Patents by Inventor Takuma KUROYANAGI

Takuma KUROYANAGI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10911019
    Abstract: A multiplexer includes: a substrate having a surface; another substrate having another surface facing the surface across an air gap; a filter that is located on the surface, and includes first series resonators in a first series pathway from a common terminal to a terminal, and first parallel resonators in first parallel pathways; another filter that is located on the another surface, and includes second series resonators in a second series pathway from the common terminal to another terminal, and second parallel resonators in second parallel pathways, a second parallel resonator closest to the another terminal and a second series resonator closest to the another terminal not overlapping with the first series pathway, at least a part of the second parallel pathways overlapping with at least a part of first pathways between the first series pathway and the first parallel resonators, the first parallel resonators, and the first series pathway.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: February 2, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Fumiaki Isaka, Yasuhisa Okamoto, Takuma Kuroyanagi
  • Patent number: 10903819
    Abstract: A communication module includes: a first substrate having a first surface; a second substrate having a second surface, the second surface facing the first surface across an air gap; a first filter located on the first surface, a passband of the first filter being either one of a transmit band and a receive band of a first band, the first band being a frequency division duplex band; and a second filter located on the second surface, at least a part of the second filter overlapping with at least a part of the first filter in a stacking direction in which the first substrate and the second substrate are stacked, a passband of the second filter being at least one of a transmit band and a receive band of a second band, the second band differing from the first band.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: January 26, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Takuma Kuroyanagi
  • Patent number: 10886891
    Abstract: An acoustic wave device includes: first and second terminals located on a first surface of a first substrate; a third terminal that is located on the first surface and is a ground terminal; series resonators located on a second surface of the first substrate and electrically connected in series with a path between the first and second terminals; a parallel resonator that is located on the second surface and has a first end electrically connected to the path and a second end electrically connected to the third terminal; and a fourth terminal located on the first surface, at least a part of the fourth terminal overlapping with, in a thickness direction of the first substrate, at least one of one or more first series resonators of the series resonators, the one or more first series resonators having both ends to which other series resonators are electrically connected.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: January 5, 2021
    Assignee: TAIYO YODEN CO., LTD.
    Inventors: Takuma Kuroyanagi, Mitsuhiro Habuta
  • Patent number: 10826460
    Abstract: A multiplexer includes: a filter located on a surface of a substrate and including first series and parallel resonators and a first wiring line; and another filter located on another surface of another substrate and including second series and parallel resonators and a second wiring line, each of first resonators among the second series and parallel resonators overlapping with the first series and parallel resonators, and/or the first wiring line, each of second resonators other than the first resonators among the second series and parallel resonators overlapping with none of the first series and parallel resonators and the first wiring line, when capacitances of series and parallel resonators in first basic sections including the first resonators are represented by Cs1 and Cp1, and capacitances of series and parallel resonators in second basic sections not including the first resonators are represented by Cs2 and Cp1, Cp1/Cs1 being less than Cp2/Cs2.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: November 3, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Daiki Itou, Yasuhisa Okamoto, Takuma Kuroyanagi, Fumiaki Isaka
  • Patent number: 10665566
    Abstract: An electronic component includes: a substrate; a device chip including a functional element located on a lower surface thereof and mounted on an upper surface of the substrate so that the functional element faces the upper surface of the substrate across an air gap; a ring-shaped metal layer located on the upper surface of the substrate and surrounding the device chip in plan view, a side surface of the ring-shaped metal layer being located further in than a side surface of the substrate; a metal sealing portion surrounding the device chip in plan view and bonding with an upper surface of the ring-shaped metal layer, a side surface of the metal sealing portion being located further out than the side surface of the ring-shaped metal layer; and a metal film located on the side surface of the metal sealing portion and the side surface of the ring-shaped metal layer.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: May 26, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Takuma Kuroyanagi
  • Publication number: 20200099361
    Abstract: An acoustic wave device includes: a first substrate that has a first surface and a second surface, the second surface being an opposite surface of the first substrate from the first surface; an acoustic wave element that is located on the first surface; a wiring portion that electrically connects the acoustic wave element and a metal portion through a through hole, the metal portion being located on the second surface, the through hole penetrating through the first substrate; and a sealing portion that is located on the first surface so as to surround the acoustic wave element, overlaps with at least a part of the through hole in plan view, and seals the acoustic wave element in an air gap.
