Abstract: There is provided a wiring harness in which a plurality of cables are bound by a plurality of protectors provided at intervals in a longitudinal direction, the wiring harness arranged along an arranging path of a fixed portion. The cables are collectively held by the protectors. The lengths of the plurality of cables between the protectors are made different such that the cables are bent between the protectors.

Abstract: A power supply structure for a sliding door includes other end-side holding portion which holds the other end of the electric wire. The other end-side holding portion includes first and second turning arms which are rotatably supported directly or indirectly by the sliding door and hold the electric wire at a tip end thereof, and biasing unit which biases the first turning arm in a direction to absorb an extra length of the electric wire. The tip end of the second turning arm inclines with respect to a longitudinal direction of a vehicle at climbing-over timing at which the electric wire climbs over a predetermined climbing-over position of a lower end edge of a door trim which configures the sliding door on an inner side of the vehicle when the sliding door is slid and moved.

Abstract: A power supply structure for a sliding door includes other end-side holding portion which holds the other end of the electric wire. The other end-side holding portion includes first and second turning arms which are rotatably supported directly or indirectly by the sliding door and hold the electric wire at a tip end thereof, and biasing unit which biases the first turning arm in a direction to absorb an extra length of the electric wire. The tip end of the second turning arm inclines with respect to a longitudinal direction of a vehicle at climbing-over timing at which the electric wire climbs over a predetermined climbing-over position of a lower end edge of a door trim which configures the sliding door on an inner side of the vehicle when the sliding door is slid and moved.

Abstract: There is provided a substrate for light-emitting element, including a mounting surface on which a light-emitting element is to be mounted, the mounting surface being one of two opposed main surfaces of the substrate. The substrate of the present invention is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in a body of the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer wherein the light-emitting element is to be mounted such that it is positioned in an overlapping relation with the voltage-dependent resistive layer.

Abstract: There is provided a light-emitting device comprising a light-emitting element and a substrate for light-emitting element. The light-emitting element is in a mounted state on a mounting surface of the substrate, the mounting surface being one of two opposed main surfaces of the substrate. The substrate is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer. The mounted light-emitting element is in an overlapping relation with the voltage-dependent resistive layer. A reflective layer is provided on at least one of the substrate and the voltage-dependent resistive layer such that the reflective layer is located adjacent to the first electrode which is in contact with a substrate exposure surface of the voltage-dependent resistive layer.

Abstract: There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprising a support layer, a semiconductor structure portion formed on the support layer, and a resin film formed on the semiconductor structure portion. The resin film comprises an opening formed by a laser irradiation therein, and also an electroconductive member which is in contact with the surface of the semiconductor structure portion is disposed within the opening of the resin film.

Abstract: There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprising a support layer, a semiconductor structure portion formed on the support layer, and a resin film formed on the semiconductor structure portion. The resin film comprises an opening formed by a laser irradiation therein, and also an electroconductive member which is in contact with the surface of the semiconductor structure portion is disposed within the opening of the resin film.

Abstract: There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprising a support layer, a semiconductor structure portion formed on the support layer, and a resin film formed on the semiconductor structure portion. The resin film comprises an opening formed by a laser irradiation therein, and also an electroconductive member which is in contact with the surface of the semiconductor structure portion is disposed within the opening of the resin film.

Abstract: A method for manufacturing a flexible semiconductor device includes (i) forming an insulating film on the upper surface of metal foil, (ii) forming an extraction electrode pattern on the upper surface of the metal foil, (iii) forming a semiconductor layer on the insulating film such that the semiconductor layer is in contact with the extraction electrode pattern, (iv) forming a sealing resin layer on the upper surface of the metal foil such that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) forming electrodes by etching the metal foil, the metal foil being used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). The metal foil need not be stripped, and a high-temperature process can be used.

Abstract: A method for manufacturing a flexible semiconductor device comprises (i) forming an insulating film on the upper surface of a resin film, (ii) forming a pattern of extraction electrodes on the upper surface of the resin film, (iii) forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the pattern of extraction electrodes, and (iv) forming a sealing resin layer on the upper surface of the resin film in such a manner that the sealing resin layer covers the semiconductor layer and the pattern of extraction electrodes, wherein at least one of the stepsof the above steps (i) to (iv) is carried out by a printing method. With this manufacturing method, various layers can be formed by a simple printing process without using a vacuum process, photolithography, or the like.

