Patents by Inventor Takeshi Okunaga

Takeshi Okunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230369761
    Abstract: Provided is an antenna unit capable of suitably increasing a 3 dB beamwidth. An antenna unit includes a single feed antenna provided on a dielectric body, and a pair of parasitic antennas provided on one side and another side of the single feed antenna in the dielectric body, and the feed antenna includes a feed line, and a feed body portion including a radiation element supplied with power through the feed line, the pair of parasitic antennas each include a parasitic body portion that has substantially the same shape as the feed body portion, pitches between the feed antenna and the pair of parasitic antennas are substantially equal to each other, and the pitches are each within a range from 0.4?+{(?/2)×n} to 0.6?+{(?/2)×n} inclusive, where ? denotes a free space wavelength (n is an integer that is 0 or more).
    Type: Application
    Filed: May 10, 2023
    Publication date: November 16, 2023
    Applicant: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Takeshi OKUNAGA, Yusuke NATSUHARA
  • Patent number: 11014336
    Abstract: A circuit board according to the present invention includes: a first layer containing a fiber base material, and fusible fluororesin with which the fiber base material is impregnated; and second layers containing non-fusible fluororesin that are arranged on the two surfaces of the first layer.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: May 25, 2021
    Assignee: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Takeshi Okunaga, Miyuki Kobayashi, Tatsuya Tamaki, Kenpei Yamasaki, Tomoki Hayashi
  • Publication number: 20210060902
    Abstract: A circuit board according to the present invention includes: a first layer containing a fiber base material, and fusible fluororesin with which the fiber base material is impregnated; and second layers containing non-fusible fluororesin that are arranged on the two surfaces of the first layer.
    Type: Application
    Filed: July 19, 2018
    Publication date: March 4, 2021
    Applicant: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Takeshi OKUNAGA, Miyuki KOBAYASHI, Tatsuya TAMAKI, Kenpei YAMASAKI, Tomoki HAYASHI
  • Patent number: 10827604
    Abstract: A method for producing a high frequency circuit board includes forming an antenna pattern on an upper surface of the provisional substrate. The method includes performing hot-press in a state where a thermoplastic resin and a provisional conductor are stacked on the upper surface of the provisional substrate, to form a first dielectric layer portion covering the antenna pattern. The method includes removing the provisional conductor and shaving the first dielectric layer portion to form a cavity to house an electronic component. The method includes mounting the electronic component on the antenna pattern in the cavity. The method includes performing hot-press in a state where a thermosetting resin and a ground conductor are stacked at an opening side of the cavity in the first dielectric layer portion, to form a second dielectric layer portion to embed the electronic component in the cavity. The method includes removing the provisional substrate.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: November 3, 2020
    Assignee: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Takeshi Okunaga, Akira Nakatsu, Kojiro Iwasa, Yusuke Natsuhara
  • Publication number: 20200260572
    Abstract: A method for producing a high frequency circuit board includes forming an antenna pattern on an upper surface of the provisional substrate. The method includes performing hot-press in a state where a thermoplastic resin and a provisional conductor are stacked on the upper surface of the provisional substrate, to form a first dielectric layer portion covering the antenna pattern. The method includes removing the provisional conductor and shaving the first dielectric layer portion to form a cavity to house an electronic component. The method includes mounting the electronic component on the antenna pattern in the cavity. The method includes performing hot-press in a state where a thermosetting resin and a ground conductor are stacked at an opening side of the cavity in the first dielectric layer portion, to form a second dielectric layer portion to embed the electronic component in the cavity. The method includes removing the provisional substrate.
    Type: Application
    Filed: July 2, 2019
    Publication date: August 13, 2020
    Applicant: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Takeshi OKUNAGA, Akira NAKATSU, Kojiro IWASA, Yusuke NATSUHARA
  • Patent number: 10079436
    Abstract: [Object] To improve the directional characteristics of a planar antenna for a milliwave band as well as widening a bandwidth. [Means for Settlement] A feed line 13 has a main feed line 21, two sub-feed lines 22, and a distributor S2 adapted to branch the main feed line 21 into the two sub-feed lines 22. The distributor S2 includes: two outer edges 30L and 30R formed as curved lines connecting both side edges 21L and 21R of the main feed line 21 to first edges 221 of the sub-feed lines 22; and an inner edge 31 connecting second edges 222 of the sub-feed lines 22 to each other, in which the inner edge 31 is configured to include two inner curved lines 31L and 31R that are convex in mutual directions, and has a pointed shape that is concave toward the main feed line 21 side.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: September 18, 2018
    Assignee: Nippon Pillar Packing Co., Ltd.
