Abstract: A printing apparatus includes: a head unit including an insertion port into which a flat cable is to be inserted; and a guiding portion configured to guide the flat cable when the flat cable is inserted into the insertion port. The guiding portion includes at least two guide members opposed to each other. The guide members opposed to each other each include a parallel surface to an insertion direction of the flat cable into the insertion port, and are disposed with the parallel surfaces opposed to each other. The distance between the parallel surfaces of the guide members that are opposed to each other matches a width in a longitudinal direction of the insertion port.

Abstract: A printing apparatus includes a head configured to discharge ink, a carriage mounted with the head and configured to reciprocate in a scanning direction, an tube coupling the head and a tank, a holding unit configured to hold the ink tube, a support unit including a support face that supports the holding unit, and a sensor configured to detect the ink, wherein the holding unit moves in the scanning direction with the ink tube curving in a convex shape toward one direction in the scanning direction, the holding unit includes a flat portion that comes into contact with and separates from the support face of the support unit according to the reciprocating movement of the carriage, and the sensor is arranged on one end side of the support unit in the direction in which the ink tube curves in the convex shape.

Abstract: A movement mechanism for a movable body including a motor including a rotation shaft, a supporting member that supports the motor, an attachment member fixed to a base body portion and to which the supporting member is attached, a driving pulley coupled to the rotation shaft, a driven pulley attached to the base body portion, an endless belt stretched between the driving pulley and the driven pulley, and the movable body attached to the endless belt, in which the supporting member is configured to be pivotally movable about a position serving as a pivotal axis such that a distance between the driving pulley and the driven pulley shortens, the position being at a side of the driven pulley from the driving pulley in a stretching direction in which the endless belt is stretched between the driving pulley and the driven pulley.

Abstract: A movement mechanism for a movable body including a motor including a rotation shaft, a supporting member that supports the motor, an attachment member fixed to a base body portion and to which the supporting member is attached, a driving pulley coupled to the rotation shaft, a driven pulley attached to the base body portion, an endless belt stretched between the driving pulley and the driven pulley, and the movable body attached to the endless belt, in which the supporting member is configured to be pivotally movable about a position serving as a pivotal axis such that a distance between the driving pulley and the driven pulley shortens, the position being at a side of the driven pulley from the driving pulley in a stretching direction in which the endless belt is stretched between the driving pulley and the driven pulley.

Abstract: A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean.

Abstract: A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean.

Abstract: A semiconductor light-emitting device includes a first LED chip whose emitted light is wavelength-converted by a fluorescent substance layer formed by applying and curing a fluorescent substance material, and a second LED chip whose emitted light is not wavelength-converted by the fluorescent substance layer, wherein the first LED chip and the second LED chip are arranged on a substrate in such a way that a level of an emission layer of the second LED chip is higher than that of a top face of the first LED chip above the substrate.

Abstract: A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean.

Abstract: A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean.

Abstract: A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor, laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean.

Abstract: An LED lighting apparatus includes an LED provided on a base, a rod-like light-guiding body having translucency that protrudes from the base, and a light reflector disposed in a vicinity of an upper end of the rod-like light-guiding body. Light from the LED is incident on a lower end of the rod-like light-guiding body, exits from the upper end via the rod-like light-guiding body, and is reflected by the light reflector.

Abstract: A semiconductor light-emitting element assembly includes: a semiconductor light-emitting element having first and second leads, a semiconductor light-emitting element chip die-bonded to the first lead and wire-bonded to the second lead, a metal body for heat dissipation fixed to the first and second leads via an insulating adhesive layer, and a reflector fixed to the first and second leads and reflecting light from the chip; a wiring board having an opening for receiving the reflector; a heat dissipator disposed on the metal body for heat dissipation; and a fastening part for fastening the heat dissipator and the wiring board, wherein the first and second leads are fixed to the wiring board so that the reflector is received in the opening, and an interval holding part for holding an interval between the heat dissipator and the wiring board.

