Abstract: A carrier transfer facilitating device does not require, for example, renewal (replacement) of an existing load port. Specifically, a carrier transfer facilitating device is provided for a load port on which a FOUP is placed. The carrier transfer facilitating device includes a temporary table on which the FOUP is temporarily placed, a carrier transferring carriage that travels above a carrier table of the load port and the temporary table in the horizontal direction and that lifts and transfers the FOUP between the carrier table and the temporary table, a supporting member that supports the temporary table and the carrier transferring carriage, and a controller that controls the movement of the carrier transferring carriage so as to avoid contact of the carrier transferring carriage with the FOUP while the FOUP is transferred between the hoop supporting table or the temporary table and an OHT.

Abstract: The wafer transport apparatus prevents contaminant deposited on an unprocessed wafer from adhering to a processed wafer. Carrying-in load port 2A is loaded with a FOUP 1 storing an unprocessed wafer W1. Carrying-in chamber 3A has a transport robot 4A which takes out the unprocessed wafer W1 from the FOUP 1. Carrying-in load lock 5A is accessed by the transport robot 4A from the carrying-in chamber 3A side. Carrying-out load port 2B is loaded with the FOUP 1 that can store a processed wafer W2. Carrying-out chamber 3B has a transport robot 4B which passes the processed wafer W2 to the FOUP 1. Carrying-out load lock 5B is accessed by the transport robot 4B from the carrying-out chamber 3B side. The carrying-in chamber 3A and carrying-out chamber 3B are separated from each other. The carrying-in load lock 5A and carrying-out load lock 5B are arranged on different stages.

Abstract: A wafer detecting apparatus detects storage states of a plurality of wafers stored in a wafer container. The plurality of wafers are stored substantially horizontal in slots in the wafer container to be transferred in and out of a front opening of the wafer container. The wafer detecting apparatus includes a vertically extending illumination device that emits light through the front opening onto the plurality of wafers and an imaging device that receives the light reflected from the plurality of wafers. The imaging device is arranged substantially directly in front of the wafer container and the illumination device is arranged in at least one of left and right sides of the imaging device.

Abstract: A load port is disclosed which allows a wafer to be transferred between the inside of a FOUP and the inside of a semiconductor fabrication apparatus even during a purge operation. The load port is provided adjacent the semiconductor fabrication apparatus in a clean room and includes a purge stage having a purge port through which a gas atmosphere in the FOUP is replaced into nitrogen gas or dry air, an opener stage provided in a juxtaposed relationship with the purge stage and having an opening communicating with the inside of the semiconductor fabrication apparatus and a door section capable of opening and closing the opening, and a moving mechanism for moving the FOUP between the purge stage and the opener stage.

Abstract: Disclosed herein is an apparatus including: a table configured to receive a container that stores an object therein, the container including a bottom surface provided with a positioning groove and including a charging inlet through which a gas is charged into the container; a positioning pin projecting from the table and adapted to engage with the positioning groove of the container; a nozzle configured to charge the gas into the container through the charging inlet; and a drive unit configured to move the nozzle into contact with the charging inlet of the container after the positioning pin is engaged with the positioning groove.

Abstract: An OHT conveyer vehicle places a FOUP on first and second on platforms. A third platform can move to a position overlapping with the first and second platform by a moving device, and then to a position at which an upper surface of the third platform is above upper surfaces of the first and second platforms by an elevation device. Therefore, the FOUP is placed on the third platform. Subsequently, the third platform can move to a position overlapping with fourth and fifth platforms by the moving device, and then to a position at which the third platform is lower than the fourth and fifth platforms by the elevation device. Therefore, the FOUP is placed on the fourth and fifth platforms.

Abstract: A wafer detecting apparatus detects storage states of a plurality of wafers stored in a wafer container. The plurality of wafers are stored substantially horizontal in slots in the wafer container to be transferred in and out of a front opening of the wafer container. The wafer detecting apparatus includes a vertically extending illumination device that emits light through the front opening onto the plurality of wafers and an imaging device that receives the light reflected from the plurality of wafers. The imaging device is arranged substantially directly in front of the wafer container and the illumination device is arranged in at least one of left and right sides of the imaging device.

