Abstract: Disclosed are a photosensitive resin composition which comprises:(A) a compound having a carboxyl group;(B) a resin having a carboxyl group;(C) a photopolymerizable unsaturated compound having an ethylenic unsaturated group;(D) a photopolymerization initiator which produces free radical by irradiation of active light; and(E) a phosphor,a photosensitive film and a process for preparing a fluorescent pattern using the same, and a phosphor subjected to surface treatment and a process for preparing the same.

Abstract: Disclosed is a process for preparing a printed circuit board, which comprises the steps of:(1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.