Patents by Inventor Tatsuhiko Hirano

Tatsuhiko Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220131433
    Abstract: Provided is a rotating electrical machine capable of obtaining a higher torque while minimizing the amount of permanent magnets used. A rotor core includes a plurality of first insertion holes each having an auxiliary magnet embedded therein, the auxiliary magnet being embedded so as to surround a rotation axis of a rotor in a cross-section orthogonal to the rotation axis. The rotor core includes a plurality of second insertion holes each having a main magnet embedded therein, the main magnet being embedded so as to extend from the auxiliary magnet toward an outer circumferential direction of the rotor. The rotor includes a plurality of magnetic poles formed around the rotation axis, the magnetic poles each having the auxiliary magnet and the plurality of main magnets. The auxiliary magnet is arranged disproportionately on one side of the first insertion hole in the circumferential direction of the rotor so as to form a clearance on the other side of the first insertion hole.
    Type: Application
    Filed: October 19, 2021
    Publication date: April 28, 2022
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tatsuhiko Hirano, Kyoko Nakamura, Mitsutoshi Akita, Daisuke Ichigozaki, Akira Yamashita
  • Publication number: 20210328490
    Abstract: In an axial gap motor, a rotor includes a plurality of rotor cores fixed in a circumferential direction of a rotor base, and a stator includes a plurality of stator cores fixed in a circumferential direction of a stator base, and coils wound around the stator cores. End faces of each of the rotor cores and end faces of the corresponding stator core are opposed to each other while being exposed to each other.
    Type: Application
    Filed: April 12, 2021
    Publication date: October 21, 2021
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Keiu KANADA, Kazuaki HAGA, Toshimitsu TAKAHASHI, Mayumi TAKAZAWA, Takuya NOMURA, Shinya SANO, Takeshi TOMONAGA, Hisanori KOMA, Yasuhide YAGYU, Kensuke KOMORI, Tatsuhiko HIRANO, Masaaki ITO, Hiroaki WAKIMOTO
  • Publication number: 20210281132
    Abstract: A plurality of auxiliary magnets is embedded in a rotor core so as to surround the rotation axis of the rotating electrical machine in the cross-section orthogonal to the rotation axis. A plurality of main magnets is embedded in the rotor core so as to extend from the auxiliary magnet in the outer circumferential direction of the rotor. A plurality of magnetic poles of the rotor is formed around the rotation axis, the magnetic poles each having the auxiliary magnet and the plurality of main magnets arranged at a distance from each other in the circumferential direction of the rotor, and the plurality of main magnets of each magnetic pole is arranged asymmetrically about a virtual line passing the rotation axis and axisymmetrically dividing the auxiliary magnet of each magnetic pole.
    Type: Application
    Filed: March 4, 2021
    Publication date: September 9, 2021
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Mitsutoshi AKITA, Daisuke ICHIGOZAKI, Tatsuhiko HIRANO, Kyoko NAKAMURA, Akira YAMASHITA
  • Publication number: 20210272751
    Abstract: The production method of a rare earth magnet of the present disclosure includes a coated magnetic powder preparation step, a mixed powder preparation step, and a pressure sintering step. In the coated magnetic preparation step, a zinc-containing coating 12 is formed on the particle surface of a samarium-iron-nitrogen-based magnetic powder to obtain a coated magnetic powder 14. In the mixed powder preparation step, a binder powder 20 having a melting point not higher than the melting point of the coating 12 and the coated magnetic powder 14 are mixed to obtain a mixed powder. In the pressure sintering step, denoting as T1° C. the temperature at which the peak disappears in an X-ray diffraction pattern of the binder powder 20 and as T2° C. the temperature at which the magnetic phase in the samarium-iron-nitrogen-based magnetic powder 10 decomposes, the mixed powder is pressure-sintered at T1° C. or more and (T2?50)° C. or less.
