Patents by Inventor Taras Kushta

Taras Kushta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10333214
    Abstract: It is an object of the present invention to provide compact and wideband array antennas based on multilayer substrate technologies which can be applied in lightweight radars. An antenna radiating element disposed in a multilayer substrate comprises a signal via; a plurality of ground vias surrounding the signal via; a radiation pad connected to one end of the signal via; a feed pad connected to another end of the signal vias; and an artificial medium disposed between the signal via and the ground vias; wherein the multilayer substrate comprises a plurality of conductor layers isolated by a dielectric material.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: June 25, 2019
    Assignee: NEC CORPORATION
    Inventor: Taras Kushta
  • Publication number: 20180145420
    Abstract: It is an object of the present invention to provide compact and wideband antenna radiating elements based on multilayer substrate technologies which can be applied in lightweight radars. A wideband antenna radiating element disposed in a multilayer substrate comprises a plurality of parts and a coupled area linking the plurality of parts. Each of the plurality of parts comprises a signal via, ground vias surrounding the signal via, a radiation pad connected to one end of the signal via, a feed pad connected to another end of the signal vias, and an artificial medium disposed between the signal via and the ground vias. The multilayer substrate comprises a plurality of conductor layers isolated by a dielectric material.
    Type: Application
    Filed: May 28, 2015
    Publication date: May 24, 2018
    Applicant: NEC Corporation
    Inventor: Taras KUSHTA
  • Publication number: 20180115036
    Abstract: It is an object of the present invention to provide compact filter-antennas disposed in multilayer substrates. A filter-antenna disposed in a multilayer substrate comprising: a radiating element formed as a patch antenna; a resonant element disposed under the radiating element, including a signal via and ground vias surrounding the signal via and functioned as a filter; and a feed transmission line connected to the radiating element.
    Type: Application
    Filed: March 19, 2015
    Publication date: April 26, 2018
    Applicant: NEC Corporation
    Inventor: Taras KUSHTA
  • Publication number: 20180083354
    Abstract: It is an object of the present invention to provide compact and wideband array antennas based on multilayer substrate technologies which can be applied in lightweight radars. An antenna radiating element disposed in a multilayer substrate comprises a signal via; a plurality of ground vias surrounding the signal via; a radiation pad connected to one end of the signal via; a feed pad connected to another end of the signal vias; and an artificial medium disposed between the signal via and the ground vias; wherein the multilayer substrate comprises a plurality of conductor layers isolated by a dielectric material.
    Type: Application
    Filed: March 19, 2015
    Publication date: March 22, 2018
    Applicant: NEC Corporation
    Inventor: Taras KUSHTA
  • Publication number: 20170076027
    Abstract: [Problem] To design a circuit configuration whereby communication performance degradation from noise coupling is pre-suppressed.
    Type: Application
    Filed: January 20, 2015
    Publication date: March 16, 2017
    Applicant: NEC CORPORATION
    Inventors: Mizuki IWANAMI, Kenta TSUKAMOTO, Taras KUSHTA
  • Patent number: 9583807
    Abstract: A filter of the present invention comprises a multilayer substrate, two terminals, a ground conductor and a hybrid resonator. The multilayer substrate includes a plurality of conductor layers and a dielectric configured to isolate said plurality of conductor layers from each other. The hybrid resonator is disposed in the multilayer substrate and comprises a first and a second resonant elements and a coupling strip connecting the first and said second resonant elements. Each resonant element comprises a signal via, a group of ground vias and an artificial dielectric. Each signal via is disposed through the multilayer substrate. Each group of ground vias is disposed through the multilayer substrate and configured to surround the signal via. Each artificial dielectric is disposed in the multilayer substrate and between the signal via and the group of ground vias.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: February 28, 2017
    Assignee: LENOVO INNOVATIONS LIMITED (HONG KONG)
    Inventors: Taras Kushta, Takashi Harada
  • Patent number: 9385430
    Abstract: An antenna of the present invention includes: a first conductive patch having a rectangular shape with corrugations on two opposing sides; and a second conductive patch below said first conductive patch and connected to a feeding point.
