Abstract: A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In the infrared sensor, supporting portions are disposed at four corners of a substantially rectangular opening in a package. The supporting portions support an optical filter, disposed so as to cover the opening, at positions that are lower than an upper end of an inner peripheral wall defining the opening. While the optical filter is supported by the supporting portions as a result of inserting a portion of a surface side of the optical filter facing the supporting portions into the opening, the optical filter is secured to the package. The optical filter and the package are joined and secured, and electrically connected to each other through a conductive adhesive.

Abstract: Disclosed herein is a solid-state image pickup device, including a pixel, the pixel including: a light receiving section; a charge transfer path; a transfer electrode; a readout gate section; and a readout electrode.

Abstract: A solid-state imaging device includes a semiconductor substrate, one or more wiring interlayer films disposed on or above the semiconductor substrate, and one or more metal wires embedded in the wiring interlayer films. The one or more wiring interlayer films are composed of a diffusion preventing material that prevents the diffusion of the metal wire.

Abstract: An economical and highly reliable infrared sensor with a wide field of view and a method for economically manufacturing a highly reliable infrared sensor with a wide field of view includes a package having supporting portions that support an optical filter at a location below the upper surfaces of sidewalls of the package and recessed portions that communicate with gaps between side surfaces of the optical filter supported by the supporting portions and the sidewalls of the package. An adhesive is supplied to the recessed portions while the optical filter is supported by the supporting portions such that the adhesive flows into the gaps between the optical filter and the sidewalls of the package by capillary action and such that the optical filter is fixed to an opening of the package via the adhesive. The optical filter is fixed to the package via the adhesive by applying the adhesive such that the adhesive spreads over substantially the entire circumference of the optical filter.

Abstract: Disclosed herein is a solid-state imaging device including a first transfer electrode portion and a second transfer electrode portion having a pattern area rate higher than that of the first transfer electrode portion. The first transfer electrode portion includes a plurality of first transfer electrodes having a single-layer structure of metal material. The second transfer electrode portion includes a plurality of second transfer electrodes having a single-layer structure of polycrystalline silicon or amorphous silicon.

Abstract: An electronic component package that provides a high shielding performance and that can prevent failures such as short-circuiting with a component contained therein. A package includes a shield case formed of a metal plate and shaped to have a bottom portion, the bottom portion having a through hole; a resin case molded on inner and outer surfaces of the shield case and shaped to have a bottom portion; and a hot terminal that is insert-molded in the resin case such that the hot terminal is inserted into the shield case through the through hole without contact. One end of the hot terminal is exposed at an inner surface of the resin case, and the other end of the hot terminal is exposed at an outer surface of the resin case. An element contained in the package is surrounded by the shield case so that good shielding performance is obtained.

Abstract: A solid-state imaging device includes a semiconductor substrate, one or more wiring interlayer films disposed on or above the semiconductor substrate, and one or more metal wires embedded in the wiring interlayer films. The one or more wiring interlayer films are composed of a diffusion preventing material that prevents the diffusion of the metal wire.

Abstract: A solid-state imaging apparatus includes a plurality of photoelectric conversion units configured to generate signal charge from light received at light-receiving surfaces thereof, the plurality of photoelectric conversion units being provided in the image-sensing area of a substrate; a charge reading unit configured to read signal charge generated by the photoelectric conversion units, a charge readout channel area thereof being provided in the image-sensing area of the substrate; a transfer register unit configured to transfer signal charge read from the plurality of photoelectric conversion units by the charge reading unit, a charge transfer channel area thereof being provided in the image-sensing area of the substrate; and a light-shielding unit that is provided in the image-sensing area of the substrate and that has an opening through which light is transmitted formed in an area corresponding to a light-receiving surface of a respective photoelectric conversion unit.

Abstract: The present invention provides a semiconductor device comprising a metal interconnect having considerably improved electromigration resistance and/or stress migration resistance. The copper interconnect 107 comprises a silicon-lower concentration region 104 and a silicon solid solution layer 106 disposed thereon. The silicon solid solution layer 106 has a structure, in which silicon atoms are introduced within the crystal lattice structure that constitutes the copper interconnect 107 to be disposed within the lattice as inter-lattice point atoms or substituted atoms. The silicon solid solution layer 106 has the structure, in which the crystal lattice structure of copper (face centered cubic lattice; lattice constant is 3.6 angstrom) remains, while silicon atoms are introduced as inter-lattice point atoms or substituted atoms.

Abstract: A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In the infrared sensor, supporting portions are disposed at four corners of a substantially rectangular opening in a package. The supporting portions support an optical filter, disposed so as to cover the opening, at positions that are lower than an upper end of an inner peripheral wall defining the opening. While the optical filter is supported by the supporting portions as a result of inserting a portion of a surface side of the optical filter facing the supporting portions into the opening, the optical filter is secured to the package. The optical filter and the package are joined and secured, and electrically connected to each other through a conductive adhesive.

