Patents by Inventor Tatsuya Funaki

Tatsuya Funaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190074347
    Abstract: A wafer level package which includes an IC chip; a rewiring layer on the IC chip; and a capacitor embedded in the rewiring layer.
    Type: Application
    Filed: October 31, 2018
    Publication date: March 7, 2019
    Inventors: Tatsuya Funaki, Noriyuki Inoue
  • Publication number: 20180371291
    Abstract: An object of the present invention is to provide a coating composition that is capable of providing a cured film excellent in adhesion to a base material and flexural fatigue resistance. Another object of the present invention is to provide a cured film obtained from the coating composition, and a laminate and a tire each having the cured film formed thereon. The coating composition of the present invention contains a polythiol compound (A), a polyurethane having an ethylenically unsaturated group (B), and a radical generator (C).
    Type: Application
    Filed: December 15, 2016
    Publication date: December 27, 2018
    Applicant: BRIDGESTONE CORPORATION
    Inventors: Tomohiro URATA, Shinichi MUSHA, Kotaro HAYAKAWA, Tatsuya FUNAKI, Akihide OOSAKU
  • Publication number: 20180132356
    Abstract: A method for manufacturing a capacitor built-in substrate includes: preparing a capacitor built-in core insulating film and laminating a respective buildup layer to each of opposed main surfaces of the capacitor built-in core insulating film. The capacitor built-in core insulating film includes a first and second metal layers, an insulating layer and a capacitor. The first and second metal layers are disposed so as to face each other with the insulating layer interposed therebetween. The capacitor is disposed so as to extend through the insulating layer with one capacitor electrode being electrically connected to the first metal layer and the other capacitor electrode being electrically connected to the second metal layer.
    Type: Application
    Filed: December 19, 2017
    Publication date: May 10, 2018
    Inventors: TATSUYA FUNAKI, Noriyuki Inoue
  • Patent number: 9480460
    Abstract: An ultrasonic diagnostic apparatus includes an memory, an determination unit, an instruction unit, a specifying unit, and an redetermination unit. The memory stores upper limit values of parameters for restricting the powers in display modes. The determination unit determines the powers in the modes so as not to exceed upper limit values of the parameters. The instruction unit inputs an instruction to increase/decrease the power of a specific mode. The specifying unit specifies the parameter value in the specific mode. The redetermination unit determines an upper limit value of the parameter in a mode different from the specific mode based on the upper limit value of the parameter in the specific mode and the parameter value specified by the specifying unit.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: November 1, 2016
    Assignee: TOSHIBA MEDICAL SYSTEMS CORPORATION
    Inventors: Yoshihito Abe, Shigeru Akiyama, Tatsuya Funaki
  • Publication number: 20160152873
    Abstract: The present invention provides a sheet for forming a laminate, mainly composed of EVA, wherein the sheet allows a sufficient removal of air bubbles in a laminate to be performed by a step of pressurizing the laminate by using nip rolls, and allows a satisfactory laminate to be produced, and provides a method for producing the laminate.
    Type: Application
    Filed: June 27, 2014
    Publication date: June 2, 2016
    Applicant: BRIDGESTONE CORPORATION
    Inventors: Kazuhiro OMURA, Masakuni WATANABE, Masao HASHIMOTO, Yuji SUZUKI, Tatsuya FUNAKI
  • Publication number: 20120312098
    Abstract: An ultrasonic diagnostic apparatus includes an memory, an determination unit, an instruction unit, a specifying unit, and an redetermination unit. The memory stores upper limit values of parameters for restricting the powers in display modes. The determination unit determines the powers in the modes so as not to exceed upper limit values of the parameters. The instruction unit inputs an instruction to increase/decrease the power of a specific mode. The specifying unit specifies the parameter value in the specific mode. The redetermination unit determines an upper limit value of the parameter in a mode different from the specific mode based on the upper limit value of the parameter in the specific mode and the parameter value specified by the specifying unit.