    Inventors: Takeshi Okunaga, Akira Nakatsu
  • Patent number: 9972900
    Abstract: Provided is a distributor capable of reducing insertion loss while suppressing a ratio in power distribution among output lines from being changed. The distributor 4 is a distributor that is connected with an input line Lin and output lines Lo1 to Lo3 respectively formed on a dielectric substrate 10 as microstrip lines, and distributes to the output lines Lo1 to Lo3 high frequency power fed from a feeding point to a branching point through the input line Lin. In addition, the distributor 4 is configured to include a stub area 42 that is formed in the input line Lin, is separated from the branching point 41, and has a rectangular shape wider than line widths of a first area La and a second area Lb of the input line Lin.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: May 15, 2018
    Assignees: Fujitsu Ten Limited, Nippon Pillar Packing Co., Ltd.
    Inventors: Takeshi Okunaga, Akira Nakatsu, Eisuke Hayakawa, Hiroaki Yoshitake
  • Patent number: 9705196
    Abstract: In an antenna, an antenna element interval is reduced without depending on an interval between converters, to widen the range of a phase folding angle to widen a detection angle range. The antenna includes a first antenna element including a feeder line extending from a first converter and a plurality of radiating elements. A second antenna element includes a feeder line extending from a second converter aligned together with the first converter and a plurality of radiating elements. The first and second antenna elements respectively include, at partial line portions of the feeder lines which extend from the converters to closest radiating elements, bend portions which are bent in directions which the bend portions come close to each other. The partial line portions of the first and second antenna elements are disposed so as to be linearly symmetrical about a virtual line.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: July 11, 2017
    Assignees: Nippon Pillar Packing Co., Ltd, Fujitsu Ten Limited
    Inventors: Takeshi Okunaga, Akira Nakatsu, Eisuke Hayakawa, Hiroaki Yoshitake
  • Patent number: 9543643
    Abstract: An antenna device according to an embodiment includes a dielectric substrate, a housing, and an interference prevention unit. On the top surface side of the dielectric substrate, a plurality of antennas is formed, and on the bottom surface side, a ground is formed, each as a conductive thin film pattern, respectively. The housing is formed of a conductive material, and formed to have a shape configured to function as a waveguide, and the top surface side of the housing is bonded to the bottom surface side of the dielectric substrate. The interference prevention unit is formed between the neighboring antennas to include at least a groove provided on the top surface side of the housing and a slit provided on the ground in the portion corresponding to the groove.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: January 10, 2017
    Assignees: FUJITSU TEN LIMITED, NIPPON PILLAR PACKING CO., LTD
    Inventors: Eisuke Hayakawa, Takeshi Okunaga, Akira Nakatsu
  • Publication number: 20160359238
    Abstract: [Object] To improve the directional characteristics of a planar antenna for a milliwave band as well as widening a bandwidth. [Means for Settlement] A feed line 13 has a main feed line 21, two sub-feed lines 22, and a distributor S2 adapted to branch the main feed line 21 into the two sub-feed lines 22. The distributor S2 includes: two outer edges 30L and 30R formed as curved lines connecting both side edges 21L and 21R of the main feed line 21 to first edges 221 of the sub-feed lines 22; and an inner edge 31 connecting second edges 222 of the sub-feed lines 22 to each other, in which the inner edge 31 is configured to include two inner curved lines 31L and 31R that are convex in mutual directions, and has a pointed shape that is concave toward the main feed line 21 side.
    Type: Application
    Filed: February 4, 2015
    Publication date: December 8, 2016
    Applicant: Nippon Pillar Packing Co., Ltd.
    Inventors: Takeshi Okunaga, Akira Nakatsu
  • Publication number: 20160079674
    Abstract: Provided is a distributor capable of reducing insertion loss while suppressing a ratio in power distribution among output lines from being changed. The distributor 4 is a distributor that is connected with an input line Lin and output lines Lo1 to Lo3 respectively formed on a dielectric substrate 10 as microstrip lines, and distributes to the output lines Lo1 to Lo3 high frequency power fed from a feeding point to a branching point through the input line Lin. In addition, the distributor 4 is configured to include a stub area 42 that is formed in the input line Lin, is separated from the branching point 41, and has a rectangular shape wider than line widths of a first area La and a second area Lb of the input line Lin.
