Patents by Inventor Tasuku Yamada

Tasuku Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170233615
    Abstract: Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.
    Type: Application
    Filed: January 20, 2016
    Publication date: August 17, 2017
    Inventors: Mitsuru Tanikawa, Takashi Watanabe, Yusuke Fujita, Yoshito Fujita, Tasuku Yamada
  • Publication number: 20170233599
    Abstract: Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can reduce an outgas at the time of being exposed to high temperatures, and can enhance moisture-resistant reliability. An inkjet adhesive according to the present invention comprises a first photocurable compound having one (meth)acrylol group, a second photocurable compound having two or more (meth)acrylol groups, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the first photocurable compound contains alkyl (meth)acrylate having 8 to 21 carbon atoms.
    Type: Application
    Filed: January 20, 2016
    Publication date: August 17, 2017
    Inventors: Mitsuru Tanikawa, Takashi Watanabe, Yusuke Fujita, Yoshito Fujita, Tasuku Yamada
  • Publication number: 20150247483
    Abstract: A first distance between a position where a point-of-action end abuts at a rear end surface of a push-side abutting portion (flat washer) forming a part of holder and a rotational axis of a pinion, and a second distance between a position where the pinion abuts at a front end surface and the rotational axis of the pinion have the relation of first distance>second distance. Thereby, after starting an engine, even when the pinion is rotated at high speed, the push-side abutting portion is less likely to rotate and remains stationary relative to the lever, and even though the push-side abutting portion begins to rotate, it is rotated at a lower speed than the pinion.
    Type: Application
    Filed: March 3, 2015
    Publication date: September 3, 2015
    Inventors: Tomoya IMANISHI, Tasuku YAMADA
  • Publication number: 20150204297
    Abstract: A washer is held by being sandwiched in an axial direction by a pinion and a holder. Here, although the washer is inexpensive, it has high planar accuracy. Then, by sandwiching the washer in the axial direction between the pinion and the holder, a metal surface of the inexpensive washer with high planar accuracy can be used as a contacting surface that contacts a holder side slide-contacting surface directly. Furthermore, another metal surface of the washer can also be directly contacted to a pinion side slide-contacting surface. Thereby, wear caused by a slide-contacting rotation of the holder can be reduced without raising costs of parts and processing in the starter that adopts a pinion shift structure.
    Type: Application
    Filed: January 21, 2015
    Publication date: July 23, 2015
    Inventors: Tasuku YAMADA, Tomoya IMANISHI
  • Publication number: 20140175505
    Abstract: The present invention provides an encapsulant for optical semiconductor devices, which is capable of suppressing surface tackiness of a cured product and is also capable of enhancing the heat resistance and thermal cycle characteristics of the cured product. An encapsulant for optical semiconductor devices according to the present invention which includes: a first organopolysiloxane which is represented by formula (1A) or formula (1B) and has an alkenyl group and a methyl group bonded to a silicon atom; a second organopolysiloxane which is represented by formula (51A) or formula (51B) and has a hydrogen atom bonded to a silicon atom and a methyl group bonded to a silicon atom; and a catalyst for hydrosilylation reaction, and the content ratios of methyl groups bonded to silicon atoms in the first and second organopolysiloxanes each are 80 mol % or more.
    Type: Application
    Filed: July 11, 2012
    Publication date: June 26, 2014
    Inventors: Ryosuke Yamazaki, Mitsuru Tanikawa, Takashi Watanabe, Osamu Inui, Yoshitaka Kunihiro, Chizuru Kimu, Yusuke Kobayashi, Hidefumi Yasui, Minoru Suezaki, Yasunari Kusaka, Tasuku Yamada