Abstract: This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.

Abstract: This acidic electrolytic copper plating solution contains a soluble copper salt, an azole compound which has 2 or 3 nitrogen atoms in a five-membered ring and serves as a copper ion electrodeposition inhibitor, an acid, and water, in which a copper concentration is 0.1 mol/L or more, an azole compound concentration is 10 mmol/L or more and 50 mmol/L or less, and a chloride ion concentration is 10 ppm or less.

Abstract: This bonding sheet (10, 20) with a preform layer (13) is a bonding sheet (10, 20) for bonding a substrate (16) and an electronic component (17), the bonding sheet (10, 20) includes a copper sheet (11) and a porous preform layer (13) including copper particles (12) provided on one surface or both surfaces of the copper sheet (11), in which surfaces of the copper particles (12) are coated with copper nanoparticles (12a) having an average particle diameter smaller than an average particle diameter of the copper particles (12), the average particle diameter of the copper nanoparticles (12a) calculated from a BET value is 9.59 nm or more and 850 nm or less, and an average porosity of the preform layer (13) is 11% or more and 78% or less.

Abstract: What is provided is stannous oxide having an ?-ray emission amount of 0.002 cph/cm2 or less after heating in an atmosphere at 100° C. for 6 hours. Tin containing lead as an impurity is dissolved in a sulfuric acid aqueous solution to prepare a tin sulfate aqueous solution, and lead sulfate is precipitated in the aqueous solution and removed. While stirring the tin sulfate aqueous solution from which lead sulfate has been removed, a lead nitrate aqueous solution containing lead having an ?-ray emission amount of 10 cph/cm2 or less is added to cause lead sulfate to be precipitated in the tin sulfate aqueous solution, and simultaneously the tin sulfate aqueous solution is circulated while removing the lead sulfate from the aqueous solution. A neutralizing agent is added to the tin sulfate aqueous solution to collect stannous oxide.

Abstract: Any metal having a low ?-ray emission, the metal being any one of tin, silver, copper, zinc, or indium, wherein an emission of an ?-ray after heating the metal at 100° C. in an atmosphere for six hours is 0.002 cph/cm2 or less. Any metal of tin, silver, copper, zinc and indium each including lead as an impurity is dissolved to prepare a hydrosulfate aqueous solution of the metal and lead sulfate is precipitated and removed in the solution. The lead sulfate is precipitated in the hydrosulfate aqueous solution by adding a lead nitrate aqueous solution including lead having an ?-ray emission of 10 cph/cm2 or less to the hydrosulfate aqueous solution, from which the lead sulfate has been removed, and, at the same time, the solution is circulated while removing the lead sulfate to electrowinning the metal using the hydrosulfate aqueous solution as an electrolytic solution.

Abstract: This metal paste for bonding includes a metal powder, a copper salt, an amine, and an alcohol, in which a ratio A/B of a weight A of Cu in the copper salt to a weight B of the metal powder is set to be in a range of 0.02 or more and 0.25 or less, the metal paste is in a paste form in a temperature range of 15° C. or higher and 35° C. or lower, a liquid phase is generated in a temperature raising process starting from 35° C., the liquid phase dissipates in the temperature raising process at a liquid phase generation temperature or higher, and a metal sintered body is formed at a liquid phase dissipation temperature or higher.

Abstract: A member for a plasma processing apparatus includes a base material and a heat transfer layer provided on one surface of the base material, and the heat transfer layer contains at least one of a fluorine-based resin and a fluorine-based elastomer.

Abstract: Any metal having a low ?-ray emission, the metal being any one of tin, silver, copper, zinc, or indium, wherein an emission of an ?-ray after heating the metal at 100° C. in an atmosphere for six hours is 0.002 cph/cm2 or less. Any metal of tin, silver, copper, zinc and indium each including lead as an impurity is dissolved to prepare a hydrosulfate aqueous solution of the metal and lead sulfate is precipitated and removed in the solution. The lead sulfate is precipitated in the hydrosulfate aqueous solution by adding a lead nitrate aqueous solution including lead having an ?-ray emission of 10 cph/cm2 or less to the hydrosulfate aqueous solution, from which the lead sulfate has been removed, and, at the same time, the solution is circulated while removing the lead sulfate to electrowinning the metal using the hydrosulfate aqueous solution as an electrolytic solution.

Abstract: This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.

Abstract: This silver paste includes a silver powder and a solvent, in which the silver powder includes first silver particles having a particle size of 100 nm or more and less than 500 nm, second silver particles having a particle size of 50 nm or more and less than 100 nm, and third silver particles having a particle size of 1000 nm or more and less than 10000 nm, and the content of the first silver particles is 12% by volume or more and 90% by volume or less, the content of the second silver particles is 1% by volume or more and 38% by volume or less, and the content of the third silver particles is 5% by volume or more and 80% by volume or less, regarding a total amount of the silver powder as 100% by volume.