    Type: Application
    Filed: July 12, 2019
    Publication date: March 26, 2020
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kazushige HATAKEYAMA, Naoki KAKITA, Takuma KUROYANAGI
  • Patent number: 10560068
    Abstract: A multiplexer includes: first and second substrate respectively having first and second surfaces facing each other across an air gap; a first filter including first resonators located on the first surface and connected between a common terminal and a first terminal; a second filter including second resonators located on the second surface and connected between the common terminal and a second terminal, a first resonator connected in series between the common terminal and the first terminal and closest to the common terminal overlapping with a second resonator connected in series between the common terminal and the second terminal and closest to the common terminal, first resonators other than the first resonator closest to the common terminal not overlapping with the second resonators, second resonators other than the second resonator closest to the common terminal not overlapping with the first resonators.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: February 11, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Takuma Kuroyanagi
  • Publication number: 20200028491
    Abstract: A communication module includes: a first substrate having a first surface; a second substrate having a second surface, the second surface facing the first surface across an air gap; a first filter located on the first surface, a passband of the first filter being either one of a transmit band and a receive band of a first band, the first band being a frequency division duplex band; and a second filter located on the second surface, at least a part of the second filter overlapping with at least a part of the first filter in a stacking direction in which the first substrate and the second substrate are stacked, a passband of the second filter being at least one of a transmit band and a receive band of a second band, the second band differing from the first band.
    Type: Application
    Filed: May 21, 2019
    Publication date: January 23, 2020
    Applicant: TAIYO YUDEN CO., LTD.
    Inventor: Takuma KUROYANAGI
  • Publication number: 20190312568
    Abstract: A multiplexer includes: a substrate having a surface; another substrate having another surface facing the surface across an air gap; a filter that is located on the surface, and includes first series resonators in a first series pathway from a common terminal to a terminal, and first parallel resonators in first parallel pathways; another filter that is located on the another surface, and includes second series resonators in a second series pathway from the common terminal to another terminal, and second parallel resonators in second parallel pathways, a second parallel resonator closest to the another terminal and a second series resonator closest to the another terminal not overlapping with the first series pathway, at least a part of the second parallel pathways overlapping with at least a part of first pathways between the first series pathway and the first parallel resonators, the first parallel resonators, and the first series pathway.
    Type: Application
    Filed: March 8, 2019
    Publication date: October 10, 2019
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Fumiaki ISAKA, Yasuhisa OKAMOTO, Takuma KUROYANAGI
  • Publication number: 20190280670
    Abstract: An acoustic wave device includes: first and second terminals located on a first surface of a first substrate; a third terminal that is located on the first surface and is a ground terminal; series resonators located on a second surface of the first substrate and electrically connected in series with a path between the first and second terminals; a parallel resonator that is located on the second surface and has a first end electrically connected to the path and a second end electrically connected to the third terminal; and a fourth terminal located on the first surface, at least a part of the fourth terminal overlapping with, in a thickness direction of the first substrate, at least one of one or more first series resonators of the series resonators, the one or more first series resonators having both ends to which other series resonators are electrically connected.
    Type: Application
    Filed: February 6, 2019
    Publication date: September 12, 2019
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Takuma KUROYANAGI, Mitsuhiro HABUTA
  • Patent number: 10396757
    Abstract: An acoustic wave device includes: a first piezoelectric substrate; a first IDT that includes a plurality of first electrode fingers and is located on a first surface of the first piezoelectric substrate; a second piezoelectric substrate that is located above the first surface; and a second IDT that is located on a second surface of the second piezoelectric substrate, and includes a plurality of second electrode fingers that are non-parallel to the plurality of first electrode fingers, the second surface of the second piezoelectric substrate facing the first surface across an air gap.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: August 27, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Naoki Kakita, Takuma Kuroyanagi
  • Publication number: 20190260351
    Abstract: A multiplexer includes: a filter located on a surface of a substrate and including first series and parallel resonators and a first wiring line; and another filter located on another surface of another substrate and including second series and parallel resonators and a second wiring line, each of first resonators among the second series and parallel resonators overlapping with the first series and parallel resonators, and/or the first wiring line, each of second resonators other than the first resonators among the second series and parallel resonators overlapping with none of the first series and parallel resonators and the first wiring line, when capacitances of series and parallel resonators in first basic sections including the first resonators are represented by Cs1 and Cp1, and capacitances of series and parallel resonators in second basic sections not including the first resonators are represented by Cs2 and Cp1, Cp1/Cs1 being less than Cp2/Cs2.