Abstract: A wire harness includes a cable and a clamp. The cable has an end portion at which a connection terminal is provided. The connection terminal is electrically connected to a connecting portion. The clamp is attached with the cable so as to be movable with respect to the cable in a direction in which the cable extends. The clamp is fixed to a fixing portion disposed adjacent to the connecting portion in a state that the connection terminal is electrically connected to the connecting portion.

Abstract: There is provided a wiring harness in which a plurality of cables are bound by a plurality of protectors provided at intervals in a longitudinal direction, the wiring harness arranged along an arranging path of a fixed portion. The cables are collectively held by the protectors. The lengths of the plurality of cables between the protectors are made different such that the cables are bent between the protectors.

Abstract: A method for manufacturing a flexible semiconductor device includes (i) forming an insulating film on the upper surface of metal foil, (ii) forming an extraction electrode pattern on the upper surface of the metal foil, (iii) forming a semiconductor layer on the insulating film such that the semiconductor layer is in contact with the extraction electrode pattern, (iv) forming a sealing resin layer on the upper surface of the metal foil such that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) forming electrodes by etching the metal foil, the metal foil being used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). The metal foil need not be stripped, and a high-temperature process can be used.

Abstract: There is provided a substrate for light-emitting element, including a mounting surface on which a light-emitting element is to be mounted, the mounting surface being one of two opposed main surfaces of the substrate. The substrate of the present invention is provided with a protection element for the light-emitting element, the protection element comprising a voltage-dependent resistive layer embedded in a body of the substrate, and comprising a first electrode and a second electrode each of which is in connection with the voltage-dependent resistive layer wherein the light-emitting element is to be mounted such that it is positioned in an overlapping relation with the voltage-dependent resistive layer.

Abstract: There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprising a support layer, a semiconductor structure portion formed on the support layer, and a resin film formed on the semiconductor structure portion. The resin film comprises an opening formed by a laser irradiation therein, and also an electroconductive member which is in contact with the surface of the semiconductor structure portion is disposed within the opening of the resin film.

Abstract: A circuit board 1 having a base material 10 and an electrode 11 formed on at least one main surface of the base material 10 includes an easy peeling portion 12 formed in at least one of an inner portion and a side portion of the electrode 11, with the adhesive strength between the electrode 11 and the easy peeling portion 12 being less than the adhesive strength between the electrode 11 and the base material 10. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.

Abstract: A wire harness includes a cable and a clamp. The cable has an end portion at which a connection terminal is provided. The connection terminal is electrically connected to a connecting portion. The clamp is attached with the cable so as to be movable with respect to the cable in a direction in which the cable extends. The clamp is fixed to a fixing portion disposed adjacent to the connecting portion in a state that the connection terminal is electrically connected to the connecting portion.

Abstract: There is provided a method for manufacturing a flexible semiconductor device characterized by comprising (i) a step of forming an insulating film on the upper surface of metal foil, (ii) a step of forming an extraction electrode pattern on the upper surface of the metal foil, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the extraction electrode pattern, (iv) a step of forming a sealing resin layer on the upper surface of the metal foil in such a manner that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) a step of forming electrodes by etching the metal foil, wherein the metal foil is used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v).

Abstract: There is provided a method for manufacturing a flexible semiconductor device. The manufacturing method is characterized by comprising (i) a step of forming an insulating film on the upper surface of a resin film, (ii) a step of forming a pattern of extraction electrodes on the upper surface of the resin film, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the pattern of extraction electrodes, and (iv) a step of forming a sealing resin layer on the upper surface of the resin film in such a manner that the sealing resin layer covers the semiconductor layer and the pattern of extraction electrodes, wherein at least one forming step among the above (i) to (iv) is carried out by a printing method. In the manufacturing method, various layers can be formed by a simple printing process without using a vacuum process, photolithography, or the like.

Abstract: There are disclosed a clip structure for installing a wire-like member and a tubular member on a mounting member and a wire-like member fixing method. The structure includes a base portion 11, a wire-like member fixing portion 12 which is formed on one side of the base portion 11 so as to fix the wire-like member to the wire-like member fixing portion, and a tubular member fixing portion 13 which is formed on the other side of the base portion 11 so as to fix the tubular member to the tubular member fixing portion. The base portion 11 is mounted on the mounting member in such a manner that the tubular member, fixed to the tubular member fixing portion 13, can be received in a recess formed in the mounting member.