    Type: Application
    Filed: December 29, 2020
    Publication date: September 2, 2021
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Daisuke ICHIGOZAKI, Tatsuhiko HIRANO, Noritsugu SAKUMA, Akihito KINOSHITA, Masaaki ITO
  • Publication number: 20200098496
    Abstract: To provide a rare earth magnet in which particles of SmFeN powder are bound using a Zn alloy powder, wherein generation of a knick at a magnetic field of around 0 is prevented, and a production method thereof. A rare earth magnet including a main phase containing Sm, Fe, and N, at least a part of the main phase having a Th2Zn17-type or Th2Ni17-type crystal structure, a sub-phase containing at least either Si or Sm, and Zn and Fe and being present around the main phase, and an intermediate phase containing Sm, Fe and N as well as Zn and being present between the main phase and the sub-phase, wherein the average Fe content in the sub-phase is 33 at % or less relative to the whole sub-phase, and the average total content of Si and Sm in the sub-phase is from 1.4 to 4.5 at % relative to the whole subs-phase.
    Type: Application
    Filed: September 19, 2019
    Publication date: March 26, 2020
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, TOHOKU UNIVERSITY
    Inventors: Akihito KINOSHITA, Noritsugu SAKUMA, Tetsuya SHOJI, Daisuke ICHIGOZAKI, Tatsuhiko HIRANO, Kazuaki HAGA, Yukio TAKADA, Satoshi SUGIMOTO, Masashi MATSUURA
  • Patent number: 9486892
    Abstract: [Problem] Provided is a polishing composition which is suitable for polishing a polishing object having a metal wiring layer and capable of diminishing the step defect while maintaining a high polishing rate. [Solution] Provided is a polishing composition used in polishing a polishing object having a metal wiring layer, which contains a metal corrosion inhibitor, a complexing agent, a surfactant, and water and in which the solid surface energy of the polishing object surface after polishing the polishing object using the polishing composition is 30 mN/m or less, and the surfactant is preferably an anionic surfactant.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: November 8, 2016
    Assignee: FUJIMI INCORPORATED
    Inventors: Shogo Onishi, Yasuto Ishida, Tatsuhiko Hirano
  • Publication number: 20160136784
    Abstract: A polishing composition contains a polishing accelerator, a water-soluble polymer including a constitutional unit originating from a polymerizable compound having a guanidine structure such as dicyandiamide, and an oxidant. The water-soluble polymer may be a water-soluble polymer including a constitutional unit originating from dicyandiamide and a constitutional unit originating from formaldehyde, a diamine or a polyamine.
    Type: Application
    Filed: January 22, 2016
    Publication date: May 19, 2016
    Applicant: Fujimi Incorporated
    Inventors: Tatsuhiko HIRANO, Shuichi TAMADA, Takahiro UMEDA
  • Publication number: 20150344738
    Abstract: [Problem] Provided is a polishing composition which is suitable for polishing a polishing object having a metal wiring layer and capable of diminishing the step defect while maintaining a high polishing rate. [Solution] Provided is a polishing composition used in polishing a polishing object having a metal wiring layer, which contains a metal corrosion inhibitor, a complexing agent, a surfactant, and water and in which the solid surface energy of the polishing object surface after polishing the polishing object using the polishing composition is 30 mN/m or less, and the surfactant is preferably an anionic surfactant.