    Type: Grant
    Filed: May 16, 2011
    Date of Patent: July 5, 2016
    Assignee: NEC CORPORATION
    Inventors: Taras Kushta, Takashi Harada
  • Patent number: 9362603
    Abstract: A filter of the present invention includes a plurality of via structures with a multilayer substrate. Each of the plurality of via structures includes first, second and third functional sections. One end of a signal via of the first functional section is connected to one end of a signal via of the second functional section and another end of the signal via of the second functional section is connected to two signal vias of the third functional section. Those signal vias are surrounded by a plurality of ground vias. Input and output ports of the filter are connected to another end of the signal via of each first functional section.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: June 7, 2016
    Assignee: NEC CORPORATION
    Inventor: Taras Kushta
  • Publication number: 20160029477
    Abstract: A wiring substrate, to be interposed when an electronic component including an integrated circuit is mounted on a printed wiring board, includes a signal wire transmitting a signal from the electronic component, and a power supply wire supplying a power voltage to the electronic component, and the power supply wire is coated directly with a magnetic thin coat, and the magnetic thin coat is not provided on the signal wire so that the magnetic thin coat is arranged to be separated from the signal wire.
    Type: Application
    Filed: February 24, 2014
    Publication date: January 28, 2016
    Applicant: NEC CORPORATION
    Inventors: Mizuki IWANAMI, Taras KUSHTA
  • Publication number: 20160006099
    Abstract: A wideband transition of the present invention between a planar transmission line and a waveguide comprises a substrate, a segment of the planar transmission line, a conductive patch, an adjusting conductor plate and a section of the waveguide. The segment is arranged in a top conductor layer of the substrate. The conductive patch is arranged in the top conductor layer and connected to one end of the segment. The adjusting conductor plate is arranged in the top conductor layer or another conductor layer of the substrate next to the top conductor layer and isolated from any other conductor. The section is disposed above the conductive patch and connected to a conductor plane at the top conductor layer. Another end of the segment is a first terminal of the wideband transition. Another end of the section is a second terminal of the wideband transition.
    Type: Application
    Filed: February 22, 2013
    Publication date: January 7, 2016
    Applicant: NEC CORPORATION
    Inventors: Taras KUSHTA, Akira MIYATA
  • Publication number: 20150357698
    Abstract: A wideband transition between a planar transmission line and a waveguide of this invention comprises a substrate, a segment of the planar transmission line and a section of the waveguide. The substrate includes a plurality of conductor-layers stacked from top to bottom and isolated by an insulating material. The segment of the planar transmission line is disposed in a top conductor-layer of the plurality of conductor-layers. The section of the waveguide is disposed on a bottom conductor-layer of the plurality of conductor-layers by a first end. The substrate comprises a conductive patch and a conductive dispersion plate. The conductive patch is disposed in the top conductor-layer and connected to a first end of said segment. The conductive dispersion plate is disposed in the bottom conductor-layer and under the conductive patch. The conductive dispersion plate comprises a corrugation.
    Type: Application
    Filed: January 10, 2013
    Publication date: December 10, 2015
    Applicant: NEC CORPORATION
    Inventor: Taras KUSHTA
  • Patent number: 9107300
    Abstract: A resonant via structure is provided with a multilayer substrate, a signal via conductor and ground vias. The multilayer substrate includes conductor layers and a dielectric. The dielectric isolates each of the conductor layers. The signal via conductor is disposed through the multilayer substrate. The ground vias are disposed through the multilayer substrate and around the signal via conductor. The dielectric comprises two sections disposed between the signal via and ground vias, in the plane of conductor layers. The first section is disposed between the first layer and other layer of the conductor layers. The second section is disposed between the other layer and the last layer of the conductor layers.
    Type: Grant
    Filed: December 14, 2009
    Date of Patent: August 11, 2015
    Assignee: NEC CORPORATION
    Inventor: Taras Kushta
  • Patent number: 8994480
    Abstract: A resonant element is provided with a multilayer board, comprising a plurality of conductor layers isolated by a dielectric, a signal via conductor, penetrating through the multilayer board, and a plurality of ground vias, penetrating thought the multilayer board and disposed around the signal via conductor. The multilayer board comprises a first conductor layer, a second conductor layer, and a corrugated conductor layer disposed between the first and the second conductor layers. The corrugated conductor layer comprises a corrugated signal plate, connected to the signal via conductor, and a corrugated ground plate, connected to the plurality of ground vias, isolated from the corrugated signal plate by the dielectric.
