norimichi Saito, Toshinori Nishi, Go Hanzawa, Takeshi Morita
  • Publication number: 20120094568
    Abstract: A method of manufacturing a three dimensional image display device includes bonding a lens plate having a lenticular lens to a display panel configured to display an image, with a partially-discontinuous frame-shaped adhesive member interposed in between while having the lenticular lens facing the display panel. The method also includes depressurizing a hermetic inner space formed by the display panel, the adhesive member, and the lens plate, and sealing an opening section communicating with the inner space.
    Type: Application
    Filed: December 23, 2011
    Publication date: April 19, 2012
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kentaro Miyazaki, Takashi Miyauchi, Takeshi Morita
  • Patent number: 8152049
    Abstract: The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: April 10, 2012
    Assignee: Panasonic Corporation
    Inventors: Takeshi Morita, Masanori Hiyoshi
  • Patent number: 8092086
    Abstract: A temperature sensor includes: a temperature-sensing element comprising a temperature-sensing portion and an element electrode wire connected to the temperature-sensing portion; a sheath member comprising a sheath tube and a sheath core wire extending from the sheath tube, the sheath core wire being joined to the element electrode wire to form a joint portion; an enclosing member comprising a closed-bottomed tube having a bottom portion at one end, and enclosing at least the temperature-sensing element and the joint portion; and a holding material filling at least a portion of a space enclosed by the enclosing member extending between a front end face of the temperature-sensing portion and the bottom portion of the enclosing member. The element electrode wire includes a bend at an intermediate portion of the element electrode wire between the temperature-sensing portion and the joint portion.
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: January 10, 2012
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Tatsuya Suzuki, Go Hanzawa, Takeshi Morita
  • Publication number: 20110319225
    Abstract: A shift controller controls a transmission for a hybrid vehicle in which: an engine and a motor are connected together via a clutch; and the transmission is placed between the motor and driving wheels. The shift controller has: a first shift controlling unit which performs shift control on a basis of at least one of transmission efficiency of the transmission and power generation efficiency of the motor in a case where regeneration is performed with the clutch disengaged during deceleration of the hybrid vehicle; and a second shift controlling unit which performs shift control to make a transmission gear ratio of the transmission smaller than in the shift control performed by the first shift controlling unit in a case where the regeneration is performed with the clutch engaged during the deceleration of the hybrid vehicle.
    Type: Application
    Filed: June 24, 2011
    Publication date: December 29, 2011
    Inventors: Yoshikazu OOTA, Ryozo Hiraku, Takeshi MORITA, Akira TAKANO
  • Patent number: 8085350
    Abstract: A three dimensional image display device includes a display panel configured to display an image, and a lens plate which is a plate member having a lenticular lens and which is provided to the display panel with a frame-shaped adhesive member interposed in between while having the lenticular lens facing the display panel. In this image display, a hermetic inner space is formed by the display panel, the adhesive member and the lens plate, and the internal pressure of the inner space is lower than the atmospheric pressure.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: December 27, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kentaro Miyazaki, Takashi Miyauchi, Takeshi Morita
  • Publication number: 20110228812
    Abstract: A temperature sensor having a weld zone between an element electrode wire and a sheath core wire. When a section of the weld zone is taken orthogonally to the axial direction and in such a manner as to pass through a center point, L/D is greater or equal to 0.6, wherein D represents the diameter of the element electrode wire, and L represents the length of a chord connecting a first weld point and a second weld point as defined herein.
    Type: Application
    Filed: November 25, 2009
    Publication date: September 22, 2011
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Tatsuya Suzuki, Go Hanzawa, Takeshi Morita, Akihiro Fukata, Ken Masuda
  • Patent number: 7870991
    Abstract: In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.
    Type: Grant
    Filed: September 6, 2007
    Date of Patent: January 18, 2011
    Assignee: Panasonic Corporation
    Inventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
  • Publication number: 20100230472
    Abstract: In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.
    Type: Application
    Filed: September 6, 2007
    Publication date: September 16, 2010
    Applicant: PANASONIC CORPORATION
    Inventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
  • Patent number: 7793817
    Abstract: To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.
    Type: Grant
    Filed: September 6, 2007
    Date of Patent: September 14, 2010
    Assignee: Panasonic Corporation
    Inventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
  • Publication number: 20100163602
    Abstract: To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.