Abstract: What is provided is stannous oxide having an ?-ray emission amount of 0.002 cph/cm2 or less after heating in an atmosphere at 100° C. for 6 hours. Tin containing lead as an impurity is dissolved in a sulfuric acid aqueous solution to prepare a tin sulfate aqueous solution, and lead sulfate is precipitated in the aqueous solution and removed. While stirring the tin sulfate aqueous solution from which lead sulfate has been removed, a lead nitrate aqueous solution containing lead having an ?-ray emission amount of 10 cph/cm2 or less is added to cause lead sulfate to be precipitated in the tin sulfate aqueous solution, and simultaneously the tin sulfate aqueous solution is circulated while removing the lead sulfate from the aqueous solution. A neutralizing agent is added to the tin sulfate aqueous solution to collect stannous oxide.

Abstract: Any metal having a low ?-ray emission, the metal being any one of tin, silver, copper, zinc, or indium, wherein an emission of an ?-ray after heating the metal at 100° C. in an atmosphere for six hours is 0.002 cph/cm2 or less. Any metal of tin, silver, copper, zinc and indium each including lead as an impurity is dissolved to prepare a hydrosulfate aqueous solution of the metal and lead sulfate is precipitated and removed in the solution. The lead sulfate is precipitated in the hydrosulfate aqueous solution by adding a lead nitrate aqueous solution including lead having an a-ray emission of 10 cph/cm2 or less to the hydrosulfate aqueous solution, from which the lead sulfate has been removed, and, at the same time, the solution is circulated while removing the lead sulfate to electrowinning the metal using the hydrosulfate aqueous solution as an electrolytic solution.

Abstract: The SnAg alloy plating solution of the invention is a SnAg alloy plating solution including a water-soluble tin compound, a water-soluble silver compound, and a particular sulfide compound in an amount in the range of 0.25 mol or more and 10 mol or less with respect to 1 mol of silver in the water-soluble silver compound.

Abstract: A tin alloy plating solution comprising a soluble tin salt, a soluble salt of a metal nobler than tin, and a sulfide compound represented by general formula (I). In formula (I), n is 1 to 3. The metal nobler than tin is preferably silver, copper, gold, or bismuth.

Abstract: The SnAg alloy plating solution of the invention is a SnAg alloy plating solution including a water-soluble tin compound, a water-soluble silver compound, and a particular sulfide compound in an amount in the range of 0.25 mol or more and 10 mol or less with respect to 1 mol of silver in the water-soluble silver compound.

Abstract: A stannous oxide powder which has a high dissolution rate into various acid solutions such as a plating solution and is particularly suitable as a Sn supply material to a plating solution, and a method for producing the stannous oxide powder are provided. The stannous oxide powder is a particle body having a plurality of plate-like protrusions protruding outward, and has an average particle size in a range of 1 ?m to 15 ?m.

Abstract: A stannous oxide powder which has a high dissolution rate into various acid solutions such as a plating solution and is particularly suitable as a Sn supply material to a plating solution, and a method for producing the stannous oxide powder are provided. The stannous oxide powder is a particle body having a plurality of plate-like protrusions protruding outward, and has an average particle size in a range of 1 ?m to 15 ?m.

Abstract: The method of producing stannous oxide includes: a Sn ion-containing acid solution forming step (S01); a first neutralizing step (S02), which is a step of forming Sn precipitates by adding one or more of alkaline solutions of ammonium carbonate, ammonium bicarbonate, and aqueous ammonia to the Sn ion-containing acid solution to retain pH at 3-6 therein; a Sn precipitate separating step (S03); a Sn precipitate dispersing step (S04), which is a step of dispersing the separated Sn precipitates in a solvent liquid to obtain a dispersion liquid; and a second neutralizing step (S06), which is a step of forming SnO by adding an alkaline solution to the dispersion liquid of the Sn precipitates and then by heating, wherein Na, K, Pb, Fe, Ni, Cu, Zn, Al, Mg, Ca, Cr, Mn, Co, In, and Cd reside in the Sn ion-containing acid solution in the first neutralizing step (S02).

Abstract: A stannous oxide powder which has a high dissolution rate into various acid solutions such as a plating solution and is particularly suitable as a Sn supply material to a plating solution, and a method for producing the stannous oxide powder are provided. The stannous oxide powder is a particle body having a plurality of plate-like protrusions protruding outward, and has an average particle size in a range of 1 ?m to 15 ?m.

Abstract: The method of producing stannous oxide includes: a Sn ion-containing acid solution forming step (S01); a first neutralizing step (S02), which is a step of forming Sn precipitates by adding one or more of alkaline solutions of ammonium carbonate, ammonium bicarbonate, and aqueous ammonia to the Sn ion-containing acid solution to retain pH at 3-6 therein; a Sn precipitate separating step (S03); a Sn precipitate dispersing step (S04), which is a step of dispersing the separated Sn precipitates in a solvent liquid to obtain a dispersion liquid; and a second neutralizing step (S06), which is a step of forming SnO by adding an alkaline solution to the dispersion liquid of the Sn precipitates and then by heating, wherein Na, K, Pb, Fe, Ni, Cu, Zn, Al, Mg, Ca, Cr, Mn, Co, In, and Cd reside in the Sn ion-containing acid solution in the first neutralizing step (S02).