Abstract: A semiconductor light-emitting device of the present invention includes a first LED chip whose emitted light is wavelength-converted by a fluorescent substance layer formed by applying and curing a fluorescent substance material, and a second LED chip whose emitted light is not wavelength-converted by the fluorescent substance layer, wherein the first LED chip and the second LED chip are arranged on a substrate in such a way that a level of an emission layer of the second LED chip is higher than that of a top face of the first LED chip above the substrate.

Abstract: An LED lighting apparatus includes an LED provided on a base, a rod-like light-guiding body having translucency that protrudes from the base, and a light reflector disposed in a vicinity of an upper end of the rod-like light-guiding body. Light from the LED is incident on a lower end of the rod-like light-guiding body, exits from the upper end via the rod-like light-guiding body, and is reflected by the light reflector.

Abstract: A semiconductor light-emitting element assembly includes: a semiconductor light-emitting element having first and second leads, a semiconductor light-emitting element chip die-bonded to the first lead and wire-bonded to the second lead, a metal body for heat dissipation fixed to the first and second leads via an insulating adhesive layer, and a reflector fixed to the first and second leads and reflecting light from the chip; a wiring board having an opening for receiving the reflector; a heat dissipator disposed on the metal body for heat dissipation; and a fastening part for fastening the heat dissipator and the wiring board, wherein the first and second leads are fixed to the wiring board so that the reflector is received in the opening, and an interval holding part for holding an interval between the heat dissipator and the wiring board.

Abstract: A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor, laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the cap is kept clean.

Abstract: A light emitting device of the present invention includes: a plurality of light emitting sections arranged in a matrix of n×m (n and m are positive integral numbers); power source lines for supplying power currents for light emission to the respective light emitting sections; control sections for controlling supply of the power currents to the respective light emitting sections; drive control sections for controlling by connecting or disconnecting respective control signals to the control sections; and holding sections for holding the control signals each indicative of supply of the power current to each of the light emitting sections. With this structure, a flat type light emitting device and a display device can be provided which realize (i) uniform light emission by easily adjusting hue and brightness of light emission in a flat panel including the light emitting sections and (ii) reduction in power consumption.

Abstract: A light guide plate 2 in accordance with the present invention includes a bend section 13 in which external light incident to a surface opposite a surface 11a is turned into a direction from a surface 13d to the surface 11c by one reflection so that the light enters a light guide section 11. Therefore, a light guide plate realized which is applicable in reducing the thickness of a backlight device and increasing the illumination surface of the backlight device in area.

Abstract: A method for producing a nitride semiconductor laser light source is provided. The nitride semiconductor laser light source has a nitride semiconductor laser chip, a stem for mounting the laser chip thereon, and a cap for covering the laser chip. The laser chip is encapsulated in a sealed container composed of the stem and the cap. The method for producing this nitride semiconductor laser light source has a cleaning step of cleaning the surface of the laser chip, the stem, or the cap. In the cleaning step, the laser chip, the stem, or the cap is exposed with ozone or an excited oxygen atom, or baked by heat. The method also has, after the cleaning step, a capping step of encapsulating the laser chip in the sealed container composed of the stem and the cap. During the capping step, the cleaned surface of the laser chip, the stem, or the, cap is kept clean.

Abstract: A motor control unit having an anti-burning device is provided which includes a rotation detection device for detecting whether the rotational speed of a given motor is below a predetermined level, a power supply limiting device for limiting the time of supplying current to the motor according to its rotational speed when the speed has been detected by the rotation speed detection device to be below the predetermined level. Thereby, the motor is prevented from burning, deteriorating in performance or shortening in life when the motor is overloaded. Also, the rotation detection device detects the condition when the motor is not rotating, and a cyclic power supply device for supplying current at a given cycle when the motor has been found to be not rotating by the aforementioned rotation detection device. Thereby, if the motor has been locked under an overload condition the motor can be readily restarted automatically when the load has been relieved.