Patents by Inventor Tatsuji Murata

Tatsuji Murata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6939431
    Abstract: Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.
    Type: Grant
    Filed: December 2, 2002
    Date of Patent: September 6, 2005
    Assignees: Mitsui Chemicals, Inc., Sharp Corporation
    Inventors: Yasushi Mizuta, Tatsuji Murata, Makoto Nakahara, Takatoshi Kira, Daisuke Ikesugi
  • Publication number: 20030144381
    Abstract: Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.
    Type: Application
    Filed: December 2, 2002
    Publication date: July 31, 2003
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Yasushi Mizuta, Tatsuji Murata, Makoto Nakahara, Takatoshi Kira, Daisuke Ikesugi