Abstract: An element body has an exposed surface including a selective surface material which is to be coated with the coating material and a non-selected surface material which is not to be coated with the coating material. The selected surface material has different material properties than the non-selected surface material. The element body is coated with the coating material by applying a surface modifier only on the surface of the selected surface material and thereafter coating the surface of the selected surface material to which the surface modifier has been applied with the coating material.

Abstract: A method for manufacturing a ceramic electronic component in which a plated electrode can be formed in a region of the surface of a ceramic base body formed of a titanium-containing metal oxide. The method includes preparing a ceramic base body containing a titanium-containing metal oxide, forming a low-resistance section by modifying the metal oxide through irradiation of part of a surface layer portion of the ceramic base body with a pulse laser with a peak power density of 1×106 W/cm2 to 1×109 W/cm2 and a frequency of 500 kHz or less, and forming an electrode on the low-resistance section by electroplating. The laser irradiation generates an O defect in a titanium-containing metal oxide, such as BaTiO3 to form an n-type semiconductor. Since this semiconductor section has a lower resistance value than the metal oxide, plating metal can be selectively deposited by electroplating.

Abstract: A method for manufacturing a ceramic electronic component in which a plated electrode can be formed in a region of the surface of a ceramic base body formed of a titanium-containing metal oxide. The method includes preparing a ceramic base body containing a titanium-containing metal oxide, forming a low-resistance section by modifying the metal oxide through irradiation of part of a surface layer portion of the ceramic base body with a pulse laser with a peak power density of 1×106 W/cm2 to 1×109 W/cm2 and a frequency of 500 kHz or less, and forming an electrode on the low-resistance section by electroplating. The laser irradiation generates an O defect in a titanium-containing metal oxide, such as BaTiO3 to form an n-type semiconductor. Since this semiconductor section has a lower resistance value than the metal oxide, plating metal can be selectively deposited by electroplating.

Abstract: An element body has an exposed surface including a selective surface material which is to be coated with the coating material and a non-selected surface material which is not to be coated with the coating material. The selected surface material has different material properties than the non-selected surface material. The element body is coated with the coating material by applying a surface modifier only on the surface of the selected surface material and thereafter coating the surface of the selected surface material to which the surface modifier has been applied with the coating material.

Abstract: In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

Abstract: In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

Abstract: Provided is a method for producing a ceramic body, which is capable of preventing the ingress of moisture into a void between a conductor and the ceramic body more effectively in the ceramic body including the conductor therein. Ingress of a supercritical fluid containing an oxide sol precursor is achieved into a void between an internal electrode layer and a ceramic laminate. After that, the oxide sol is turned into a gel, and subjected to a heat treatment, thereby filling the void between the internal electrode layer and the ceramic laminate with an oxide.

Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

Abstract: A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 ?m or less when a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 ?m or less, and is about 20 ?m or less when a protruding length of the adjacent internal electrodes from the end surface is at least about 0.1 ?m. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.

Abstract: A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 ?m or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 ?m or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.

Abstract: A monolithic ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes extending between the ceramic layers and also includes external electrodes disposed on the laminate. The internal electrodes are partly exposed at surfaces of the laminate and are electrically connected to each other with the external electrodes. The external electrodes include first plating layers and second plating layers. The first plating layers are in direct contact with the internal electrodes. The second plating layers are located outside the first plating layers and contain glass particles dispersed therein.

Abstract: In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

Abstract: Provided is a method for producing a ceramic body, which is capable of preventing the ingress of moisture into a void between a conductor and the ceramic body more effectively in the ceramic body including the conductor therein. Ingress of a supercritical fluid containing an oxide sol precursor is achieved into a void between an internal electrode layer and a ceramic laminate. After that, the oxide sol is turned into a gel, and subjected to a heat treatment, thereby filling the void between the internal electrode layer and the ceramic laminate with an oxide.

Abstract: Disclosed is a capacitor which has a high capacitance and a low equivalent series resistance. The capacitor includes a conductive base material composed of a plating film having a specific surface area of 100 mm2/mm3 or more, a dielectric film on a surface of the conductive base material, and an opposed conductor formed so as to be opposed to the conductive base material with the dielectric film interposed therebetween. The plating film constituting the conductive base material is formed by electrolytic plating or electroless plating, and may have a porous form, wire-like form or broccoli-like form.

Abstract: A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 ?m or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 ?m or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.

Abstract: A method for manufacturing a ceramic electronic component having excellent solderability is provided. In this method, the elution of barium from the ceramic electronic component and the adhesion of ceramic electronic components in tin plating are reduced. The method for manufacturing a ceramic electronic component includes the steps of providing an electronic component of barium-containing ceramic and forming an electrode on the outer surface of the electronic component, the electrode being electroplated with tin. In this method, a plating bath used in the tin plating has a tin ion concentration A in the range of 0.03 to 0.51 mol/L, a sulfate ion concentration B in the range of 0.005 to 0.31 mol/L, a molar ratio B/A of less than one, and a pH in the range of 6.1 to 10.5.

Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

Abstract: A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.

Abstract: A monolithic ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes extending between the ceramic layers and also includes external electrodes disposed on the laminate. The internal electrodes are partly exposed at surfaces of the laminate and are electrically connected to each other with the external electrodes. The external electrodes include first plating layers and second plating layers. The first plating layers are in direct contact with the internal electrodes. The second plating layers are located outside the first plating layers and contain glass particles dispersed therein.

Abstract: A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 ?m or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.