Patents by Inventor Takeshi Sakamoto

Takeshi Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240126121
    Abstract: Provided is a film for a wavelength conversion sheet that can suppress a change in color with time when applied to a wavelength conversion sheet. A film for a wavelength conversion sheet, comprising a primer layer and a first base material film in presented order, wherein a refractive index of the primer layer is defined as n1, a thickness of the primer layer is defined as t1, and a refractive index of the first base material film is defined as n2, and the following condition 1 or the following condition 2 is satisfied: Condition 1: n1<n2, and d1 represented by the following expression 1 represents a range of x±0.10 wherein x is an odd integer; Condition 2: n1>n2, and d1 represented by the following expression 1 represents a range of x±0.10 wherein x is an even integer; Expression 1: d1=n1×t1/112.5 nm.
    Type: Application
    Filed: March 17, 2022
    Publication date: April 18, 2024
    Inventors: Takeshi SAKAMOTO, Ryutaro HARADA, Shuichi TAMURA, Akihito HARUKI, Shota YAMANISHI, Yuko FUJIOKA
  • Patent number: 11961960
    Abstract: Provided is a lithium secondary battery having a higher capacity and a longer life. The lithium secondary battery includes: a positive electrode including a material capable of intercalation and deintercalation of a lithium ion; a lithium ion-conductive electrolyte including a salen-based metal complex; and a negative electrode including a material capable of occlusion and release of a lithium metal or a lithium ion. The salen-based metal complex is selected from (R,R)-(?)-N,N?-bis(3,5-di-tert-butylsalicylidene)-1,2-cyclohexanediaminotitanium chloride (TiSl), VSl, CrSl, MnSl, FeSl, CoSl, and RuSl.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: April 16, 2024
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Shuhei Sakamoto, Yoko Ono, Masahiko Hayashi, Takeshi Komatsu
  • Publication number: 20240082959
    Abstract: A laser processing apparatus includes a support unit that supports a wafer including a plurality of functional elements disposed adjacent to each other via a street, an irradiation unit that irradiates the street with laser light, and a control unit that controls the irradiation unit based on information about the streets so that a first region and a second region of the street are simultaneously irradiated with the laser light, and a power of the laser light for removing a surface layer of the street in the first region is higher than a power for removing the surface layer of the street in the first region. The information about the street includes information that a processing threshold value indicating a difficulty of laser processing in the first region is lower than a processing threshold value in the second region.
    Type: Application
    Filed: December 20, 2021
    Publication date: March 14, 2024
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yo SUGIMOTO, Takeshi SAKAMOTO, Takafumi OGIWARA, Naoki UCHIYAMA, Takashi KURITA, Ryo YOSHIMURA
  • Publication number: 20240072892
    Abstract: An optical signal emitting direction control method of a present embodiment includes arranging a transparent member to extend over an underwater space and an in-air space, causing an optical signal to enter the transparent member from the underwater space via a surface of an underwater portion of the transparent member immersed in the underwater space, and causing the optical signal entered the transparent member to be emitted into the in-air space via a surface of an in-air portion of the transparent member exposed to the in-air space.
    Type: Application
    Filed: January 5, 2021
    Publication date: February 29, 2024
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Kento YOSHIZAWA, Kazumitsu SAKAMOTO, Takeshi KINOSHITA, Etsushi YAMAZAKI, Takayuki MIZUNO, Takuya OHARA
  • Patent number: 11911854
    Abstract: Provided is a solder alloy, a solder paste, a solder preform, and a solder joint which suppress chip cracking during cooling, improve the heat dissipation characteristics of the solder joint, and exhibit high joint strength at high temperatures. The solder alloy has an alloy composition of, by mass: Sb: 9.0 to 33.0%; Ag: more than 4.0% and less than 11.0%; and Cu: more than 2.0% and less than 6.0%, with the balance of Sn. Moreover, the solder paste, the solder preform, and the solder joint all contain said solder alloy.
    Type: Grant
    Filed: December 14, 2019
    Date of Patent: February 27, 2024
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yoshie Tachibana, Takeshi Sakamoto
  • Publication number: 20240053553
    Abstract: An embodiment mounting structure of an optical module includes, in order, a plurality of optical modules, a first optical waveguide component, a first optical connector, a second optical connector, and a second optical waveguide component, in which the first optical connector includes a first magnetic component and accommodates the first optical waveguide component optically connected to the optical modules, the second optical connector includes a second magnetic component and accommodates the second optical waveguide component, and at least one of the first magnetic component or the second magnetic component includes a hard magnetic material, and by causing a magnetic force to act between the first magnetic component and the second magnetic component, an attractive force is applied in a direction in which a gap between facing end surfaces of the first magnetic component and the second magnetic component decreases.
