Abstract: A semiconductor device includes a semiconductor chip, a heat-dissipating plate, and a sealing resin, in which the semiconductor chip is mounted face-down on a substrate, the heat-dissipating plate is bonded to an upper surface of the semiconductor chip with a bonding material, the sealing resin seals the semiconductor chip and side surfaces of the heat-dissipating plate, an upper surface of the heat-dissipating plate is an exposed surface exposed from an upper surface of the sealing resin, a convex portion or a concave portion is provided on the side surface of the heat-dissipating plate, and at least an upper surface of the convex portion or at least a lower surface of the concave portion is in contact with the sealing resin.

Abstract: A semiconductor device including a first substrate including a first insulating substrate, a first wiring pattern layer and first front-side pads formed on a front surface of the first insulating substrate, and a first base portion constituted by thick copper on a back surface thereof, a first semiconductor element fixed to the first substrate via a first heat sink in a first opening of the first insulating substrate, a second substrate including a second insulating substrate, a second wiring pattern layer and second front-side pads formed on a front surface of the second insulating substrate, and a second base portion constituted by thick copper on a back surface thereof, a second semiconductor element fixed to the second substrate via a second heat sink in a second opening of the second insulating substrate, and a third substrate arranged between the first substrate and the second substrate to face them.

Abstract: A magnetic ceramic substrate includes a base material made of magnetic ceramic and a conductor pattern formed to be in contact with a surface of the base material. The surface of the base material is smooth, and the conductor pattern contains a metal conductor and amorphous glass. A circulator includes the magnetic ceramic substrate.

Abstract: A microwave module includes a plurality of microwave devices and a microwave module substrate. Each of the plurality of microwave devices exchanges a signal with a corresponding one of a plurality of antenna elements. The microwave module substrate includes a mounting surface on which the plurality of microwave devices are mounted. The microwave module substrate is electrically connected to each of the plurality of antenna elements. The mounting surface is perpendicular to a plane surface on which the plurality of antenna elements are arrayed.

Abstract: A semiconductor module includes: a semiconductor element having, on a front face thereof, a signal terminal and a ground terminal; a transmission line body having a signal transmission portion and a ground portion; a signal connection terminal electrically connected to the signal transmission portion of the transmission line body; ground connection terminals arranged to surround the signal connection terminal and electrically connected to the ground portion of the transmission line body, the ground connection terminals and the signal connection terminal constituting a pseudo coaxial line; a heat dissipation plate having a front face in close contact with a back face of the semiconductor element; and an interposer substrate having a semiconductor-element signal pad electrically connected to the signal terminal of the semiconductor element by a conductive adhesive, a transmission-line-body-2 signal pad electrically connected to the signal connection terminal, and a ground portion electrically connected to the g

Abstract: In an array antenna apparatus, a first height of top faces of plurality of antenna elements is greater than or equal to a second height of a first top of a first electronic component relative to a first primary surface. The first electronic component is the tallest among one or more electronic components mounted on fourth primary surfaces of one or more first external circuit boards. A third height of a second primary surface is greater than a fourth height of fourth primary surfaces. Accordingly, the array antenna apparatus has good antenna characteristics.

Abstract: A flexible printed circuit board includes: a base material including a principal face; at least one first wiring pattern disposed on the principal face of the base material and extending along a first direction; and a first member and a second member disposed on the first wiring pattern so as to be spaced from each other in the first direction. In the first direction, the first member and the second member divide the flexible printed circuit board into: a first region located opposite to the second member with respect to the first member in the first direction, a second region located between the first member and the second member, a third region located opposite to the first member with respect to the second member, a fourth region in which the first member is disposed, and a fifth region in which the second member is disposed.

Abstract: In an array antenna apparatus, a first height of top faces of plurality of antenna elements is greater than or equal to a second height of a first top of a first electronic component relative to a first primary surface. The first electronic component is the tallest among one or more electronic components mounted on fourth primary surfaces of one or more first external circuit boards. A third height of a second primary surface is greater than a fourth height of fourth primary surfaces. Accordingly, the array antenna apparatus has good antenna characteristics.

Abstract: A flexible printed circuit board includes: a base material including a principal face; at least one first wiring pattern disposed on the principal face of the base material and extending along a first direction; and a first member and a second member disposed on the first wiring pattern so as to be spaced from each other in the first direction. In the first direction, the first member and the second member divide the flexible printed circuit board into: a first region located opposite to the second member with respect to the first member in the first direction, a second region located between the first member and the second member, a third region located opposite to the first member with respect to the second member, a fourth region in which the first member is disposed, and a fifth region in which the second member is disposed.