    Type: Application
    Filed: August 27, 2015
    Publication date: March 17, 2016
    Applicants: Nippon Pillar Packing Co., Ltd., Fujitsu Ten Limited
    Inventors: Takeshi Okunaga, Akira Nakatsu, Eisuke Hayakawa, Hiroaki Yoshitake
  • Patent number: 9236664
    Abstract: An antenna which reduces the number of end faces and perpendicular corners, and suffers from little deterioration of performance even if used for high frequency transmission/reception, in particular a microstrip patch antenna which is comprised of a dielectric substrate on the bottom surface of which a conductive ground plate is formed and on the top surface of which a patch antenna part formed by a conductor and a feeder circuit connected to the same are provided, wherein the feeder circuit is connected to the antenna part while offset by exactly a predetermined distance to either end side from a center of one side of said antennas part to which said feeder circuit is to be connected so that a transmission loss of the antenna becomes a predetermined value or less. The predetermined distance can be made 20 to 70% of the longitudinal side of the patch antenna part.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: January 12, 2016
    Assignees: FUJITSU TEN LIMITED, NIPPON PILLAR PACKING CO., LTD.
    Inventors: Eisuke Hayakawa, Takeshi Okunaga, Takaaki Fujita
  • Publication number: 20150255870
    Abstract: In an antenna, an antenna element interval is reduced without depending on an interval between converters, to widen the range of a phase folding angle to widen a detection angle range. The antenna includes a first antenna element including a feeder line extending from a first converter and a plurality of radiating elements. A second antenna element includes a feeder line extending from a second converter aligned together with the first converter and a plurality of radiating elements. The first and second antenna elements respectively include, at partial line portions of the feeder lines which extend from the converters to closest radiating elements, bend portions which are bent in directions which the bend portions come close to each other. The partial line portions of the first and second antenna elements are disposed so as to be linearly symmetrical about a virtual line.
    Type: Application
    Filed: March 6, 2015
    Publication date: September 10, 2015
    Inventors: Takeshi Okunaga, Akira Nakatsu, Eisuke Hayakawa, Hiroaki Yoshitake
  • Publication number: 20140292606
    Abstract: An antenna device according to an embodiment includes a dielectric substrate, a housing, and an interference prevention unit. On the top surface side of the dielectric substrate, a plurality of antennas is formed, and on the bottom surface side, a ground is formed, each as a conductive thin film pattern, respectively. The housing is formed of a conductive material, and formed to have a shape configured to function as a waveguide, and the top surface side of the housing is bonded to the bottom surface side of the dielectric substrate. The interference prevention unit is formed between the neighboring antennas to include at least a groove provided on the top surface side of the housing and a slit provided on the ground in the portion corresponding to the groove.
    Type: Application
    Filed: December 18, 2013
    Publication date: October 2, 2014
    Applicants: NIPPON PILLAR PACKING CO., LTD., FUJITSU TEN LIMITED
    Inventors: Eisuke HAYAKAWA, Takeshi OKUNAGA, Akira NAKATSU
  • Publication number: 20130027259
    Abstract: An object is to suppress radiation of a cross polarized wave by a microstrip antenna to improve cross polarization discrimination of the traveling wave excitation antenna. A microstrip antenna wherein: a feed line 21 through which a traveling wave propagates, and a radiating element 22 that is excited by the traveling wave are formed on a dielectric substrate 1, and wherein: the radiating element 22 has a radiating part 22A for radiating a co-polarization wave, and an open stub 22B that has a stub length 22A substantially equal to ?g/4 and that extends from the radiating part toward a cross polarization direction. Therefore, without changing an element width Lb of the radiating element 22, radiation of a cross polarized wave by the radiating element 22 can be suppressed to improve cross polarization discrimination.
    Type: Application
    Filed: July 27, 2012
    Publication date: January 31, 2013
    Applicants: FUJITSU TEN LIMITED, NIPPON PILLAR PACKING CO., LTD.
    Inventors: Takaaki Fujita, Takeshi Okunaga, Eisuke Hayakawa
  • Publication number: 20120112976
    Abstract: An antenna which reduces the number of end faces and perpendicular corners, and suffers from little deterioration of performance even if used for high frequency transmission/reception, in particular a microstrip patch antenna which is comprised of a dielectric substrate on the bottom surface of which a conductive ground plate is formed and on the top surface of which a patch antenna part formed by a conductor and a feeder circuit connected to the same are provided, wherein the feeder circuit is connected to the antenna part while offset by exactly a predetermined distance to either end side from a center of one side of said antennas part to which said feeder circuit is to be connected so that a transmission loss of the antenna becomes a predetermined value or less. The predetermined distance can be made 20 to 70% of the longitudinal side of the patch antenna part.
    Type: Application
    Filed: October 18, 2011
    Publication date: May 10, 2012
    Applicants: NIPPON PILLAR PACKING CO., LTD, FUJITSU TEN LIMITED
    Inventors: Eisuke Hayakawa, Takeshi Okunaga, Takaaki Fujita