    Type: Application
    Filed: January 12, 2021
    Publication date: February 15, 2024
    Inventors: Kota Shikama, Norio Sato, Takeshi Sakamoto
  • Publication number: 20240051067
    Abstract: A laser processing method includes: a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street; and a second step of, after the first step, irradiating the street with laser light based on information regarding the street such that a surface layer of the street is removed in a first region of the street and the surface layer remains in a second region of the street. The information regarding the street includes information indicating that, when a modified region is formed in the wafer along a line passing through the street, a fracture extending from the modified region does not reach the street along the line in the first region, and reaches the street along the line in the second region.
    Type: Application
    Filed: December 20, 2021
    Publication date: February 15, 2024
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yo SUGIMOTO, Takeshi SAKAMOTO, Takafumi OGIWARA, Naoki UCHIYAMA, Takashi KURITA, Ryo YOSHIMURA
  • Patent number: 11897056
    Abstract: A laser processing apparatus includes an irradiation portion, and a controller. The irradiation portion includes a shaping portion configured to shape the laser light. The controller includes: a determination portion configured to determine a first and a second orientation; a processing controller configured to perform a first process of forming the modified region along a first region and stopping formation of the modified region other than the first region, and a second process of forming the modified region along a second region and stopping formation of the modified region other than the second region; and an adjustment portion configured to adjust the orientation of the longitudinal direction to be the first orientation when the first process is performed, and to adjust the orientation of the longitudinal direction to be the second orientation when the second process is performed.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: February 13, 2024
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi Sakamoto, Katsuhiro Korematsu
  • Publication number: 20240045674
    Abstract: A transfer processing device includes an arithmetic instruction number acquisition circuit, a buffer circuit, a transfer information acquisition circuit, and a software processing unit. The arithmetic instruction number acquisition circuit acquires a transfer instruction number corresponding to transfer information which is information related to the next transfer destination of an arithmetic instruction. The buffer circuit is arranged between the arithmetic instruction number acquisition circuit and the transfer information acquisition circuit, and temporarily stores and relays the arithmetic instruction and the arithmetic instruction number supplied from the arithmetic instruction number acquisition circuit to the transfer information acquisition circuit. The transfer information acquisition circuit acquires transfer information on the basis of the arithmetic instruction number, and gives the acquired transfer information to the arithmetic instruction.
    Type: Application
    Filed: December 10, 2020
    Publication date: February 8, 2024
    Inventors: Tsuyoshi Ito, Kenji Tanaka, Yuki Arikawa, Kazuhiko Terada, Tsutomu Takeya, Takeshi Sakamoto
  • Publication number: 20240033859
    Abstract: A laser processing method includes a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street, a second step of, after the first step, forming a modified region in the wafer along a line passing through the street, and a third step of, after the second step, irradiating the street with laser light such that a surface layer of the street is removed, and a fracture extending from the modified region reaches a bottom surface of a recess formed by removing the surface layer, along the line.
    Type: Application
    Filed: December 20, 2021
    Publication date: February 1, 2024
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yo SUGIMOTO, Takeshi SAKAMOTO, Takafumi OGIWARA, Naoki UCHIYAMA, Takashi KURITA, Ryo YOSHIMURA
  • Publication number: 20240007362
    Abstract: In an NFV system, a protocol processor that receives a packet from an external network, a calculator that implements NFV for performing predetermined processing on the received packet, and an ANN calculator that performs processing using an ANN in the processing of the NFV are mounted on an NIC.
    Type: Application
    Filed: November 30, 2020
    Publication date: January 4, 2024
    Inventors: Kenji Tanaka, Yuki Arikawa, Tsuyoshi Ito, Tsutomu Takeya, Takeshi Sakamoto
  • Publication number: 20240004828
    Abstract: Each NIC performs an aggregation calculation of data output from each processor in a normal order including a head NIC located at a head position of a first pipeline connection, an intermediate NIC located at an intermediate position, and a tail NIC located at a tail position, and when the aggregation calculation in the tail NIC is completed, each NIC starts distribution of an obtained aggregation result, distributes the aggregation result in a reverse order including the tail NIC, the intermediate NIC, and the head NIC, and outputs the aggregation result to the processor of the communication interface.
