Patents by Inventor Tatsuo Kataoka

Tatsuo Kataoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030226687
    Abstract: Provided is a method of manufacturing a printed wiring board which keeps a good etching factor of formed circuits, eliminates an etching residue and can effectively prevent the occurrence of surface layer migration.
    Type: Application
    Filed: June 9, 2003
    Publication date: December 11, 2003
    Inventors: Tatsuo Kataoka, Tatsuya Aoki, Yasunori Matsumura
  • Patent number: 6616773
    Abstract: A substrate treatment assembly for treating a work object on a surface of a substrate by supplying to the work object a wet ozone-containing gas wetted with a treatment solution includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, a supply device for supplying the wet ozone-containing gas to a work object on a surface of the substrate, a gas conduit connecting the wetting device to the supply device, and a heating device for heating the wet ozone-containing gas to a temperature approximately equal to or greater than the temperature of the substrate.
    Type: Grant
    Filed: October 11, 2000
    Date of Patent: September 9, 2003
    Assignees: Mitsubishi Denki Kabushiki Kaisha, SPC Electronics Corporation
    Inventors: Masaki Kuzumoto, Seiji Noda, Izumi Oya, Makoto Miyamoto, Hideo Horibe, Tatsuo Kataoka, Tetsuji Oishi
  • Patent number: 6517999
    Abstract: A method of removing photoresist film with high efficiency of removal and friendliness with the environment while reducing the material consumption and the cost for the ventilation facility, and an apparatus used for the method are provided.
    Type: Grant
    Filed: July 12, 2000
    Date of Patent: February 11, 2003
    Assignees: Shimada Rika Kougyo Kabushiki Kaisha, Mitsubishi Denki Kabushiki Kaisha
    Inventors: Izumi Oya, Seiji Noda, Makoto Miyamoto, Masaki Kuzumoto, Masashi Ohmori, Tatsuo Kataoka
  • Publication number: 20020187334
    Abstract: A two-metal TAB tape, double-sided CSP tape, and BGA tape in which the tape has an insulating substrate and wiring layers at least on both sides of the insulating substrate, sprocket holes are made at regular intervals in the longitudinal direction along the edges in the direction of the width, through holes are made in the substrate by punching press, the through holes are filled with conductor by punching press, and the conductor is electrically connected to the wiring layers, characterized in that pilot round holes are made among the sprocket holes made in the longitudinal direction. Methods for producing such two-metal TAB tape, double-sided CSP tape, and BGA tape are disclosed.
    Type: Application
    Filed: May 13, 2002
    Publication date: December 12, 2002
    Inventors: Akira Ichiryu, Tatsuo Kataoka, Hirokazu Kawamura, Katsuhiko Hayashi, Masahito Ishii
  • Publication number: 20020115024
    Abstract: A method of removing photoresist film with high efficiency of removal and friendliness with the environment while reducing the material consumption and the cost for the ventilation facility, and an apparatus used for the method are provided.
    Type: Application
    Filed: April 30, 2002
    Publication date: August 22, 2002
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Izumi Oya, Seiji Noda, Makoto Miyamoto, Masaki Kuzumoto, Masashi Ohmori, Tatsuo Kataoka
  • Patent number: 6129100
    Abstract: A transfer robot 2 for holding the peripheral edge of a wafer 1 and transferring the wafer 1, a turning-over alignment section 7 for turning over the wafer 1 and centering the wafer 1, and a transfer robot cleaning section 6 for cleaning holding portions 2a of the transfer robot 2 are provided. Besides, a wafer cleaning section 5 for cleaning the wafer 1 is provided and in this wafer cleaning section 5, a spinner 22 for chucking the wafer 1 and a nozzle 20 through which a cleaning liquid is jetted to this wafer 1. To this nozzle 20, a tank 11 for pure water for supplying pure water, a tank 12 for functional water for supplying a functional water, a tank 13 for chemical liquid for supplying a chemical liquid, and a cleaning liquid mixing portion 14 for storing these various kinds of cleaning liquids and mixing them are connected through supply lines.