    Type: Application
    Filed: September 6, 2007
    Publication date: July 1, 2010
    Applicant: PANASONIC CORPORATION
    Inventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
  • Publication number: 20100151761
    Abstract: A manufacturing apparatus for a three-dimensional image display includes a control unit configured to cause a display panel bonded to a lens plate while being housed in a decompression chamber to display an inspection chart, to cause an image capture to capture images of the inspection chart multiple times along with an increase in a decompression degree inside the decompression chamber while causing a decompressor to decompress the inside of the decompression chamber, to obtain variance of luminance distribution for each of the images captured by the image capture, to obtain change information of the variance that changes depending on a change in the decompression degree inside the decompression chamber, and to obtain the decompression degree at a change point of the variance based on the obtained change information of the variance.
    Type: Application
    Filed: December 16, 2009
    Publication date: June 17, 2010
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kentaro Miyazaki, Takashi Miyauchi, Takeshi Morita
  • Patent number: 7712652
    Abstract: First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit board 13 are picked up from a component supply unit 1 using a placement head 16, and by lifting and lowering the placement head 16 holding the first components and the second components relative to a paste transfer device 5 supplying a flux 10 in the manner such as coating films having two types of different thicknesses, the flux 10 is supplied to the bumps of the plurality of components in a bundle using a transfer coating method. With such a configuration, it is possible to efficiently perform a component mounting with a satisfactory adhesiveness by ensuring an optimal amount of application quantity of a paste.
    Type: Grant
    Filed: May 3, 2007
    Date of Patent: May 11, 2010
    Assignee: Panasonic Corporation
    Inventors: Takeshi Morita, Masanori Hiyoshi
  • Publication number: 20090321499
    Abstract: The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.
    Type: Application
    Filed: August 23, 2007
    Publication date: December 31, 2009
    Applicant: PANASONIC CORPORATION
    Inventors: Takeshi Morita, Masanori Hiyoshi
  • Publication number: 20090279586
    Abstract: A temperature sensor including a temperature sensing element (102) having a temperature sensing unit (103) and a pair of device electrode wires (104) extending from the temperature sensing unit; a sheath member (106) including a sheath wire (108) connected at a junction (110) to one of the device electrode wires and a sheath outer pipe (107) retaining the sheath wire in an insulating material (114); an inner tube (112) which has a bottomed cylindrical shape, the inner tube accommodating the temperature sensing element and the junction in a bottom portion side of the inner tube serving as a leading end of the temperature sensor, and extending in an extension direction of the device electrode wire and the sheath wire; and an outer tube (120) which has a bottomed cylindrical shape including a gas inlet hole (122a, 122b, 122c), the outer tube covering the inner tube, and being spaced, from the inner tube on a leading end side of the junction when viewed in a direction perpendicular to an axial direction of the in
    Type: Application
    Filed: May 8, 2009
    Publication date: November 12, 2009
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Tatsuya SUZUKI, Mitsunori OI, Takashi MAEDA, Norimichi SAITO, Toshinori NISHI, Go HANZAWA, Takeshi MORITA
  • Publication number: 20090279585
    Abstract: A temperature sensor including: a temperature sensing element (102) having a temperature sensing unit (103) and a pair of device electrode wires (104); a sheath member (106) having a sheath wire (108) connected at a junction (110) to at least one of the device electrode wires and a sheath outer pipe (107) retaining the sheath wire in an insulating material (114); an inner tube (112) which has a bottomed cylindrical shape; and a cylindrical outer tube (120) having an open end, covering the inner tube such that the open end is located at a front end side of the junction and in a region to the rear end side of or aligned with the front end of the inner tube, and being spaced from the inner tube at the front end side of the junction.
    Type: Application
    Filed: May 8, 2009
    Publication date: November 12, 2009
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Takeshi MORITA, Go HANZAWA, Tetsuya SUZUKI, Mitsunori OI
  • Publication number: 20090203209
    Abstract: A semiconductor device which is capable of avoiding an increase in pattern ratio and allowing wiring dummy patterns to improve global steps developed by CMP upon insertion of the dummy patterns which are different from an actual wiring pattern. The semiconductor device has a configuration wherein a gate wiring pattern is formed on a semiconductor substrate, a plurality of dummy patterns are provided therearound, and a BPSG oxide film which is flattened by CMP is formed on the gate wiring pattern and the dummy patterns as an interlayer insulating film. In the semiconductor device, the dummy patterns are formed so as to include pattern non-forming regions such as slits.
    Type: Application
    Filed: January 23, 2009
    Publication date: August 13, 2009
    Inventor: Takeshi Morita