Abstract: A bone conductive speaker in which the hearing of external sounds is not inhibited because the earhole is not closed, the hearing efficiency is high and the sound leakage is small because the tragus portion is vibrated locally, and moreover the configuration is simple and the putting-on and taking-off operations are easy to perform. The bone conductive speaker comprises a bone conductive speaker body (1) and holding means (2) which is attached to the bone conductive speaker body (1) to hold the bone conductive speaker body (1) so that the bone conductive speaker body (1) is brought into contact with the tragus (31) or a portion in the vicinity thereof. The holding means (2) is of a ring shape having a size accommodated in the concha cavity (30), and both outside face parts thereof come into contact with the inside portion of the tragus (31) and the inside surface of the concha cavity (30) to continuously push them, by which the holding means (2) is locked at that position.

Abstract: A method for producing a solid-state imaging device includes steps of: forming transfer electrodes on a substrate having a plurality of light-sensing portions through a gate insulating layer so that the light-sensing portions are exposed; forming a planarized insulating layer on the substrate to cover the transfer electrodes formed on the substrate; forming openings in the planarized insulating layer so that each of the transfer electrodes is partly exposed out of the planarized insulating layer at a predetermined position; forming a wiring material layer so that the openings are filled with the wiring material layer; forming a resist layer on the wiring material layer; exposing and developing the resist layer so that only the resist layer in a predetermined area covering the openings is left; and patterning the wiring material layer using the exposed and developed resist layer to form connection wirings connected to the transfer electrodes by the openings.

Abstract: A method of manufacturing a solid state imaging device having a photo-electric conversion portion array and a transfer electrode array, these arrays being provided in parallel to each other, upper surfaces and side wall surfaces of the transfer electrode array being covered with a light-shielding layer, and a transparent layer showing an oxidizing property at the time of film formation, the transparent layer being formed on the photo-electric conversion parts and the light-shielding layer.

Abstract: A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In the infrared sensor, supporting portions are disposed at four corners of a substantially rectangular opening in a package. The supporting portions support an optical filter, disposed so as to cover the opening, at positions that are lower than an upper end of an inner peripheral wall defining the opening. While the optical filter is supported by the supporting portions as a result of inserting a portion of a surface side of the optical filter facing the supporting portions into the opening, the optical filter is secured to the package. The optical filter and the package are joined and secured, and electrically connected to each other through a conductive adhesive.

Abstract: Disclosed herein is a solid-state image pickup device including, a plurality of light receiving units, a transfer channel, a first transfer electrode, a second transfer electrode, first wiring, and second wiring.

Abstract: An economical and highly reliable infrared sensor with a wide field of view and a method for economically manufacturing a highly reliable infrared sensor with a wide field of view includes a package having supporting portions that support an optical filter at a location below the upper surfaces of sidewalls of the package and recessed portions that communicate with gaps between side surfaces of the optical filter supported by the supporting portions and the sidewalls of the package. An adhesive is supplied to the recessed portions while the optical filter is supported by the supporting portions such that the adhesive flows into the gaps between the optical filter and the sidewalls of the package by capillary action and such that the optical filter is fixed to an opening of the package via the adhesive. The optical filter is fixed to the package via the adhesive by applying the adhesive such that the adhesive spreads over substantially the entire circumference of the optical filter.

Abstract: An average face composition is produced by computer graphic methods surveying average facial features, skin color, lip color and eye color among plural faces representing different human races. Enquiries are performed among a plurality of different people to receive their replies to questions on the obtained faces on which various cosmetics were furnished. The collected comments were analyzed to prepare color maps, whereby necessary information and images were established to enable selection of suitable cosmetics.

Abstract: A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In the infrared sensor, supporting portions are disposed at four corners of a substantially rectangular opening in a package. The supporting portions support an optical filter, disposed so as to cover the opening, at positions that are lower than an upper end of an inner peripheral wall defining the opening. While the optical filter is supported by the supporting portions as a result of inserting a portion of a surface side of the optical filter facing the supporting portions into the opening, the optical filter is secured to the package. The optical filter and the package are joined and secured, and electrically connected to each other through a conductive adhesive.

Abstract: An electronic component package that provides a high shielding performance and that can prevent failures such as short-circuiting with a component contained therein. A package includes a shield case formed of a metal plate and shaped to have a bottom portion, the bottom portion having a through hole; a resin case molded on inner and outer surfaces of the shield case and shaped to have a bottom portion; and a hot terminal that is insert-molded in the resin case such that the hot terminal is inserted into the shield case through the through hole without contact. One end of the hot terminal is exposed at an inner surface of the resin case, and the other end of the hot terminal is exposed at an outer surface of the resin case. An element contained in the package is surrounded by the shield case so that good shielding performance is obtained.

Abstract: A spectacle type communication device wearable in the same feeling as in wearing normal spectacles, preventing tired feeling and uncomfortable feeling from providing to a wearer even if the wearer uses it for a long time, and capable of providing excellent aesthetic appearance. In the communication device formed in a spectacle style, bone-conduction speakers (3) separated from a communication device body (7) having an amplifier circuit and a battery are mounted on temples (2) or ear pads (4) and supported to be brought into contact with tragus (10) or near jaw joints slightly forward of the tragus (10), and the connection parts (5) of cables (8) extending from the communication device body (7) are disposed on the temples (2) or the ear pads (4).