    Type: Application
    Filed: October 29, 2013
    Publication date: December 3, 2015
    Applicant: FUJIMI INCORPORATED
    Inventors: Shogo ONISHI, Yasuto ISHIDA, Tatsuhiko HIRANO
  • Patent number: 9117761
    Abstract: A polishing composition contains a water-soluble polymer, a polishing accelerator, and an oxidizing agent. The water-soluble polymer is a polyamide-polyamine polymer having an amine value of 150 mg KOH/1 g·solid or greater.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: August 25, 2015
    Assignee: FUJIMI INCORPORATED
    Inventors: Shuichi Tamada, Tatsuhiko Hirano, Takahiro Umeda, Kazuya Sumita, Yoshihiro Izawa
  • Patent number: 8864860
    Abstract: To provide a polishing composition which can satisfy both suppression of the surface topography and a high stock removal rate, in a polishing step in the production of a wiring structure. A polishing composition comprising abrasive grains, a processing accelerator, a nonionic surfactant represented by R-POE (I) (wherein R is a C10-16 alkyl group having a branched structure, and POE is a polyoxyethylene chain) and having an HLB of from 7 to 12, an anionic surfactant, a protective film-forming agent, an oxidizing agent, and water.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: October 21, 2014
    Assignee: Fujimi Incorporated
    Inventors: Tatsuhiko Hirano, Hiroshi Mizuno, Yasuyuki Yamato, Akihito Yasui
  • Publication number: 20140014872
    Abstract: Disclosed is a polishing composition containing a pH-lowering substance and a pH-buffering agent. The difference in absolute value between the pH of the polishing composition immediately after adding a 31% by weight hydrogen peroxide solution thereto at 5.16 g per 100 g of the polishing composition and the pH of the polishing composition after leaving to stand for eight days therefrom is 0.5 or less. Also disclosed is another polishing composition containing a pH-lowering substance and a pH-controlling agent. In comparison to the amount of a basic substance in the polishing composition immediately after adding a 31% by weight hydrogen peroxide solution thereto at 5.16 g per 100 ml of the polishing composition, the amount of a basic substance in the polishing composition after leaving to stand for eight days therefrom is increased by no less than 0.1 mM.
    Type: Application
    Filed: March 28, 2012
    Publication date: January 16, 2014
    Applicant: FUJIMI INCORPORATED
    Inventors: Shuichi Tamada, Tatsuhiko Hirano, Yoshihihro Ezawa, Shogo Onishi
  • Publication number: 20130203254
    Abstract: A polishing composition contains a water-soluble polymer, a polishing accelerator, and an oxidizing agent. The water-soluble polymer is a polyamide-polyamine polymer having an amine value of 150 mg KOH/1 g·solid or greater.
    Type: Application
    Filed: August 2, 2011
    Publication date: August 8, 2013
    Applicant: FUJIMI INCORPORATED
    Inventors: Shuichi Tamada, Tatsuhiko Hirano, Takahiro Umeda, Kazuya Sumita, Yoshihiro Izawa
  • Publication number: 20120153218
    Abstract: To provide a polishing composition which can satisfy both suppression of the surface topography and a high stock removal rate, in a polishing step in the production of a wiring structure. A polishing composition comprising abrasive grains, a processing accelerator, a dishing inhibitor and water. Here, the abrasive grains comprise at least first abrasive grains and second abrasive grains; the ratio of an average primary particle size DL1 of the second abrasive grains to an average primary particle size DS1 of the first abrasive grains, DL1/DS1, is 5>DL1/DS1>1; the degree of association of the first abrasive grains is from 1.8 to 5; and the degree of association of the second abrasive grains is at most 2.5.
    Type: Application
    Filed: February 28, 2012
    Publication date: June 21, 2012
    Applicant: Fujimi Incorporated
    Inventors: Tatsuhiko HIRANO, Hiroshi Mizuno, Takahiro Umeda
  • Publication number: 20110250754
    Abstract: A polishing composition contains a polishing accelerator, a water-soluble polymer including a constitutional unit originating from a polymerizable compound having a guanidine structure such as dicyandiamide, and an oxidant. The water-soluble polymer may be a water-soluble polymer including a constitutional unit originating from dicyandiamide and a constitutional unit originating from formaldehyde, a diamine or a polyamine.
    Type: Application
    Filed: March 30, 2011
    Publication date: October 13, 2011
    Applicant: FIJIMI INCORPORATED
    Inventors: Tatsuhiko HIRANO, Shuichi TAMADA, Takahiro UMEDA
  • Publication number: 20090179172
    Abstract: To provide a polishing composition which can satisfy both suppression of the surface topography and a high stock removal rate, in a polishing step in the production of a wiring structure. A polishing composition comprising abrasive grains, a processing accelerator, a dishing inhibitor and water. Here, the abrasive grains comprise at least first abrasive grains and second abrasive grains; the ratio of an average primary particle size DL1 of the second abrasive grains to an average primary particle size DS1 of the first abrasive grains, DL1/DS1, is 5>DL1/DS1>1; the degree of association of the first abrasive grains is from 1.8 to 5; and the degree of association of the second abrasive grains is at most 2.5.