    Type: Application
    Filed: August 22, 2012
    Publication date: December 13, 2012
    Applicants: TOSHIBA MEDICAL SYSTEMS CORPORATION, KABUSHIKI KAISHA TOSHIBA
    Inventors: Yoshihito Abe, Shigeru Akiyama, Tatsuya Funaki
  • Patent number: 8026506
    Abstract: In a thin-film transistor comprising respective elements of: three electrodes of a source electrode, a drain electrode and a gate electrode; a channel layer; and a gate insulating film, at least the channel layer is formed by a metal oxide film including indium. Therefore, it is possible to obtain the thin-film transistor, which can manufacture an element to a polymer substrate without using a high temperature process and which can achieve a high performance and a high reliability at low cost.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: September 27, 2011
    Assignee: Bridgestone Corporation
    Inventors: Osamu Shiino, Yoshinori Iwabuchi, Ryo Sakurai, Tatsuya Funaki
  • Patent number: 7960834
    Abstract: An electronic element including an electronic element base and electrodes each of which has a first electrode having a surface composed of at least Al or an Al alloy and a second electrode composed of a metal nanoparticle sintered body and bonded to the first electrode. A bonding interface between the first electrode and the second electrode has a multilayer structure including, from the side of the first electrode to the side of the second electrode, (a) a first layer primarily composed of Al, (b) a second layer primarily composed of an Al oxide, (c) a third layer primarily composed of an alloy of Al and a constituent element of metal nanoparticles, and (d) a fourth layer primarily composed of the constituent element of the metal nanoparticles.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: June 14, 2011
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tatsuya Funaki
  • Patent number: 7931518
    Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method. A process for the preparation of a light transmissive electromagnetic wave shielding material comprising; (A1) printing a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and (A2) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer 13 on the pretreatment layer 12.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: April 26, 2011
    Assignee: Bridgestone Corporation
    Inventors: Hidefumi Kotsubo, Tatsuya Funaki, Kiyomi Sasaki
  • Publication number: 20100126767
    Abstract: The present invention provides a process for efficiently preparing a light transmissive electromagnetic wave shielding material enhanced in light transmissive property, electromagnetic wave shielding property, appearance and legibility, and having high-accuracy mesh-pattern. The process for the preparation of a light transmissive electromagnetic wave shielding material comprising; printing in the form of mesh a pretreatment agent for electroless plating on a transparent substrate to form a mesh-shaped pretreatment layer, the pretreatment agent comprising a fine particle having an extremely-thin film of noble metal on its surface, and subjecting the mesh-shaped pretreatment layer to electroless plating to form a mesh-shaped metal conductive layer on the pretreatment layer.
    Type: Application
    Filed: March 5, 2008
    Publication date: May 27, 2010
    Applicant: Bridgestone Corporation
    Inventors: Hidefumi Kotsubo, Tatsuya Funaki, Kiyomi Sasaki, Kentaro Hanzawa
  • Publication number: 20100025680
    Abstract: In a thin-film transistor comprising respective elements of: three electrodes of a source electrode, a drain electrode and a gate electrode; a channel layer; and a gate insulating film, at least the channel layer is formed by a metal oxide film including indium. Therefore, it is possible to obtain the thin-film transistor, which can manufacture an element to a polymer substrate without using a high temperature process and which can achieve a high performance and a high reliability at low cost.
    Type: Application
    Filed: January 30, 2008
    Publication date: February 4, 2010
    Applicant: BRIDGESTONE CORPORATION
    Inventors: Osamu Shino, Yoshinori Iwabuchi, Ryo Sakurai, Tatsuya Funaki
  • Publication number: 20100003474
    Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method. A process for the preparation of a light transmissive electromagnetic wave shielding material comprising; (A1) printing a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and (A2) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer 13 on the pretreatment layer 12.
    Type: Application
    Filed: August 3, 2007
    Publication date: January 7, 2010
    Applicant: Bridgestone Corporation
    Inventors: Hidefumi Kotsubo, Tatsuya Funaki, Kiyomi Sasaki
  • Patent number: 7611746
    Abstract: A method for producing an electromagnetic-wave-shielding light-transmitting window member comprising a transparent substrate and a conductive pattern formed by electroless plating on a surface of the transparent substrate. In the method, an ultraviolet-curable resin paste containing an electroless plating catalyst is applied to a surface of a transparent substrate, and the resulting printed pattern is cured by irradiation of ultraviolet light to form a resin pattern. Subsequently, a plating layer is deposited on the resin pattern by electroless plating treatment to form a conductive pattern. The ultraviolet-curable resin paste is selected from a group of sublimable resists and phthalocyanine-based sublimable materials and contains a volatile substance that is volatized by heating or irradiation. By using the ultraviolet-curable resin paste, a good conductive pattern having excellent adhesion to the transparent substrate can be formed with high accuracy, efficiently, and at low cost.
    Type: Grant
    Filed: May 11, 2006
    Date of Patent: November 3, 2009
    Assignee: Bridgestone Corporation
    Inventors: Tatsuya Funaki, Hidefumi Kotsubo, Kiyomi Sasaki
  • Publication number: 20090214839
    Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method. A process for the preparation of a light transmissive electromagnetic wave shielding material comprising; (A1) printing a pretreatment agent for electroless plating comprising a composite metal oxide and/or a composite metal oxide hydrate and a synthetic resin in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and (A3) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer on the pretreatment layer 13.
