Abstract: An object is to reduce the risk of outflow of defects and improve the work efficiency of assembly work. An assembly system 10 according to an embodiment of the present invention is used to assemble a finished product while sequentially placing and fixing multiple types of components to a workpiece. The assembly system 10 includes a collaborative robot 20 configured to collaborate with a worker 100, an identification information reading unit 27 configured to read identification information indicated on a component placed on the workpiece, and a controller 70 configured to determine whether a type of the component placed on the workpiece is correct or incorrect based on the read identification information and control the collaborative robot in accordance with a result of the correctness determination.

Abstract: An object is to reduce the risk of outflow of defects and improve the work efficiency of assembly work. An assembly system 10 according to an embodiment of the present invention is used to assemble a finished product while sequentially placing and fixing multiple types of components to a workpiece. The assembly system 10 includes a collaborative robot 20 configured to collaborate with a worker 100, an identification information reading unit 27 configured to read identification information indicated on a component placed on the workpiece, and a controller 70 configured to determine whether a type of the component placed on the workpiece is correct or incorrect based on the read identification information and control the collaborative robot in accordance with a result of the correctness determination.

Abstract: A semiconductor signal connector has a contact area provided with a contact part. The contact part is elongated in a transverse direction so that a signal terminal can contact at any location thereof. Further, the semiconductor signal connector has a first contact part to contact a first signal terminal, a second contact part to contact a second signal terminal, and a connecting part formed by a deformable member for connecting the first contact part and the second contact part.

Abstract: Leg portions are provided at the four corners of a resistor that generates a large amount of heat and a partition panel is secured to the top of the leg portions through a heat-insulating spacer. A adiabatic layer is formed by an empty space between the resistor and the partition panel. Further, the transmission of heat from the resistor through the leg portions to the partition panel is suppressed by the heat-insulating spacer. A servo amplifier is connected to the mounting portions provided on the partition panel, at the side opposite the resistor main body. As the transmission of heat generated by the resistor to the servo amplifier main body is cut off by the partition panel and suppressed, components inside the servo amplifier are protected from heat.

Abstract: A semiconductor module is mounted on a printed circuit board so that a heat radiating surface of the module and surfaces of the printed circuit boards are parallel to inner wall surfaces of a unit case. The total thickness of the semiconductor module constituting an inverter essential to a servo amplifier, and the printed circuit boards on which the semiconductor module is mounted is made substantially equal to a distance between the inner walls of the unit case so that the width of the servo amplifier can be minimized. The other components having sizes smaller than the width of the unit case are selected, and an electrolytic capacitor and the like are divided into a plurality of parts so that the divided parts are separately accommodated.

Abstract: A semiconductor signal connector has a contact area provided with a contact part. The contact part is elongated in a transverse direction so that a signal terminal can contact at any location thereof. Further, the semiconductor signal connector has a first contact part to contact a first signal terminal, a second contact part to contact a second signal terminal, and a connecting part formed by a deformable member for connecting the first contact part and the second contact part.

Abstract: A heat sink attached to a heat plate comprising a heat plate (1) produced by sticking two aluminum plates (11, 12) to each other, leaving a closed path (13) therebetween for confining a heat exchange medium therein, and of which the bottom is attached by an object to be cooled, a cooling fin (2) which is stuck to the upper region of the heat plate (1), and a flange (4) for mounting the assembly of the heat plate (1) and the cooling fin 92), wherein the surface of the heat plate (1) on which the cooling fin (2) is to be attached, is even and the cooling fin (2) and the flange (4) are a one-piece structure fabricated by employing die casting.

Abstract: The miniaturization of junction field effect transistors constituting memory cells and higher integration of a dynamic semiconductor memory device are attained. Word lines composed of a p-type impurity diffusion layer are formed on an n-type silicon substrate. An n-type impurity diffusion layer is formed within the p-type impurity diffusion layer. The n-type impurity diffusion layer constitutes two source-drain regions and a channel region, and the p-type impurity diffusion layer constitutes a gate region in each junction field effect transistor. The diffusion layer depth of the channel region is less than that of the source-drain regions. Bit lines are connected to one source-drain region, and storage nodes are connected to the other source-drain region. Each capacitor is made of a storage node, a dielectric film and a cell plate electrode.

Abstract: The invention relates to a motor output changeover control apparatus used for the spindle motor of machine tools. Conventionally, since a constant output over a wide range is realized by gears, a spindle motor is constituted by a single winding. The amount of heat produced by the winding is great, and a speed-change mechanism employing the gears is large in size.With the motor output changeover control apparatus of the invention, output characteristics over a wide range from high to low speeds is stabilized by changing over the connection of the power lines of an AC motor.

Abstract: An amplifier unit for an AC spindle, comprising a casing (10) and an amplifier integrally contained in the casing (10) and electrically interposed between an AC motor for driving the spindle of a machine tool and a power source.

Abstract: A high-frequency noise absorbing circuit in a control circuit of a loading device having a power supply section (I), a converter circuit section (II), a DC link section (III) and an inverter circuit section IV, with capacitors C3 and C4 being connected between ground and respective positive and negative terminals of the DC link section (III) and a smoothing capacitor C1 connected between the positive and negative terminals of the DC link section (III). The high-frequency noise absorbing circuit includes a zero-phase reactor L1 arranged in the power supply section (I). Further, the high-frequency noise absorbing circuit includes a zero-phase reactor L1 arranged in the power supply section (I), and capacitors C5 arranged between the lines of the power supply section (I).

Abstract: This invention concerns a novel compound represented by the general formula (I), a process for producing the novel compound of the formula (I) by reacting the compound of the formula (II) with the compound of the formula (III), as well as an anti-inflammatory and analgesic composition containing the compound of the formula (I): ##STR1## (R represents hydrogen or lower alkyl group).