Abstract: A carrier transfer facilitating device does not require, for example, renewal (replacement) of an existing load port. Specifically, a carrier transfer facilitating device is provided for a load port on which a FOUP is placed. The carrier transfer facilitating device includes a temporary table on which the FOUP is temporarily placed, a carrier transferring carriage that travels above a carrier table of the load port and the temporary table in the horizontal direction and that lifts and transfers the FOUP between the carrier table and the temporary table, a supporting member that supports the temporary table and the carrier transferring carriage, and a controller that controls the movement of the carrier transferring carriage so as to avoid contact of the carrier transferring carriage with the FOUP while the FOUP is transferred between the hoop supporting table or the temporary table and an OHT.

Abstract: Disclosed herein is an apparatus including: a table configured to receive a container that stores an object therein, the container including a bottom surface provided with a positioning groove and including a charging inlet through which a gas is charged into the container; a positioning pin projecting from the table and adapted to engage with the positioning groove of the container; a nozzle configured to charge the gas into the container through the charging inlet; and a drive unit configured to move the nozzle into contact with the charging inlet of the container after the positioning pin is engaged with the positioning groove.

Abstract: A load port is disclosed which allows a wafer to be transferred between the inside of a FOUP and the inside of a semiconductor fabrication apparatus even during a purge operation. The load port is provided adjacent the semiconductor fabrication apparatus in a clean room and includes a purge stage having a purge port through which a gas atmosphere in the FOUP is replaced into nitrogen gas or dry air, an opener stage provided in a juxtaposed relationship with the purge stage and having an opening communicating with the inside of the semiconductor fabrication apparatus and a door section capable of opening and closing the opening, and a moving mechanism for moving the FOUP between the purge stage and the opener stage.

Abstract: An OHT conveyer vehicle places a FOUP on first and second on platforms. A third platform can move to a position overlapping with the first and second platform by a moving device, and then to a position at which an upper surface of the third platform is above upper surfaces of the first and second platforms by an elevation device. Therefore, the FOUP is placed on the third platform. Subsequently, the third platform can move to a position overlapping with fourth and fifth platforms by the moving device, and then to a position at which the third platform is lower than the fourth and fifth platforms by the elevation device. Therefore, the FOUP is placed on the fourth and fifth platforms.

Abstract: A wafer conveyance system is described for transporting one or more wafers that undergo, while being transported, different processes at a plurality of wafer processing apparatuses inside which one or more wares are processed. A hermetically closed chamber is provided that defines an isolated environment inside which a controlled atmosphere. At least one guide path is provided inside the hermetically closed chamber. At least one mobile element is movable inside the hermetically closed chamber along the at least one guide path to transport one or more wafers from one wafer processing apparatus to another. A plurality of position sensors that detect positions of the at least one mobile element are deployed along each of the at least one guide path in such a manner that they are deployed at intervals close together when near the wafer processing apparatuses and deployed at wider intervals elsewhere. In another aspect, the guide rails may be constructed of a plurality of connectable rail units.

Abstract: A wafer conveyance system is described for transporting one or more wafers that undergo, while being transported, different processes at a plurality of wafer processing apparatuses inside which one or more wares are processed. A hermetically closed chamber is provided that defines an isolated environment inside which a controlled atmosphere. At least one guide path is provided inside the hermetically closed chamber. At least one mobile element is movable inside the hermetically closed chamber along the at least one guide path to transport one or more wafers from one wafer processing apparatus to another. A plurality of position sensors that detect positions of the at least one mobile element are deployed along each of the at least one guide path in such a manner that they are deployed at intervals close together when near the wafer processing apparatuses and deployed at wider intervals elsewhere. In another aspect, the guide rails may be constructed of a plurality of connectable rail units.

Abstract: Wafer processing apparatus A-Z for performing processes A-Z on a wafer are arranged in a row. A chamber 14 is formed parallel to these wafer processing apparatus, and a guide rail 11 is provided inside the chamber 14. A mobile element 12 driven by means of a linear motor is provided on the guide rail 11, and a wafer transfer robot 13 capable of exchanging a wafer between the wafer processing apparatus is mounted on the mobile element 12. With this structure, the wafer transfer robot 13 exchange wafers between wafer processing apparatus to perform each process on the wafers until the wafers are conveyed to the wafer processing apparatus Z.