    Type: Application
    Filed: November 11, 2020
    Publication date: January 4, 2024
    Inventors: Kenji Tanaka, Tsuyoshi Ito, Yuki Arikawa, Tsutomu Takeya, Kazuhiko Terada, Takeshi Sakamoto
  • Publication number: 20230421510
    Abstract: A network card has a plurality of buffers each having different physical performances including a memory access speed or a storage capacity, and a buffer control circuit selects one buffer to be a packet storage destination from among the plurality of buffers on the basis of a priority or a service quality of a packet specified from header information of the packet received by a physical port and the physical performances of the plurality of buffers.
    Type: Application
    Filed: November 13, 2020
    Publication date: December 28, 2023
    Inventors: Yuki Arikawa, Kenji Tanaka, Tsuyoshi Ito, Tsutomu Takeya, Takeshi Sakamoto
  • Publication number: 20230412527
    Abstract: In a network interface card, a buffer is provided with a plurality of queues corresponding to packet priority levels, a packet processing circuit stores a packet in a queue in the buffer corresponding to the priority level obtained from a packet received by a physical port, and a control circuit sequentially selects a queue in the buffer on the basis of the packet priority level and allocates a packet read from the selected queue to a computation/processing circuit.
    Type: Application
    Filed: November 13, 2020
    Publication date: December 21, 2023
    Inventors: Yuki Arikawa, Kenji Tanaka, Tsuyoshi Ito, Tsutomu Takeya, Takeshi Sakamoto
  • Patent number: 11833611
    Abstract: A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: December 5, 2023
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi Sakamoto, Junji Okuma
  • Publication number: 20230385603
    Abstract: A neural architecture search system includes a deployment constraint management unit that converts a first constraint condition that defines a constraint of a system that implements a neural network into a second constraint condition that defines a constraint of a parameter that prescribes an architecture of the neural network, a learning engine unit that performs learning of the neural network under a search condition and calculates inference accuracy in a case where the learned neural network is used, and a model modification unit that causes the learning engine unit to perform the learning and the calculation of the inference accuracy while changing the architecture of the neural network on the basis of the inference accuracy and the second constraint condition so as to obtain the best inference accuracy.
    Type: Application
    Filed: November 12, 2020
    Publication date: November 30, 2023
    Inventors: Yuki Arikawa, Kenji Tanaka, Tsuyoshi Ito, Tsutomu Takeya, Takeshi Sakamoto
  • Patent number: 11828990
    Abstract: An optical connector of the present invention includes a ferrule accommodating optical fibers, a flange integrated with the ferrule, a sleeve in which a pair of the ferrules are accommodated, and a connection component which is provided around the sleeve and includes a magnet or a metallic magnetic material, wherein at least one of the connection component and the flange includes a magnet, and an attractive force acts on the connection component and the flanges, whereby cores of the opposing optical fibers come into close contact with each other. As a result, the optical connector of the present invention can provide the present physical contact connection and can provide a smaller optical connector.
    Type: Grant
    Filed: November 28, 2019
    Date of Patent: November 28, 2023
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Kota Shikama, Norio Sato, Takeshi Sakamoto
  • Patent number: 11823063
    Abstract: Individual distributed processing nodes packetize distributed data for each weight of a neural network of a learning object in an order of a number of the weight, transmit the distributed data to an aggregation processing node, acquire aggregation data transmitted from the node in order, and update the weight of the neural network. The node acquires the transmitted distributed data, packetizes the aggregation data for which the distributed data of all the distributed processing nodes is aggregated for each weight, and transmits the aggregation data to the individual nodes. The individual nodes monitor an unreceived data amount which is a difference between data amounts of the transmitted distributed data and the acquired aggregation data, and when the unreceived data amount becomes equal to or larger than a threshold Ma, stops transmission of the distributed data until the unreceived data amount becomes equal to or smaller than a threshold Mb (Mb<Ma).
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: November 21, 2023
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Tsuyoshi Ito, Kenji Kawai, Junichi Kato, Huycu Ngo, Yuki Arikawa, Takeshi Sakamoto
  • Patent number: 11817319
    Abstract: A laminated element manufacturing method includes a first forming step of forming a first modified region along a line to cut by irradiating a semiconductor substrate of a first wafer with a laser light along the line to cut, a first grinding step of grinding the semiconductor substrate of the first wafer, a bonding step of bonding a circuit layer of a second wafer to the semiconductor substrate of the first wafer, a second forming step of forming a second modified region along the line to cut by irradiating a semiconductor substrate of the second wafer with a laser light along the line to cut, and a second grinding step of grinding the semiconductor substrate of the second wafer.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: November 14, 2023
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi Sakamoto, Ryuji Sugiura, Yuta Kondoh, Naoki Uchiyama
  • Patent number: D1013746
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: February 6, 2024
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Junji Okuma, Takeshi Sakamoto