    Type: Application
    Filed: August 31, 2007
    Publication date: August 27, 2009
    Applicant: Bridgestone Corporation
    Inventors: Hidefumi Kotsubo, Tatsuya Funaki, Kiyomi Sasaki
  • Publication number: 20090133923
    Abstract: The present invention provides a process for preparing the light transmissive electromagnetic wave shielding material having an enhanced productivity. A process for preparing a light transmissive electromagnetic shielding material comprising; coating a transparent substrate with a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof to form a coated layer and drying the coated layer to provide a pretreatment layer on the transparent substrate, forming a plating protective layer in the dot pattern on the pretreatment layer, and subjecting the exposing part of the pretreatment layer having no plating protective layer to electroless plating to form a metal conductive layer in the mesh pattern.
    Type: Application
    Filed: March 8, 2007
    Publication date: May 28, 2009
    Inventors: Hidefumi Kotsubo, Tatsuya Funaki, Kiyomi Sasaki
  • Publication number: 20090039507
    Abstract: An electronic element including an electronic element base and electrodes each of which has a first electrode having a surface composed of at least Al or an Al alloy and a second electrode composed of a metal nanoparticle sintered body and bonded to the first electrode. A bonding interface between the first electrode and the second electrode has a multilayer structure including, from the side of the first electrode to the side of the second electrode, (a) a first layer primarily composed of Al, (b) a second layer primarily composed of an Al oxide, (c) a third layer primarily composed of an alloy of Al and a constituent element of metal nanoparticles, and (d) a fourth layer primarily composed of the constituent element of the metal nanoparticles.
    Type: Application
    Filed: October 23, 2008
    Publication date: February 12, 2009
    Inventor: Tatsuya Funaki
  • Publication number: 20070036888
    Abstract: An ultraviolet-curable resin paste containing an electroless plating catalyst is applied by printing to a surface of a transparent substrate 1, and the resulting printed pattern 2 is cured by irradiation of ultraviolet light to form a resin pattern 3. Subsequently, a plating layer 4 is deposited on the resin pattern 3 by electroless plating treatment to form a conductive pattern 5. The resin pattern 3 to be subjected to the electroless plating treatment has an uncured layer 3A provided on a surface thereof. During the electroless plating treatment, the uncured layer 3A is eroded in the plating bath and particles of the catalyst are exposed. It is possible to form a satisfactory plating layer 4 using the exposed catalyst particles as nuclei. By using the ultraviolet-curable resin paste, a good conductive pattern having excellent adhesion to the transparent substrate can be formed with high accuracy, efficiently, and at low cost.
    Type: Application
    Filed: May 11, 2006
    Publication date: February 15, 2007
    Inventors: Tatsuya Funaki, Hidefumi Kotsubo, Kiyomi Sasaki
  • Patent number: 6768062
    Abstract: A connection method and a connection structure, using solder bumps, for component-side pad electrodes and substrate-side pad electrodes, and inspecting methods for the connection state thereof which are adaptable to high density mounting, and which allow the miniaturization of the product formed by mounting a surface-mount component onto a substrate. Substrate-side pad electrodes are arranged inside a component-corresponding region A; the length of the substrate-side pad electrodes is set to be larger than that of the corresponding component-side pad electrode; an IC chip (surface-mount component) is placed on the substrate so that each of the solder bumps is opposed to a predetermined substrate-side pad electrode; and the solder bumps are melted by heating, thereby connecting each of the component-side pad electrodes and one of the substrate-side pad electrodes through the solder.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: July 27, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Ryoichi Morimoto, Jitsuho Hirota, Tatsuya Funaki
  • Publication number: 20020043396
    Abstract: A connection method and a connection structure, using solder bumps, for component-side pad electrodes and substrate-side pad electrodes, and inspecting methods for the connection state thereof which are adaptable to high density mounting, and which allow the miniaturization of the product formed by mounting a surface-mount component onto a substrate. Substrate-side pad electrodes are arranged inside a component-corresponding region A; the length of the substrate-side pad electrodes is set to be larger than that of the corresponding component-side pad electrode; an IC chip (surface-mount component) is placed on the substrate so that each of the solder bumps is opposed to a predetermined substrate-side pad electrode; and the solder bumps are melted by heating, thereby connecting each of the component-side pad electrodes and one of the substrate-side pad electrodes through the solder.
    Type: Application
    Filed: October 11, 2001
    Publication date: April 18, 2002
    Inventors: Ryoichi Morimoto, Jitsuho Hirota, Tatsuya Funaki