    Type: Application
    Filed: December 22, 2008
    Publication date: July 16, 2009
    Applicant: FUJIMI INCORPORATED
    Inventors: Tatsuhiko HIRANO, Hiroshi Mizuno, Takahiro Umeda
  • Publication number: 20090173910
    Abstract: To provide a polishing composition which can satisfy both suppression of the surface topography and a high stock removal rate, in a polishing step in the production of a wiring structure. A polishing composition comprising abrasive grains, a processing accelerator, a nonionic surfactant represented by R-POE (I) (wherein R is a C10-16 alkyl group having a branched structure, and POE is a polyoxyethylene chain) and having an HLB of from 7 to 12, an anionic surfactant, a protective film-forming agent, an oxidizing agent, and water.
    Type: Application
    Filed: December 22, 2008
    Publication date: July 9, 2009
    Applicant: FUJIMI INCORPORATED
    Inventors: Tatsuhiko HIRANO, Hiroshi Mizuno, Yasuyuki Yamato, Akihito Yasui
  • Patent number: 7550388
    Abstract: A polishing composition contains a deterioration inhibitor for inhibiting deterioration of polishing capability of the polishing composition, an abrasive, and water. The deterioration inhibitor is at least one selected from polysaccharide and polyvinyl alcohol. The polysaccharide is starch, amylopectin, glycogen, cellulose, pectin, hemicellulose, pullulan, or elsinan. Among them, pullulan is preferable. The abrasive is at least one selected from aluminum oxide and silicon dioxide, preferably at least one selected from fumed silica, fumed alumina, and colloidal silica. The polishing composition can be suitably used in polishing for forming wiring a semiconductor device.
    Type: Grant
    Filed: March 21, 2005
    Date of Patent: June 23, 2009
    Assignee: Fujima Incorporated
    Inventors: Junhui Oh, Atsunori Kawamura, Tsuyoshi Matsuda, Tatsuhiko Hirano, Kenji Sakai, Katsunobu Hori
  • Publication number: 20090127500
    Abstract: A polishing composition contains a triazole having a 6-membered ring skeleton, a water soluble polymer, an oxidant, and abrasive grains. The triazole has a hydrophobic functional group in the 6-membered ring skeleton. The content of the triazole in the polishing composition is 3 g/L or less. The pH of the polishing composition is 7 or more. The polishing composition is suitably used in polishing for forming wiring of a semiconductor device.
    Type: Application
    Filed: September 1, 2006
    Publication date: May 21, 2009
    Applicant: FUJIMI INCORPORATED
    Inventors: Tatsuhiko Hirano, Hiroshi Asano, Katsunobu Hori
  • Patent number: 7485162
    Abstract: A polishing composition of the present invention, to be used in polishing for forming wiring in a semiconductor device, includes: a specific surfactant; a silicon oxide; at least one selected from the group consisting of carboxylic acid and alpha-amino acid; a corrosion inhibitor; an oxidant; and water. This polishing composition is capable of suppressing the occurrence of the dishing.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: February 3, 2009
    Assignee: Fujimi Incorporated
    Inventors: Tsuyoshi Matsuda, Tatsuhiko Hirano, Junhui Oh, Atsunori Kawamura, Kenji Sakai
  • Publication number: 20070176140
    Abstract: A first polishing composition is used in chemical mechanical polishing for removing one part of the portion of a conductive layer positioned outside a trench. A second polishing composition is used in chemical mechanical polishing for removing the remaining part of the portion of a conductive layer positioned outside the trench and the portion of a barrier layer positioned outside the trench. The first polishing composition contains a specific surfactant, a silicon oxide, a carboxylic acid, an anticorrosive, an oxidizing agent, and water. The second polishing composition contains colloidal silica, an acid, an anticorrosive, and a completely saponified polyvinyl alcohol.
    Type: Application
    Filed: September 30, 2004
    Publication date: August 2, 2007
    Inventors: Tsuyoshi Matsuda, Tatsuhiko Hirano, Junhui Oh, Atsunori Kawamura, Kenji Sakai