    Type: Application
    Filed: December 28, 2018
    Publication date: August 22, 2019
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Daiki ITOU, Yasuhisa OKAMOTO, Takuma KUROYANAGI, Fumiaki ISAKA
  • Patent number: 10270414
    Abstract: An acoustic wave device includes: a support substrate; a piezoelectric substrate that is jointed on the support substrate; a plurality of acoustic wave elements that are provided on the piezoelectric substrate; and an interconnection line that is provided on the piezoelectric substrate and couples the plurality of acoustic wave elements, wherein: the piezoelectric substrate of a first area, on which the plurality of acoustic wave elements are provided, is remained; the piezoelectric substrate of a second area, on which the interconnection line is provided, is remained; the piezoelectric substrate of a third area is for cutting the support substrate; and the piezoelectric substrates of a fourth area is other than the first area, the second area and the third area, the fourth area having a fifth area in which at least a part of the piezoelectric substrate is removed.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: April 23, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takuma Kuroyanagi, Kaoru Sakinada
  • Patent number: 10250219
    Abstract: An acoustic wave device includes: a first substrate that includes a first acoustic wave filter located on an upper surface of the first substrate; a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second acoustic wave filter on a lower surface of the second substrate, the lower surface of the second substrate facing the upper surface of the first substrate across an air gap; and a shield electrode that is supported by the upper surface of the first substrate, and is located between at least a part of the first acoustic wave filter and at least a part of the second acoustic wave filter through the air gap.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: April 2, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Kazushige Hatakeyama, Takuma Kuroyanagi
  • Patent number: 10250222
    Abstract: An electronic device includes: a first substrate including a first functional element located on an upper surface of the first substrate; a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second functional element located on a lower surface of the second substrate; and a sealing member that is located on the upper surface of the first substrate, surrounds the second substrate in plan view, is not located between the first substrate and the second substrate, seals the first functional element and the second functional element so that the first functional element and the second functional element are located across an air gap.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: April 2, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takuma Kuroyanagi, Kazushige Hatakeyama
  • Patent number: 10250223
    Abstract: An acoustic wave device includes: a first substrate including a support substrate and a piezoelectric substrate bonded on an upper surface of the support substrate, and including a first acoustic wave element located on an upper surface of the piezoelectric substrate; a ring-shaped metal layer located in a region that surrounds the first acoustic wave element and in which the piezoelectric substrate is removed, a second substrate flip-chip mounted on an upper surface of the first substrate and including a functional element located on a lower surface of the second substrate; and a metallic member located on an upper surface of the ring-shaped metal layer, surrounding the second substrate in plan view, not located between the first substrate and the second substrate, and sealing the first acoustic wave element and the functional element so that the first acoustic wave element and the functional element are located across an air gap.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: April 2, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Tomoyuki Kurihara, Kazushige Hatakeyama, Takuma Kuroyanagi, Yohei Shimizu, Masahiro Sato, Naoki Kakita, Kazutaka Suzuki
  • Patent number: 10218334
    Abstract: An acoustic wave device includes: a substrate; an acoustic wave resonator that is formed on the substrate; a first wiring line that is formed on the substrate and is electrically coupled to the acoustic wave resonator; and a second wiring line that is electrically coupled to the first wiring line, at least a part of the second wiring line being formed immediately above the acoustic wave resonator across an air gap.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: February 26, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yasufumi Kaneda, Takuma Kuroyanagi, Kazushige Hatakeyama
  • Publication number: 20180358167
    Abstract: An electronic component includes: a first substrate having a first surface; a second substrate having a second surface facing the first surface across an air gap; a first coil pattern that is located on the first surface so as to face the second surface across the air gap; a second coil pattern that is located in a second region on the second surface and faces the first surface across the air gap, at least a part of the second region overlapping with a first region in plan view, the first region being formed of a region in which the first coil pattern is located and a region surrounded by the first coil pattern; and a connection terminal connecting the first coil pattern and the second coil pattern.
    Type: Application
    Filed: May 22, 2018
    Publication date: December 13, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Hitoshi TSUKIDATE, Takuma KUROYANAGI
  • Patent number: 10097158
    Abstract: Acoustic wave device includes: a piezoelectric substrate; a first IDT located on the piezoelectric substrate; and a second IDT located on the piezoelectric substrate and connected in series to the first IDT, wherein the first IDT and the second IDT share a single common bus bar as a first bus bar of two bus bars of the first IDT and a first bus bar of two bus bars of the second IDT, and the common bus bar has a width not more than two times a wavelength of an acoustic wave propagating through the first and second IDTs, the common bus bar connects to no dummy electrode finger facing a tip of an electrode finger connected to a second bus bar of the two bus bars of the first IDT and the second IDT across a gap.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: October 9, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yasufumi Kaneda, Takuma Kuroyanagi, Hitoshi Tsukidate, Osamu Ikata, Kaoru Sakinada, Michio Miura, Tooru Takezaki
  • Patent number: 10090825
    Abstract: An acoustic wave device includes: a first substrate; a first acoustic wave filter located on a first surface of the first substrate; a pad that is located on the first surface and electrically separated from the first acoustic wave filter in the first surface; a ground pattern that is located on the first surface, and is located between the pad and the first acoustic wave filter in the first surface; and a second acoustic wave filter that is electrically connected to the pad, and at least partially overlaps with the first acoustic wave filter in plan view.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: October 2, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Takuma Kuroyanagi