Patents by Inventor Tatsumi INOMOTO

Tatsumi INOMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9633888
    Abstract: Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: April 25, 2017
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Saori Nishizaki, Tomoki Umezawa, Hirokazu Matsuzaki, Takeshi Minamiru, Tatsumi Inomoto, Eitoku Sonoda, Kenji Yamazaki
  • Publication number: 20160293463
    Abstract: Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.
    Type: Application
    Filed: February 17, 2016
    Publication date: October 6, 2016
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Saori NISHIZAKI, Tomoki UMEZAWA, Hirokazu MATSUZAKI, Takeshi MINAMIRU, Tatsumi INOMOTO, Eitoku SONODA, Kenji YAMAZAKI