Abstract: Wafer processing apparatus A-Z for performing processes A-Z on a wafer are arranged in a row. A chamber 14 is formed parallel to these wafer processing apparatus, and a guide rail 11 is provided inside the chamber 14. A mobile element 12 driven by means of a linear motor is provided on the guide rail 11, and a wafer transfer robot 13 capable of exchanging a wafer between the wafer processing apparatus is mounted on the mobile element 12. With this structure, the wafer transfer robot 13 exchange wafers between wafer processing apparatus to perform each process on the wafers until the wafers are conveyed to the wafer processing apparatus Z.

Abstract: Wafer processing apparatus A-Z for performing processes A-Z on a wafer are arranged in a row. A chamber 14 is formed parallel to these wafer processing apparatus, and a guide rail 11 is provided inside the chamber 14. A mobile element 12 driven by means of a linear motor is provided on the guide rail 11, and a wafer transfer robot 13 capable of exchanging a wafer between the wafer processing apparatus is mounted on the mobile element 12. With this structure, the wafer transfer robot 13 exchange wafers between wafer processing apparatus to perform each process on the wafers until the wafers are conveyed to the wafer processing apparatus Z.

Abstract: It is the object of the present invention to firstly provide a loading system and loading method of high working efficiency, and secondly, to provide a loading system and method in which a high precision of loading onto a center mold can be regularly assured without the need for repeated correction checks. The loading system includes a transport car 2 movable along a plurality of tire vulcanizing presses 1 arranged in a line; a robot arm 3 mounted on said transport car 2 for movement in three XYZ dimensions to a prescribed position in a desired stance; and a green tire chuck 6 fixed to the end of said robot arm 3. A load method essentially comprises the steps of picking-up, transportation, loading and chucking during shaping, of a green tire largely through movement of the robot arm of said system.

Abstract: A tire vulcanizing system capable of performing high accuracy transportation of a green tire by a loader and of performing high accuracy transportation of a vulcanized tire by an unloader including a group of tire vulcanizing presses having many tire vulcanizing presses 1 arranged in a row and manipulators 2 arranged along the group of the tire vulcanizing presses in such a way that they may freely run. The tire vulcanizing presses 1 are constructed such that the upper and lower molds 80, 81 are stored between the engaging or disengaging upper and lower press members in such a manner that they may be fastened with the green tire mounting table 7 and the post-cure inflator 8 arranged around them.

Abstract: A conveyor system that performs a conveyance by using pallets for loading green tires and device for conveying these pallets, installs a storage area for storing pallets as they are on the way to convey, and uses robots for transferring the green tires from a pallet to a tire vulcanizer. Pallets being of such a type as to be able to load two or more green tires for planar placement and a conveyor devise is desired to be able to get under these pallets for lifting up. Furthermore, a visual sensor provided on a robot reads at least one of a mark concerning the specification of a green tire, a mark for its positioning on a pallet, and a mark for its positioning on a tire vulcanizer, identifies a green tire to be conveyed, and automatically performs a positioning in transferring the green tire from the relevant pallet and a positioning in transferring the green tire to a tire vulcanizer in the conveyor system.

Abstract: Disclosed is a pulverizing, drying and transporting system for a pulverized fuel of a blast furnace of the type having at least one hot stove for supplying hot blast air, said hot stove also providing hot stove exhaust gas. The system includes a pulverizing and drying unit for pulverizing lamp raw fuel and drying the pulverized fuel. The hot stove gas is supplied to the pulverizing and drying unit. The hot stove exhaust gas dries the pulverized fuel and conveys it to a pulverized fuel collecting and separating device which separates the gas from the pulverized fuel. The line supplying the hot stove gas to the pulverizing and drying unit includes a heating device for selectively supplying additional heat to the hot stove exhaust gas. Moreover, the line for supplying the hot stove gas to the pulverizing and drying unit can include at least one of a temperature stabilizing device and a cooling device.