    Type: Grant
    Filed: October 23, 1998
    Date of Patent: October 10, 2000
    Assignee: Hoya Corporation
    Inventors: Kenichi Kitagawa, Kiyoshi Shimada, Ei'ichi Ando, Tatsuo Kataoka, Takashi Yoneda, Yoshihito Tatehaba
  • Patent number: 5919538
    Abstract: A method of manufacturing TAB tapes comprising the steps of (1) to (5):(1) laminating a protection film-covered adhesive layer on the entire surface of at least one face of a base film except both the edge portions thereof thereby to obtain a laminated portion, the base film being enough wide to provide a base film for each of the intended plural TAB tapes each having a desired width;(2) drilling sprocket holes in the thus obtained laminated portion comprising the base film and the protection film-covered adhesive layer and in both the edge portions of said base film and drilling device holes in said laminated portion;(3) peeling said protection film off the adhesive layer, and adhering a copper foil to said adhesive layer;(4) applying a photoresist to said copper foil, exposing and developing the photoresist-applied copper foil and then etching the photoresist-developed copper foil to form wiring patterns thereby to obtain a wide TAB tape in which plural strips of TAB tape having the disired width are origin
    Type: Grant
    Filed: October 1, 1998
    Date of Patent: July 6, 1999
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Junji Tokushima, Hiroshi Iguchi, Tatsuo Kataoka
  • Patent number: 5866020
    Abstract: A method of manufacturing TAB tapes comprising the steps of (1) to (5):(1) laminating a protection film-covered adhesive layer on the entire surface of at least one face of a base film except both the edge portions thereof thereby to obtain a laminated portion, the base film being enough wide to provide a base film for each of the intended plural TAB tapes each having a desired width;(2) drilling sprocket holes in the thus obtained laminated portion comprising the base film and the protection film-covered adhesive layer and in both the edge portions of said base film and drilling device holes in said laminated portion;(3) peeling said protection film off the adhesive layer, and adhering a copper foil to said adhesive layer;(4) applying a photoresist to said copper foil, exposing and developing the photoresist-applied copper foil and then etching the photoresist-developed copper foil to form wiring patterns thereby to obtain a wide TAB tape in which plural strips of TAB tape having the disired width are origin
    Type: Grant
    Filed: September 6, 1996
    Date of Patent: February 2, 1999
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Junji Tokushima, Hiroshi Iguchi, Tatsuo Kataoka
  • Patent number: 5173369
    Abstract: A tape carrier having a connection function prepared by etching a metal foil to form an conductive pattern comprising outer leads and inner leads on a starting tape carrier and then providing, by plating, the connection portion of at least one group of said outer and inner lead groups with nodules for connecting said at least one group of the leads to a mating conductive pattern via the nodules.
    Type: Grant
    Filed: October 19, 1990
    Date of Patent: December 22, 1992
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventor: Tatsuo Kataoka
  • Patent number: 5118386
    Abstract: A printed circuit board having a plurality of bumps that serve for connection terminals, the bumps being formed by covering the printed circuit except portions where the bumps are to be formed, applying an electroplating onto the uncovered bump-forming portions on the printed circuit maintaining a thickness nearly equal to that of the covering, applying thereon a non-electrolytic plating and electroplating on the whole surface from the surfaces of the bump-forming portions to the surfaces of the covered portions, and removing the platings by etching from the surface except the bump portions.
    Type: Grant
    Filed: December 18, 1989
    Date of Patent: June 2, 1992
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yutaka Iguchi
  • Patent number: 5019944
    Abstract: This invention relates to a mounting substrate onto which components such as an IC chip are to be mounted, its production method, and a printed wiring board having a connector function suitable for a fine pitch and its connection method. Metal nodules are formed on conductors of connection portions by electrodeposition, or the like. Connection is made by fixing connection portions by an adhesive. Good conduction can be secured through the metal nodules and good insulation can be held between adjacent conductors.
    Type: Grant
    Filed: May 25, 1989
    Date of Patent: May 28, 1991
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Masahito Ishii, Tatsuo Kataoka, Yoshitaka Tanaka