    Type: Grant
    Filed: July 21, 2009
    Date of Patent: March 31, 2015
    Assignee: NEC Corporation
    Inventor: Taras Kushta
  • Patent number: 8970327
    Abstract: A filter is provided with a planar transmission line and a combined via structure connected to (both) one ends of the planar transmission line. The planar transmission line and the combined via structure are disposed in a same multilayer board. The combined via structure comprises two working parts. The first working part comprises a segment of signal via and a plurality of segments of ground vias surrounding the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias, smooth conductive plate and corrugated conductive plate. The smooth conductive plate and the corrugated conductive plate are connected to the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias and corrugated conductive plate. The corrugated conductive plate is connected to the signal via.
    Type: Grant
    Filed: December 25, 2008
    Date of Patent: March 3, 2015
    Assignee: NEC Corporation
    Inventor: Taras Kushta
  • Publication number: 20140085147
    Abstract: An antenna of the present invention includes: a first conductive patch having a rectangular shape with corrugations on two opposing sides; and a second conductive patch below said first conductive patch and connected to a feeding point.
    Type: Application
    Filed: May 16, 2011
    Publication date: March 27, 2014
    Applicant: NEC CORPORATION
    Inventors: Taras Kushta, Takashi Harada
  • Patent number: 8576027
    Abstract: A filter is provided with a multilayer board incorporating a resonator formed by two ground plates opposed to each other and conductive side walls connected to the ground plates; two signal vias provided through the resonator; and two terminals connected to the signal vias to receive a pair of signals. The resonator has a first face of symmetry vertical to the ground plates. The signal vias are disposed symmetrically with respect to the first face of symmetry on a distance from the first face of symmetry.
    Type: Grant
    Filed: December 25, 2007
    Date of Patent: November 5, 2013
    Assignee: NEC Corporation
    Inventor: Taras Kushta
  • Patent number: 8536464
    Abstract: A multilayer substrate is provided with a conductor plane region in which a plurality of conductor planes are disposed; a clearance region disposed adjacent to the conductor plane region so that the plurality of conductor planes are excluded from the clearance region. A plurality of signal vias are disposed through the clearance region so that the plurality of signal vias are isolated from the plurality of conductor planes. A conductor post is connected to one of the plurality of conductor planes and disposed between two of the signal vias in the clearance region.
    Type: Grant
    Filed: May 26, 2008
    Date of Patent: September 17, 2013
    Assignee: NEC Corporation
    Inventors: Taras Kushta, Jun Sakai, Hikaru Kouta
  • Patent number: 8476537
    Abstract: A multi-layer substrate includes a planar transmission line structure and a signal via, which are connected by a multi-tier transition. The multi-tier transition includes a signal via pad configured to serve for a full-value connection of the signal via and the planar transmission line; and a dummy pad connected to the signal via, formed in an area of a clearance hole in a conductor layer disposed between a signal terminal of the signal via and the planar transmission line, and isolated from the conductor layer.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: July 2, 2013
    Assignee: NEC Corporation
    Inventor: Taras Kushta
  • Publication number: 20130099876
    Abstract: A filter of the present invention includes a plurality of via structures with a multilayer substrate. Each of the plurality of via structures includes first, second and third functional sections. One end of a signal via of the first functional section is connected to one end of a signal via of the second functional section and another end of the signal via of the second functional section is connected to two signal vias of the third functional section. Those signal vias are surrounded by a plurality of ground vias. Input and output ports of the filter are connected to another end of the signal via of each first functional section.
    Type: Application
    Filed: June 30, 2010
    Publication date: April 25, 2013
    Inventor: Taras Kushta
  • Patent number: 8378762
    Abstract: An electromagnetic band gap (EGB) structure includes a substrate made of an isolating material. A plurality of identical planar transmission line segments are formed one under another in conductor layers embedded in the substrate. Vertical transitions connect one by one the plurality of planar transmission line segments. Adjacent ones of the vertical transitions are equally spaced on a predetermined distance in a direction parallel to the transmission line segments, thereby the vertical transitions serve as periodical inclusions forming the EBG structure.
    Type: Grant
    Filed: March 2, 2007
    Date of Patent: February 19, 2013
    Assignee: NEC Corporation
    Inventor: Taras Kushta